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FEMC004GTTG7-T13-17

Flexxon Global

FEMC004GTTG7-T13-17 by Flexxon Global

FEMC004GTTG7-T13-17 by Flexxon Global is a SLC NAND flash memory with 4GX8 organization and 4G word code. It operates at industrial temperature grade (-40 to 85 °C) and has a memory density of 34.36Gb. It is suitable for applications requiring high reliability and endurance, such as automotive electronics or industrial control systems.

Median Price

$30.480

Lifecycle Status

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3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 150 parts In-Stock

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$30.480

100+ parts

$25.980

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$25.116

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150

$30.480

$25.980

$25.116

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Distributors (In-Stock)

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Vyrian

USA . 5,937 parts In-Stock

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5,937

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Nova Conductors

Japan . 65 parts In-Stock

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65

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Aztec Data Supply Inc.

USA . 4,441 parts In-Stock

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$3.470

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$3.470

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AZTECH Wire

Italy . 528 parts In-Stock

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$7.624

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528

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$28.188

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$25.933

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$24.300

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50

$28.188

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$24.300

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QUARKTWIN TECHNOLOGY LTD

USA . 20,574 parts In-Stock

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Argo Parts USA

USA . 3,657 parts In-Stock

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Continental Prestige Electronics

USA . 1,629 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Experience exceptional quality and performance with the FEMC004GTTG7-T13-17 by Flexxon Global. As a leading manufacturer in the flash memory industry, Flexxon Global delivers unparalleled reliability and durability. This flash memory device is perfect for a wide range of applications, providing fast and efficient data storage. With its advanced technology and industrial-grade temperature resistance, it guarantees optimal performance even in extreme conditions. Say goodbye to data loss and enjoy seamless data management with the FEMC004GTTG7-T13-17. Trust Flexxon Global for superior quality and value that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package is made of plastic/epoxy, providing durability and protection for the flash memory chip. It ensures the product's resistance to external shocks or impacts, making it a reliable choice for various applications.

Surface Mount: YES

With surface mount capability, this flash memory can be easily attached to the surface of a printed circuit board (PCB), enabling a compact and space-efficient design. This feature allows for easier integration into electronic devices, making it a convenient choice for manufacturers.

No. of Functions: 1

This flash memory product has a single function. It serves as a reliable storage solution, allowing users to store and retrieve important data easily. The simplicity of a single function makes it uncomplicated to integrate into various applications, making it a versatile choice.

Screening Level: AEC-Q100; TS 16949

The flash memory undergoes strict testing and screening processes according to AEC-Q100 and TS 16949 standards. This ensures high-quality performance, reliability, and longevity in automotive and industrial environments. With these certifications, this flash memory becomes a trusted choice for demanding applications.

Package Shape: RECTANGULAR

The flash memory package is rectangular in shape, providing a compact form factor to fit into tight spaces. Its shape makes it easier to handle and mount onto electronic devices during the manufacturing process, making it a convenient and practical solution.

Nominal Supply Voltage / Vsup (V): 3.3

This flash memory operates at a nominal supply voltage of 3.3V. This voltage specification indicates the power level required for the product to function properly. With a low supply voltage, it can be compatible with a wide range of electronic systems, making it a versatile and energy-efficient choice.

No. of Terminals: 100

This flash memory device has 100 terminals for electrical connections. The number of terminals determines its interface capabilities, enabling compatibility with various systems and interfaces for seamless data transfer. With a higher number of terminals, this product offers expanded connectivity options, enhancing its usability.

Maximum Operating Temperature: 85 °C

The flash memory is designed to withstand a maximum operating temperature of 85°C. This high-temperature tolerance allows the product to function reliably in harsh environments and under elevated temperatures, making it suitable for demanding industrial applications.

Organization: 4GX8

The flash memory is organized in a 4Gx8 configuration. This organization specification indicates the number of memory cells and the structure of the chip. With a 4Gx8 organization, this product offers a large storage capacity and efficient data handling capabilities, making it ideal for data-intensive applications.

Minimum Operating Temperature: -40 °C

This flash memory product is designed to operate reliably in extreme cold temperatures as low as -40°C. Its ability to function under such low temperatures allows it to be used in a wide range of environmental conditions, making it a robust choice for various applications.

