Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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SST26VF016B-80E/SM
Microchip Technology
SST26VF016B-80E/SM by Microchip: 16Mx1 NOR Flash Memory with 80MHz clock, SPI serial bus for automotive applications. Features 100K write/erase cycles, operates at -40 to 125°C, and has a small outline package style.
80 MHz
100
100000 Write/Erase Cycles
R-PDSO-G8
5.26 mm
16777216 bit
FLASH
1
8
16777216 words
16M
SYNCHRONOUS
125 Cel
-40 Cel
16MX1
3-STATE
PLASTIC/EPOXY
SOP
SOP8,.3
RECTANGULAR
SMALL OUTLINE
SERIAL
2.5
AEC-Q100
2.03 mm
SPI
.000025 Amp
25 mA
3.6 V
2.3 V
YES
CMOS
AUTOMOTIVE
GULL WING
1.27 mm
DUAL
NOR TYPE
5.25 mm
HARDWARE/SOFTWARE
SST25PF040C-40E/SN
SST25PF040C-40E/SN by Microchip: 3.3V NOR Flash Memory with 4Mx1 organization, SPI interface, and 40MHz clock frequency. Ideal for automotive applications due to TS16949 screening level and -40°C to 125°C operating temperature range. Compact size (4.9mm x 3.9mm) with low standby current (0.00001A).
40 MHz
20
4.9 mm
4194304 bit
4194304 words
4M
4MX1
SOP8,.23
3.3
TS 16949
1.75 mm
.00001 Amp
15 mA
3.9 mm
SOFTWARE
MTSD256AHC6MS-1WT
Micron Technology
FLASH CARD; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Package Body Material: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
R-XUUC-N
2199023255552 bit
FLASH CARD
274877906944 words
256G
85 Cel
-25 Cel
256GX8
UNSPECIFIED
DIE
UNCASED CHIP
NO LEAD
UPPER
MTSD064AHC6MS-1WT
Micron Technology's MTSD064AHC6MS-1WT is a 64GX8 NOR type flash memory chip with 549755813888-bit density. Operating synchronously at -25 to 85 °C, it offers 68719476736 words capacity for various applications requiring high-speed serial memory solutions.
549755813888 bit
68719476736 words
64G
64GX8
MTSD032AHC6MS-1WT
MTSD032AHC6MS-1WT by Micron Technology is a 32GX8 NOR flash memory chip with 274877906944-bit density. Operating in synchronous mode, it has a memory width of 8 and operates serially. Ideal for applications requiring high-speed data storage and retrieval at temperatures ranging from -25°C to 85°C.
274877906944 bit
34359738368 words
32G
32GX8
MTSD128AHC6MS-1WT
FLASH CARD; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Terminal Position: UPPER; Technology: CMOS;
1099511627776 bit
137438953472 words
128G
128GX8
W25Q512JVFIQ
Winbond Electronics
W25Q512JVFIQ by Winbond Electronics is a 64MX8 NOR type flash memory with 133 MHz clock frequency, ideal for industrial applications. It operates at 3.3V, has 100000 write/erase cycles endurance, and uses SPI serial bus type. With a compact size of 10.31mm x 7.49mm x 2.64mm, it offers high performance in a small outline package for various electronic devices.
ALSO OPERATES AT 2.7VMIN @104MHZ
4
133 MHz
R-PDSO-G16
10.31 mm
536870912 bit
16
67108864 words
64M
64MX8
SOP16,.4
2.64 mm
.00006 Amp
40 mA
3 V
INDUSTRIAL
7.49 mm
W25Q64JWZPIM
W25Q64JWZPIM by Winbond Electronics is a NOR flash memory with 8MX8 organization, SPI serial bus type, and 133 MHz clock frequency. It is ideal for industrial applications requiring high endurance with 100K write/erase cycles and operates at temperatures ranging from -40 to 85 °C.
