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FEMC016GTTE7-T13-16

Flexxon Global

FEMC016GTTE7-T13-16 by Flexxon Global

FEMC016GTTE7-T13-16 by Flexxon Global is a flash memory with 16GX8 organization and MLC NAND type technology. It has a memory density of 137438953472 bits and operates at temperatures ranging from -25 to 85°C. This memory card is suitable for applications requiring high storage capacity and reliable performance.

Median Price

$53.350

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 40 parts In-Stock

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$53.350

100+ parts

$45.344

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40

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Vyrian

USA . 6,496 parts In-Stock

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6,496

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Nova Conductors

Japan . 1,000 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,688 parts In-Stock

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$4.110

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$4.110

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AZTECH Wire

Italy . 579 parts In-Stock

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$10.681

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579

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Advanced Electronics

New Zealand . 700 parts In-Stock

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$42.630

100+ parts

$39.220

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$36.750

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700

$42.630

$39.220

$36.750

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Microchip USA

USA . 2,810 parts In-Stock

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$99.659

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Argo Parts USA

USA . 2,942 parts In-Stock

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Bastille Electronics

Australia . 600 parts In-Stock

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Continental Prestige Electronics

USA . 432 parts In-Stock

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Overview

Discover the superior quality and unmatched performance of the FEMC016GTTE7-T13-16 by Flexxon Global. As a leading manufacturer in the industry, Flexxon Global's commitment to excellence shines through in every product they create. This flash memory device delivers unrivaled speed and reliability, making it perfect for a variety of applications. With its cutting-edge technology and impressive storage capacity, this product offers customers unparalleled value and convenience. Experience the benefits of advanced data storage with the FEMC016GTTE7-T13-16 by Flexxon Global.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the flash memory chip, making it suitable for a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on PCBs, saving space and facilitating automated manufacturing processes.

Screening Level: AEC-Q100; TS 16949

Compliance with AEC-Q100 and TS 16949 standards ensures high reliability, quality, and performance in automotive and industrial environments.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for easy integration into various electronic devices and systems.

Nominal Supply Voltage: 3.3V

Operates efficiently at a standard supply voltage of 3.3V, ensuring compatibility with a wide range of electronic devices and systems.

No. of Terminals: 100

Having 100 terminals allows for efficient data transfer and communication between the flash memory chip and other components in the system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this flash memory chip can reliably function in demanding environmental conditions without overheating.

Organization: 16GX8

Organized into 16 groups of 8 bits each, providing a total of 17179869184 words for efficient data storage and retrieval.

Minimum Operating Temperature: -25 °C

The flash memory chip can operate at temperatures as low as -25 °C, making it suitable for use in both extreme hot and cold environments.

Type: MLC NAND TYPE

Multi-Level Cell (MLC) NAND technology offers higher storage capacity and faster read/write speeds, ideal for applications requiring large amounts of data storage.

Technology: CMOS

Complementary Metal-Oxide Semiconductor (CMOS) technology provides low power consumption, high speed, and reliable performance, making the flash memory chip energy-efficient and durable.

Terminal Form: BALL

Ball terminal form ensures secure electrical connections and easy soldering during assembly, enhancing overall reliability and performance.

No. of Words: 17179869184 words

The large number of available words allows for extensive data storage capacity, suitable for storing a vast amount of information in a compact form factor.

Memory Width: 8

With a memory width of 8 bits, the flash memory chip can efficiently process and transfer data in parallel, enhancing overall speed and performance.

No. of Words Code: 16G

The 16G words code indicates a memory density of 137438953472 bits, providing ample storage space for various applications and use cases.

Memory IC Type: FLASH CARD

Being a flash card memory IC type, this product offers fast data access times, high reliability, and excellent data retention, making it suitable for portable storage devices and memory cards.

Technical Specifications

Flash Memory FEMC016GTTE7-T13-16 attributes and parameters. Explore more Flash Memory devices from Flexxon Global

Specs

JESD-30 Code:

R-PBGA-B100

Memory Density:

137438953472 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

100

No. of Words:

17179869184 words

No. of Words Code:

16G

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

16GX8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Screening Level:

AEC-Q100; TS 16949

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Position:

BOTTOM

Type:

MLC NAND TYPE

Trade Compliance

FEMC016GTTE7-T13-16 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Flexxon Global

As NAND Flash Manufacturers, Flexxon is the leading brand to design, manufacture, and retail industrial NAND flash storage and memory devices. Our key emphasis is to provide top-notch memory solutions ensuring the highest level of data security. We have a range of versatile compact memory storage solutions to serve every sector; specifically the CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications. We are 100% focused on developing products and solutions that can be customized to support various Industrial performance requirements for our customer base worldwide. For a reliable, competent, and enduring memory, Flexxon always delivers premium memory devices to apprehend the data security aspects. Flexxon is the industry leader to develop NAND flash storage devices. Our key focus is to innovate memory devices ensuring data security and reliability. The rate of data theft and cyber-attacks has risen which unfolds the importance of a strong and efficient protection solution. Due to the need of eliminating cyber-threats, as NAND Flash Manufacturers, we have improvised the firmware-based cybersecurity solution to enhance the security level. The world’s first AI cybersecurity solution certifies as the last layer of defense against cyber threats and won the CSA Award. With the revolutionizing AI cybersecurity solution, Flexxon maintains Data Integrity, Data Confidentiality, and Cybersecurity intact. Being the leader in Industrial NAND Flash Manufacturing Industry, we have profound knowledge about the NAND flash market and have an in-depth understanding of the related challenges as well as the requirements of our CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications.

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