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FEMC004GTTG7-T13-16

Flexxon Global

FEMC004GTTG7-T13-16 by Flexxon Global

FEMC004GTTG7-T13-16 by Flexxon Global is a 3.3V MLC NAND Flash Memory with 4GX8 organization, 100 terminals, and 34359738368 bit memory density. It operates in industrial temperature range (-40 to 85 °C) and is suitable for applications requiring high-density storage in automotive electronics or industrial devices.

Median Price

$19.020

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 35 parts In-Stock

1+ parts

$19.020

100+ parts

$16.259

1k+ parts

$15.324

10k+ parts

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35

$19.020

$16.259

$15.324

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,100 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,100

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Nova Conductors

Japan . 41 parts In-Stock

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1k+ parts

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41

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 612 parts In-Stock

1+ parts

$3.070

100+ parts

-

1k+ parts

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10k+ parts

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612

$3.070

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AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$13.418

100+ parts

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871

$13.418

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$17.425

100+ parts

$16.031

1k+ parts

$15.022

10k+ parts

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5,000

$17.425

$16.031

$15.022

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Continental Prestige Electronics

USA . 4,824 parts In-Stock

1+ parts

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4,824

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Argo Parts USA

USA . 1,347 parts In-Stock

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1,347

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Bastille Electronics

Australia . 700 parts In-Stock

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700

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Overview

Upgrade your storage solutions with the FEMC004GTTG7-T13-16 by Flexxon Global, a high-quality flash memory device that offers reliability and performance. Manufactured with precision and expertise, this product is perfect for a wide range of applications in various industries. With its advanced features and durable construction, customers can trust in its value and benefits for their data storage needs. Experience the advantages of Flexxon Global's innovative technology and elevate your storage capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the flash memory, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes it easy to integrate this flash memory into various electronic devices or PCBs, saving space and reducing assembly time.

Screening Level: AEC-Q100; TS 16949

Having AEC-Q100 and TS 16949 screening levels ensures high quality and reliability, making it suitable for automotive and industrial applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy handling and integration into different design layouts, enhancing flexibility in product design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V provides compatibility with a wide range of systems, offering versatility in usage.

No. of Terminals: 100

Having 100 terminals allows for efficient connectivity and data transfer, making it suitable for applications requiring high-speed and high-capacity memory.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions, making it ideal for industrial use.

Organization: 4GX8

Organized as 4GX8, this flash memory offers a balance between capacity and performance, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this flash memory is capable of functioning in extreme cold environments, increasing its usability.

Type: MLC NAND TYPE

Being of MLC NAND type, this flash memory offers higher storage density and reliability, making it a cost-effective and efficient choice for storage solutions.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this flash memory is suitable for rugged environments, ensuring consistent performance in demanding conditions.

Technology: CMOS

Utilizing CMOS technology, this flash memory offers low power consumption and high-speed operation, making it energy-efficient and responsive.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation, improving reliability and performance in demanding applications.

No. of Words: 4294967296 words

With a vast number of words, this flash memory offers ample storage capacity, ideal for storing large amounts of data in various applications.

Memory Width: 8

Having a memory width of 8 bits allows for efficient data transfer and processing, enabling high-speed performance in data-intensive tasks.

No. of Words Code: 4G

The 4G words code signifies a high memory capacity, making it suitable for applications requiring extensive data storage and retrieval capabilities.

Memory Density: 34359738368 bit

With a high memory density of 34359738368 bits, this flash memory offers abundant storage space for a wide range of data-intensive applications.

Memory IC Type: FLASH CARD

Being a flash card memory IC type, this product provides portable storage solutions, making it convenient for use in mobile devices and embedded systems.

Technical Specifications

Flash Memory FEMC004GTTG7-T13-16 attributes and parameters. Explore more Flash Memory devices from Flexxon Global

Specs

JESD-30 Code:

R-PBGA-B100

Memory Density:

34359738368 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

100

No. of Words:

4294967296 words

No. of Words Code:

4G

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4GX8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Screening Level:

AEC-Q100; TS 16949

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Position:

BOTTOM

Type:

MLC NAND TYPE

Trade Compliance

FEMC004GTTG7-T13-16 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Flexxon Global

As NAND Flash Manufacturers, Flexxon is the leading brand to design, manufacture, and retail industrial NAND flash storage and memory devices. Our key emphasis is to provide top-notch memory solutions ensuring the highest level of data security. We have a range of versatile compact memory storage solutions to serve every sector; specifically the CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications. We are 100% focused on developing products and solutions that can be customized to support various Industrial performance requirements for our customer base worldwide. For a reliable, competent, and enduring memory, Flexxon always delivers premium memory devices to apprehend the data security aspects. Flexxon is the industry leader to develop NAND flash storage devices. Our key focus is to innovate memory devices ensuring data security and reliability. The rate of data theft and cyber-attacks has risen which unfolds the importance of a strong and efficient protection solution. Due to the need of eliminating cyber-threats, as NAND Flash Manufacturers, we have improvised the firmware-based cybersecurity solution to enhance the security level. The world’s first AI cybersecurity solution certifies as the last layer of defense against cyber threats and won the CSA Award. With the revolutionizing AI cybersecurity solution, Flexxon maintains Data Integrity, Data Confidentiality, and Cybersecurity intact. Being the leader in Industrial NAND Flash Manufacturing Industry, we have profound knowledge about the NAND flash market and have an in-depth understanding of the related challenges as well as the requirements of our CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications.

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