R-PDSO-N8
6 mm
67108864 bit
8388608 words
8M
8MX8
HVSON
SOLCC8,.25
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
NOT SPECIFIED
1.8
.8 mm
20 mA
1.95 V
1.7 V
5 mm
MX25U12832FZ4I02
Macronix
Macronix MX25U12832FZ4I02 is a NOR flash memory with 16MX8 organization, SPI serial bus type, and 133 MHz clock frequency. It is ideal for applications requiring high endurance, such as IoT devices and industrial automation systems.
R-XDSO-N8
8 mm
134217728 bit
16MX8
SOLCC8,.3
.000005 Amp
2 V
1.65 V
GD25Q32CTIG
Gigadevice Semiconductor
GD25Q32CTIG by Gigadevice Semiconductor is a 32Mbit NOR Flash Memory with SPI interface. Operating at 120MHz, it offers 100K Write/Erase cycles and supports hardware/software write protection. Ideal for industrial applications, it has a temperature range of -40 to 85°C and low standby current of 0.000005Amp.
BOTTOM/TOP
120 MHz
33554432 bit
33554432 words
32M
32MX1
2.7
2.7 V
GD25Q32CSIG
GD25Q32CSIG by Gigadevice Semiconductor is a 32M NOR Flash Memory with SPI serial bus, 120MHz clock frequency, and 100000 write/erase cycles. Ideal for industrial applications requiring high-speed synchronous operation and reliable data storage in a compact small outline package.
5.28 mm
2.16 mm
5.23 mm
MX25U51245GBFI0A
Macronix MX25U51245GBFI0A is a 64MX8 NOR flash memory with 166 MHz clock frequency, 1.8V programming voltage, and SPI serial bus type. Ideal for applications requiring high-speed synchronous operation, such as automotive electronics and industrial control systems.
166 MHz
R-PBGA-B68
68
VFBGA
BGA56,8X10,20
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.44 mm
.00005 Amp
BALL
.4 mm
BOTTOM
MTFC128GAPALBH-AAT
MTFC128GAPALBH-AAT by Micron Technology is a 128GX8 NAND flash memory with 1099511627776 bit density. Operating in synchronous mode, it has a terminal pitch of 0.5 mm and supports parallel communication. This thin profile package is ideal for applications requiring high-speed data storage and retrieval at temperatures ranging from -40 to 105 °C.
R-PBGA-B153
13 mm
153
105 Cel
TFBGA
BGA153,14X14,20
GRID ARRAY, THIN PROFILE, FINE PITCH
PARALLEL
1.1 mm
.5 mm
NAND TYPE
11.5 mm
MTFC16GAPALGT-AIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 16GX8;
200 MHz
5
137438953472 bit
17179869184 words
16G
16GX8
BGA
MTFC8GAKAJCN-4MITTR
Micron Technology's MTFC8GAKAJCN-4MITTR is a 8GX8 MLC NAND flash memory with 68719476736 bit density. It operates in synchronous mode at up to 52 MHz clock frequency, suitable for industrial applications. The package style is grid array with very thin profile and fine pitch, making it ideal for compact electronic devices.
52 MHz
NO
e1
68719476736 bit
8589934592 words
8G
8GX8
260
1 mm
TIN SILVER COPPER
30
MLC NAND TYPE
MTFC16GAPALHT-AIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
R-PBGA-B100
18 mm
BGA100,10X17,40
GRID ARRAY, VERY THIN PROFILE
14 mm
THGBMJG8C2LBAIL
Kioxia Holdings
Kioxia Holdings' THGBMJG8C2LBAIL is a Flash Memory with 32GX8 organization, 274877906944 bit memory density, and CMOS technology. It features a package style of GRID ARRAY, operates b/w -25 to 85 °C, and has a terminal pitch of 0.5 mm. Ideal for applications requiring high-speed data storage in compact devices.
