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SC68376BGMAB20

NXP Semiconductors

SC68376BGMAB20 by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;

Median Price

$75.338

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 20 parts In-Stock

1+ parts

$82.420

100+ parts

$68.120

1k+ parts

$64.820

10k+ parts

-

20

$82.420

$68.120

$64.820

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Verical

USA . 9,960 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$68.257

10k+ parts

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9,960

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-

$68.257

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,463 parts In-Stock

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6,463

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Digiode

USA . 2,685 parts In-Stock

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2,685

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Anansix

USA . 291 parts In-Stock

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291

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Nova Conductors

Japan . 200 parts In-Stock

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200

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NexGen Digital

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 372 parts In-Stock

1+ parts

$14.000

100+ parts

-

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372

$14.000

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Advanced Electronics

New Zealand . 49 parts In-Stock

1+ parts

$19.288

100+ parts

$17.552

1k+ parts

$15.816

10k+ parts

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49

$19.288

$17.552

$15.816

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Corohmni

South Africa . 153 parts In-Stock

1+ parts

$50.938

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153

$50.938

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Microchip USA

USA . 1,587 parts In-Stock

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$146.858

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1,587

$146.858

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UNI Independent Distributors

Spain . 4,532 parts In-Stock

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Argo Parts USA

USA . 3,664 parts In-Stock

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3,664

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Corphita

USA . 2,597 parts In-Stock

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2,597

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Continental Prestige Electronics

USA . 1,777 parts In-Stock

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1,777

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Perfect Parts

USA . 753 parts In-Stock

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753

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Netroflash

USA . 50 parts In-Stock

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50

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Technical Specifications

Microcontrollers SC68376BGMAB20 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20.97 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G160

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

160

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

ROM Programmability:

FLASH

Maximum Seated Height:

3.85 mm

Speed:

20.97 rpm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

SC68376BGMAB20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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