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FEMC008GTTE7-T13-16

Flexxon Global

FEMC008GTTE7-T13-16 by Flexxon Global

Flexxon Global's FEMC008GTTE7-T13-16 Flash Memory features 8GX8 organization, MLC NAND technology, and 3.3V nominal voltage. Ideal for automotive applications with AEC-Q100 screening level, TS 16949 certification, and operating temperatures ranging from -25 to 85°C.

Median Price

$39.120

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 131 parts In-Stock

1+ parts

$39.120

100+ parts

$33.300

1k+ parts

$32.189

10k+ parts

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131

$39.120

$33.300

$32.189

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,568 parts In-Stock

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6,568

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 39,200 parts In-Stock

1+ parts

$5.560

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39,200

$5.560

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AZTECH Wire

Italy . 679 parts In-Stock

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$18.776

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679

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$37.410

100+ parts

$34.417

1k+ parts

$32.250

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500

$37.410

$34.417

$32.250

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Continental Prestige Electronics

USA . 6,972 parts In-Stock

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Argo Parts USA

USA . 1,785 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Discover the cutting-edge FEMC008GTTE7-T13-16 by Flexxon Global, a top-quality Flash Memory product designed with precision and reliability in mind. With AEC-Q100 and TS 16949 screening levels, this rectangular-shaped memory device offers exceptional performance in a wide range of applications. Benefit from its 8GX8 organization, MLC NAND technology, and 3.3V supply voltage for seamless integration into your projects. Trust Flexxon Global for top-of-the-line memory solutions that deliver value, efficiency, and peace of mind to customers looking for high-performance flash cards. Elevate your technology with the FEMC008GTTE7-T13-16 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability for long-term use.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly.

Screening Level: AEC-Q100; TS 16949

AEC-Q100 and TS 16949 screening level certifications guarantee high quality and reliability for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient and space-saving mounting in electronic devices.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is standard and widely compatible with various electronic systems and devices.

No. of Terminals: 100

With 100 terminals, this flash memory offers a high level of connectivity for data transfer and storage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environments.

Organization: 8GX8

The 8GX8 organization provides a good balance between storage capacity and data access speed.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows for reliable performance even in extreme cold conditions.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the design and layout of the circuit board.

Type: MLC NAND TYPE

The MLC NAND type offers a good balance between cost and performance for data storage applications.

Technology: CMOS

The CMOS technology used in this flash memory ensures low power consumption and high-speed data processing.

Terminal Form: BALL

The terminal form in ball shape ensures secure connections and efficient heat dissipation.

No. of Words: 8589934592 words

The large number of words supported indicates a high storage capacity for data-intensive applications.

Memory Width: 8

The memory width of 8 bits allows for efficient data transfer and processing.

No. of Words Code: 8G

The 8G words code signifies a large memory capacity suitable for storing a vast amount of data.

Memory Density: 68719476736 bit

The high memory density of 68719476736 bits enables storing a large volume of data in a compact form factor.

Memory IC Type: FLASH CARD

This flash memory IC type is commonly used in portable devices and offers fast read and write speeds.

Technical Specifications

Flash Memory FEMC008GTTE7-T13-16 attributes and parameters. Explore more Flash Memory devices from Flexxon Global

Specs

JESD-30 Code:

R-PBGA-B100

Memory Density:

68719476736 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

100

No. of Words:

8589934592 words

No. of Words Code:

8G

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

8GX8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Screening Level:

AEC-Q100; TS 16949

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Position:

BOTTOM

Type:

MLC NAND TYPE

Trade Compliance

FEMC008GTTE7-T13-16 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Flexxon Global

As NAND Flash Manufacturers, Flexxon is the leading brand to design, manufacture, and retail industrial NAND flash storage and memory devices. Our key emphasis is to provide top-notch memory solutions ensuring the highest level of data security. We have a range of versatile compact memory storage solutions to serve every sector; specifically the CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications. We are 100% focused on developing products and solutions that can be customized to support various Industrial performance requirements for our customer base worldwide. For a reliable, competent, and enduring memory, Flexxon always delivers premium memory devices to apprehend the data security aspects. Flexxon is the industry leader to develop NAND flash storage devices. Our key focus is to innovate memory devices ensuring data security and reliability. The rate of data theft and cyber-attacks has risen which unfolds the importance of a strong and efficient protection solution. Due to the need of eliminating cyber-threats, as NAND Flash Manufacturers, we have improvised the firmware-based cybersecurity solution to enhance the security level. The world’s first AI cybersecurity solution certifies as the last layer of defense against cyber threats and won the CSA Award. With the revolutionizing AI cybersecurity solution, Flexxon maintains Data Integrity, Data Confidentiality, and Cybersecurity intact. Being the leader in Industrial NAND Flash Manufacturing Industry, we have profound knowledge about the NAND flash market and have an in-depth understanding of the related challenges as well as the requirements of our CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications.

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