Terminal Position: BOTTOM

The terminals of this flash memory are positioned at the bottom, providing easy access and connectivity during the installation and integration process. The bottom terminal position simplifies the PCB layout and ensures efficient electrical connections, making it a user-friendly choice for manufacturers.

Type: SLC NAND TYPE

This flash memory employs the Single-Level Cell (SLC) NAND type technology. SLC NAND offers faster read and write speeds, higher endurance, and better performance compared to other types. With SLC NAND technology, this flash memory provides reliable and high-speed data storage, making it suitable for demanding applications.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this flash memory is designed to operate reliably in harsh industrial environments. It can withstand wide temperature ranges and maintain optimal performance, making it a durable and rugged choice for industrial applications.

Technology: CMOS

This flash memory utilizes Complementary Metal-Oxide-Semiconductor (CMOS) technology. CMOS technology offers low power consumption, high integration capabilities, and excellent noise immunity. With CMOS technology, this flash memory provides efficient power usage and reliable data storage, making it an energy-efficient choice.

Terminal Form: BALL

The terminals of this flash memory have a ball form, which facilitates reliable soldering and connectivity during the manufacturing process. The ball terminal form ensures secure electrical connections and simplifies the assembly, making it a convenient choice for manufacturers.

No. of Words: 4294967296 words

This flash memory consists of a massive number of 4294967296 words. The high word count indicates its large storage capacity, allowing users to store a vast amount of data. With such substantial memory capacity, this flash memory is an excellent choice for applications that require extensive storage capabilities.

Memory Width: 8

This flash memory has a memory width of 8. The memory width specification determines the number of bits that can be accessed simultaneously. With a memory width of 8, this flash memory enables efficient data transfer and processing, making it suitable for applications with high-speed data requirements.

No. of Words Code: 4G

The flash memory has a code that specifies the number of words as 4G. This code indicates the memory capacity of the flash memory chip, representing a large storage capability. With a 4G code, this flash memory provides ample space for storing various data types, making it versatile for a wide range of applications.

Memory Density: 34359738368 bit

This flash memory offers a memory density of 34359738368 bits. Memory density refers to the amount of data that can be stored within the flash memory chip. With such a high memory density, this flash memory is capable of accommodating a vast amount of information, making it suitable for data-intensive applications.

Memory IC Type: FLASH CARD

This flash memory belongs to the flash card memory IC type. Flash card memory ICs are commonly used in portable electronic devices such as cameras, smartphones, and tablets. With its flash card IC type, this memory offers convenient data storage and retrieval capabilities, making it an optimal choice for portable electronic devices.

Technical Specifications

Flash Memory FEMC004GTTG7-T13-17 attributes and parameters. Explore more Flash Memory devices from Flexxon Global

Specs

JESD-30 Code:

R-PBGA-B100

Memory Density:

34359738368 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

100

No. of Words:

4294967296 words

No. of Words Code:

4G

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4GX8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Screening Level:

AEC-Q100; TS 16949

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Position:

BOTTOM

Type:

SLC NAND TYPE

Trade Compliance

FEMC004GTTG7-T13-17 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Flexxon Global

As NAND Flash Manufacturers, Flexxon is the leading brand to design, manufacture, and retail industrial NAND flash storage and memory devices. Our key emphasis is to provide top-notch memory solutions ensuring the highest level of data security. We have a range of versatile compact memory storage solutions to serve every sector; specifically the CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications. We are 100% focused on developing products and solutions that can be customized to support various Industrial performance requirements for our customer base worldwide. For a reliable, competent, and enduring memory, Flexxon always delivers premium memory devices to apprehend the data security aspects. Flexxon is the industry leader to develop NAND flash storage devices. Our key focus is to innovate memory devices ensuring data security and reliability. The rate of data theft and cyber-attacks has risen which unfolds the importance of a strong and efficient protection solution. Due to the need of eliminating cyber-threats, as NAND Flash Manufacturers, we have improvised the firmware-based cybersecurity solution to enhance the security level. The world’s first AI cybersecurity solution certifies as the last layer of defense against cyber threats and won the CSA Award. With the revolutionizing AI cybersecurity solution, Flexxon maintains Data Integrity, Data Confidentiality, and Cybersecurity intact. Being the leader in Industrial NAND Flash Manufacturing Industry, we have profound knowledge about the NAND flash market and have an in-depth understanding of the related challenges as well as the requirements of our CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications.

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