GRID ARRAY
OTHER
11 mm
THGBMJG8C4LBAU8
Kioxia Holdings THGBMJG8C4LBAU8 is a 32GX8 flash memory with 274877906944 bit density. It operates b/w -40 to 105 °C, suitable for industrial applications. With a terminal pitch of 0.5 mm and package style GRID ARRAY, it offers high-speed data storage in compact devices.
SQF-SHMU2-128G-SBE
Advantech
Advantech SQF-SHMU2-128G-SBE is a 128GX8 MLC NAND flash module with 30000 Write/Erase Cycles endurance. Operating at -40 to 85 °C, it uses SERIAL mode with 3.3V programming voltage. Ideal for applications requiring high memory density and reliability in MICROELECTRONIC ASSEMBLY package style.
10
30000 Write/Erase Cycles
R-XDMA-N52
FLASH MODULE
ASYNCHRONOUS
DMA
MICROELECTRONIC ASSEMBLY
FEMC016GTTG7-T13-27
Flexxon Global
FEMC016GTTG7-T13-27 by Flexxon Global is a SLC NAND flash memory with 16GX8 organization and 137.4Gb density. It operates in industrial temperature range (-40 to 85°C) and has AEC-Q100 screening level for automotive applications. The package is rectangular, surface mountable, with 100 terminals at a nominal voltage of 3.3V.
AEC-Q100; TS 16949
SLC NAND TYPE
FEMC032GTTE7-T13-26
FEMC032GTTE7-T13-26 by Flexxon Global is a 32GX8 MLC NAND flash memory with 274877906944-bit density. Operating at -25 to 85 °C, it has AEC-Q100 screening for automotive applications. With 3.3V supply and 100 terminals in a rectangular package, it's ideal for high-density data storage needs.
FEMC064GTTE7-T14-46
FEMC064GTTE7-T14-46 by Flexxon Global is a Flash Memory with 64GX8 organization, MLC NAND type, and 549755813888 bit memory density. It operates b/w -25 to 85 °C, suitable for automotive applications meeting AEC-Q100 standards. With 153 terminals and CMOS technology, it offers high performance in a compact rectangular package.
FEMC004GTTG7-T13-17
FEMC004GTTG7-T13-17 by Flexxon Global is a SLC NAND flash memory with 4GX8 organization and 4G word code. It operates at industrial temperature grade (-40 to 85 °C) and has a memory density of 34.36Gb. It is suitable for applications requiring high reliability and endurance, such as automotive electronics or industrial control systems.
34359738368 bit
4294967296 words
4G
4GX8
FEMC008GTTE7-T13-17
FEMC008GTTE7-T13-17 by Flexxon Global is an SLC NAND flash memory with 8GX8 organization, 3.3V supply voltage, and 85°C max operating temp. Ideal for automotive applications due to AEC-Q100 screening level and TS 16949 certification, offering high reliability in harsh environments.
FEMC016GTTG7-T13-16
FEMC016GTTG7-T13-16 by Flexxon Global is a 16GX8 MLC NAND flash card with 137.4Tb memory density, suitable for industrial applications. It operates at -40 to 85°C, has 100 terminals in a rectangular package, and meets AEC-Q100 standards.
FEMC004GTTG7-T13-16
FEMC004GTTG7-T13-16 by Flexxon Global is a 3.3V MLC NAND Flash Memory with 4GX8 organization, 100 terminals, and 34359738368 bit memory density. It operates in industrial temperature range (-40 to 85 °C) and is suitable for applications requiring high-density storage in automotive electronics or industrial devices.
FEMC008GTTG7-T13-17
FEMC008GTTG7-T13-17 by Flexxon Global is an 8GX8 SLC NAND flash memory with 68719476736-bit density. Operating at -40 to 85 °C, it's AEC-Q100 and TS 16949 compliant for industrial use. With a rectangular package and PLASTIC/EPOXY material, it has 100 terminals for surface mount applications.
