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SPC5777CCK3MME3

NXP Semiconductors

SPC5777CCK3MME3 by NXP Semiconductors

NXP Semiconductors' SPC5777CCK3MME3 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 524288 RAM bytes. Ideal for automotive applications with CAN, SCI, SPI connectivity and low power mode support. This CMOS technology-based chip offers high performance in a compact square package.

Median Price

$69.090

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 193 parts In-Stock

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$53.920

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$53.920

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Farnell

UK . 193 parts In-Stock

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$59.500

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$41.810

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$41.810

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Mouser Electronics

USA . 70 parts In-Stock

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$78.680

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$52.840

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70

$78.680

$52.840

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Element14

Singapore . 200 parts In-Stock

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$87.950

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$64.890

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200

$87.950

$64.890

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Distributors (In-Stock)

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Digiode

USA . 2,790 parts In-Stock

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$31.226

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$31.226

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Nova Conductors

Japan . 300 parts In-Stock

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$45.610

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Vyrian

USA . 8,141 parts In-Stock

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Anansix

USA . 950 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 324 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 826 parts In-Stock

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$17.169

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Ampacity Inc.

Singapore . 199 parts In-Stock

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$27.940

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Semicontronic

India . 198 parts In-Stock

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$27.940

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$27.242

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$27.102

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$27.102

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Corphita

USA . 399 parts In-Stock

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$29.583

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Corohmni

South Africa . 515 parts In-Stock

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$43.438

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Netroflash

USA . 500 parts In-Stock

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$45.610

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$45.610

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Continental Prestige Electronics

USA . 200 parts In-Stock

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$53.570

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Vigor

Singapore . 4,269 parts In-Stock

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$71.640

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Microchip USA

USA . 2,198 parts In-Stock

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Lixinc

USA . 19,958 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 6,727 parts In-Stock

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Argo Parts USA

USA . 3,634 parts In-Stock

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Overview

Unleash the power of innovation with the SPC5777CCK3MME3 by NXP Semiconductors. This high-quality microcontroller offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. Whether you're designing automotive systems or industrial machinery, this product delivers exceptional value with its advanced features and cutting-edge technology. Trust NXP Semiconductors to provide you with the best-in-class solutions for your next project. Elevate your designs and exceed customer expectations with the SPC5777CCK3MME3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the microcontroller suitable for various environments and applications.

Integrated Cache: YES

The integrated cache helps in improving the performance of the microcontroller by reducing memory latency and increasing access speed.

Maximum Supply Voltage: 1.32 V

Having a higher maximum supply voltage allows for flexibility in power requirements while ensuring efficient operation.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data processing and storage, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape ensures uniformity in size and easy integration into circuit designs.

Bit Size: 32

With a 32-bit size, the microcontroller can process data and perform operations with higher precision and efficiency.

No. of Terminals: 416

Having a large number of terminals provides ample connectivity options for external devices and components, making the microcontroller versatile.

Minimum Supply Voltage: 1.2 V

The lower minimum supply voltage ensures energy efficiency and helps in reducing power consumption during operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the microcontroller to function reliably in extreme heat conditions.

CPU Family: E200Z7

Being part of the E200Z7 CPU family indicates a reliable and trusted processor architecture, ensuring stable performance.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its compatibility with a wide range of devices.

DMA Channels: YES

Having DMA channels helps in offloading data transfer tasks from the CPU, improving overall system efficiency and performance.

ROM Words: 8388608

With a large ROM capacity, the microcontroller can store a significant amount of program data and instructions, enhancing its versatility.

Maximum Clock Frequency: 40 MHz

Operational at a high clock frequency of 40 MHz, the microcontroller can execute instructions and process data quickly, ensuring swift and efficient operation.

Technical Specifications

Microcontrollers SPC5777CCK3MME3 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z7

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e2

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of External Interrupts:

1

No. of Serial I/Os:

5

No. of Terminals:

416

No. of Timers:

0

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA416,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Current:

1350 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), SCI(5), SPI(5)

Peripherals:

POR

Trade Compliance

SPC5777CCK3MME3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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