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SST25PF040C-40E/SN

Microchip Technology

SST25PF040C-40E/SN by Microchip Technology

SST25PF040C-40E/SN by Microchip: 3.3V NOR Flash Memory with 4Mx1 organization, SPI interface, and 40MHz clock frequency. Ideal for automotive applications due to TS16949 screening level and -40°C to 125°C operating temperature range. Compact size (4.9mm x 3.9mm) with low standby current (0.00001A).

Median Price

$2.237

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$1.315

100+ parts

-

1k+ parts

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85

$1.315

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Mobius Materials

USA . 215 parts In-Stock

1+ parts

$3.160

100+ parts

$2.520

1k+ parts

-

10k+ parts

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215

$3.160

$2.520

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Vyrian

USA . 6,309 parts In-Stock

1+ parts

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6,309

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 250 parts In-Stock

1+ parts

$1.060

100+ parts

-

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250

$1.060

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Continental Prestige Electronics

USA . 5,818 parts In-Stock

1+ parts

$1.315

100+ parts

-

1k+ parts

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10k+ parts

$1.288

5,818

$1.315

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-

$1.288

Argo Parts USA

USA . 4,034 parts In-Stock

1+ parts

$1.315

100+ parts

-

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4,034

$1.315

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.315

100+ parts

$1.288

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10k+ parts

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100

$1.315

$1.288

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$3.193

100+ parts

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208

$3.193

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Aztec Data Supply Inc.

USA . 3,526 parts In-Stock

1+ parts

$4.800

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3,526

$4.800

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AZTECH Wire

Italy . 779 parts In-Stock

1+ parts

$12.966

100+ parts

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779

$12.966

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Fulton Briggs Corp.

USA . 1,853 parts In-Stock

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1,853

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Overview

Unlock the power of reliable and high-performance Flash Memory with the SST25PF040C-40E/SN by Microchip Technology. As a trusted manufacturer in the industry, Microchip Technology delivers top-quality products that meet TS 16949 screening standards. This versatile memory device is perfect for automotive applications, offering 4MX1 organization, 3-STATE output characteristics, and 100,000 Write/Erase cycles. With a wide operating temperature range and compact design, the SST25PF040C-40E/SN provides exceptional value and performance for your project needs. Choose Microchip Technology for cutting-edge technology you can rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product, ensuring it can withstand various environmental conditions.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage for efficient performance and power consumption of the flash memory.

Maximum Operating Temperature: 125 °C

Allows the flash memory to operate in high-temperature environments without compromising performance.

Organization: 4MX1

Efficient organization of memory cells, allowing for fast read and write operations.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation for the flash memory.

Endurance: 100000 Write/Erase Cycles

High endurance level ensures long-term reliability and longevity of the flash memory.

Technical Specifications

Flash Memory SST25PF040C-40E/SN attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

40 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3.3

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

SOFTWARE

Trade Compliance

SST25PF040C-40E/SN Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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