FEMC016GTTE7-T13-27
FEMC016GTTE7-T13-27 by Flexxon Global is a SLC NAND flash memory with 16GX8 organization and 137.4Gb density. It operates at -25 to 85°C, has 100 terminals, and uses CMOS technology. Ideal for automotive applications due to AEC-Q100 screening level and TS16949 certification.
FEMC016GTTE7-T14-16
FEMC016GTTE7-T14-16 by Flexxon Global is a 16GX8 MLC NAND flash memory card with 137.4Tb density and 3.3V supply voltage. Ideal for automotive applications due to AEC-Q100 screening, TS 16949 compliance, and operating temperature range of -25°C to 85°C.
FEMC002GTTE7-T14-17
FEMC002GTTE7-T14-17 by Flexxon Global is a SLC NAND flash memory with 2GX8 organization, 17179869184 bit memory density, and 3.3V nominal voltage. Ideal for automotive applications due to AEC-Q100 screening level and TS 16949 certification, operating b/w -25°C to 85°C temperature range.
17179869184 bit
2147483648 words
2G
2GX8
FEMC002GTTG7-T24-17
FEMC002GTTG7-T24-17 by Flexxon Global is a SLC NAND flash memory with 2GX8 organization, 17179869184 bit memory density, and operates at industrial temperature grade. It has 153 terminals, package shape is rectangular made of plastic/epoxy material. Ideal for automotive applications due to AEC-Q100 screening level and TS 16949 certification.
FEMC008GTTA7-T13-16
FEMC008GTTA7-T13-16 by Flexxon Global is an 8GX8 MLC NAND flash memory card with 68719476736 bit density. Operating at -40 to 85 °C, it has a supply voltage of 3.3V and meets AEC-Q100 standards. Ideal for industrial applications requiring high-density memory in a compact rectangular package.
FEMC008GTTG7-T13-16
FEMC008GTTG7-T13-16 by Flexxon Global is an 8GX8 MLC NAND flash memory card with 68719476736-bit density. It operates at industrial temperature grade (-40 to 85 °C) and has a supply voltage of 3.3V. Suitable for automotive applications due to AEC-Q100 screening level and TS16949 certification.
FEMC004GTTE7-T13-17
FEMC004GTTE7-T13-17 by Flexxon Global is a SLC NAND flash memory with 4GX8 organization, 3.3V supply voltage, and 100 terminals. It operates b/w -25°C to 85°C, suitable for automotive applications meeting AEC-Q100 standards. With a memory density of 34.36 Gb, it's ideal for high-performance storage solutions in harsh environments.
FEMC004GTTE7-T14-16
FEMC004GTTE7-T14-16 by Flexxon Global is a Flash Memory with 4GX8 organization, MLC NAND type, and 3.3V nominal voltage. It is suitable for applications requiring high memory density and operates in a wide temperature range (-25 to 85 °C).
FEMC004GTTG7-T24-16
FEMC004GTTG7-T24-16 by Flexxon Global is a 3.3V MLC NAND flash memory with 4GX8 organization, 34359738368-bit density, and AEC-Q100 screening. Ideal for industrial applications requiring reliable data storage in temperatures ranging from -40 to 85°C. This rectangular package with 153 terminals is designed for surface mount assembly.
FEMC008GTTE7-T13-16
Flexxon Global's FEMC008GTTE7-T13-16 Flash Memory features 8GX8 organization, MLC NAND technology, and 3.3V nominal voltage. Ideal for automotive applications with AEC-Q100 screening level, TS 16949 certification, and operating temperatures ranging from -25 to 85°C.
FEMC016GTTA7-T13-16
FEMC016GTTA7-T13-16 by Flexxon Global is a 16GX8 MLC NAND flash card with 137.4Tb memory density, operating at -40 to 85°C. Suitable for industrial applications, it features AEC-Q100 screening and TS 16949 certification, with a supply voltage of 3.3V and 100 terminals in a rectangular package.
