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SC68376BACAB20

NXP Semiconductors

SC68376BACAB20 by NXP Semiconductors

NXP SC68376BACAB20 is a 32-bit microcontroller with 160 terminals in a square package. It features ADC channels, MROM ROM programmability, and CMOS technology. Ideal for applications requiring a flatpack style microcontroller with gull wing terminal form and 0.65 mm pitch.

Median Price

$55.190

Lifecycle Status

Suppliers In-Stock

8

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Arrow

USA . 94 parts In-Stock

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Verical

USA . 94 parts In-Stock

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EBV Elektronik

Germany . 48 parts In-Stock

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Digiode

USA . 2,777 parts In-Stock

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Vyrian

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Anansix

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TME

Poland . 48 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 1,196 parts In-Stock

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Ampacity Inc.

Singapore . 17 parts In-Stock

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Corphita

USA . 4,824 parts In-Stock

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Corohmni

South Africa . 156 parts In-Stock

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Microchip USA

USA . 2,399 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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UNI Independent Distributors

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Robosynatics

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Lucentia Tech

USA . 1,598 parts In-Stock

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Aranea Global

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Overview

Unleash the power of cutting-edge technology with the SC68376BACAB20 by NXP Semiconductors. This high-quality microcontroller offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From automotive to industrial automation, this versatile device delivers exceptional value and benefits, ensuring seamless operation and optimal efficiency. Trust NXP Semiconductors to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Easier and more efficient installation process, saving time and effort.

Bit Size: 32

High bit size allows for complex calculations and processing capabilities.

No. of Terminals: 160

Sufficient number of terminals for connectivity with other components and peripherals.

Package Style (Meter): FLATPACK

Flatpack design saves space and allows for compact and efficient circuit layout.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, ensuring optimal performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, leading to energy efficiency.

ROM Programmability: MROM

MROM allows for non-volatile memory storage, ensuring program data retention even when power is turned off.

Technical Specifications

Microcontrollers SC68376BACAB20 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G160

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

160

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

ROM Programmability:

MROM

Maximum Seated Height:

3.85 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

SC68376BACAB20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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