FEMC016GTTE7-T13-16
FEMC016GTTE7-T13-16 by Flexxon Global is a flash memory with 16GX8 organization and MLC NAND type technology. It has a memory density of 137438953472 bits and operates at temperatures ranging from -25 to 85°C. This memory card is suitable for applications requiring high storage capacity and reliable performance.
GD25Q16CEIGR
GD25Q16CEIGR by Gigadevice Semiconductor is a 2MX8 NOR flash memory with 120 MHz clock frequency. Operating at -40 to 85 °C, it offers 100000 Write/Erase Cycles endurance. Ideal for industrial applications requiring high-speed serial data storage in compact form factors.
3 mm
2097152 words
2M
2MX8
SOLCC8,.11,20
2 mm
GD25Q16CSIG
GD25Q16CSIG by Gigadevice Semiconductor is a 16Mb NOR Flash Memory with 120MHz clock frequency, SPI serial bus type. Operating at -40 to 85°C, it offers 100K write/erase cycles and supports hardware/software write protection. Ideal for industrial applications requiring high-speed data storage in compact designs.
GD25Q16CTIG
GD25Q16CTIG by Gigadevice Semiconductor is a 16Mb NOR Flash Memory with SPI interface. Operating at 120MHz clock frequency, it offers 100K Write/Erase cycles endurance. Ideal for industrial applications requiring high-speed data transfer and reliable non-volatile memory storage.
SOP8,.25
MTFDDAV480TDS-1AW1ZABYY
Micron Technology's MTFDDAV480TDS-1AW1ZABYY is a 480GX8 TLC NAND flash memory with 3.3V programming voltage. Operating in asynchronous mode, it has a memory density of 4123168604160 bit and operates b/w 0 to 70 °C. Ideal for microelectronic assemblies, this rectangular package measures 80mm x 22mm x 3.28mm and features a serial interface with no lead terminals.
R-XSMA-N75
80 mm
4123168604160 bit
75
515396075520 words
480G
70 Cel
0 Cel
480GX8
SMA
3.28 mm
3.46 V
3.14 V
SINGLE
TLC NAND TYPE
22 mm
2988780
Phoenix Contact
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; No. of Words Code: 256M; Length: 36.4 mm; Width: 3.3 mm;
36.4 mm
2147483648 bit
CONFIGURATION MEMORY
268435456 words
256M
256MX8
42.8 mm
3.465 V
3.135 V
3.3 mm
SFU32048E1AE1TO-I-QT-1A1-STD
Swissbit Ag
SFU32048E1AE1TO-I-QT-1A1-STD by Swissbit Ag is a 2GX8 SLC NAND flash memory with 17179869184 bit density. Operating in industrial temperature range (-40 to 85 °C), it has a rectangular shape, 67.8mm length, and asynchronous mode. Ideal for applications requiring high reliability and fast data storage.
R-XXMA-X
67.8 mm
8.3 mm
208 mA
5.5 V
4.5 V
MTFC16GAPALBH-ITTR
MTFC16GAPALBH-ITTR by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a thin profile and fine pitch package style suitable for industrial applications. With a temperature range of -40 to 85 °C, it offers high-speed synchronous operation in a compact form factor.
1.2 mm
MTFC16GAPALBH-IT
MTFC16GAPALBH-IT by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a thin profile and fine pitch package style suitable for industrial applications. With a temperature range of -40 to 85 °C, this flash card offers high memory density and synchronous operation.
IS25WP512M-RHLA3-TR
Integrated Silicon Solution
IS25WP512M-RHLA3-TR by Integrated Silicon Solution is a 64MX8 NOR flash memory with 112 MHz clock frequency. Operating at 1.8V, it offers 100000 write/erase cycles and supports SPI serial bus type. Ideal for automotive applications due to AEC-Q100 screening level and -40 to 125 °C temperature range.
112 MHz
R-PBGA-B24
3
24
TBGA
BGA24,5X5,40
GRID ARRAY, THIN PROFILE
.00026 Amp
35 mA
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