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W25Q80DVZPIG

Winbond Electronics

W25Q80DVZPIG by Winbond Electronics

W25Q80DVZPIG by Winbond Electronics is a NOR type Flash Memory with 1Mx8 organization, operating at 3V with 104MHz clock frequency. It offers 100000 Write/Erase cycles endurance and SPI serial bus interface. Ideal for applications requiring fast synchronous operation and low power consumption in compact electronic devices.

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,510 parts In-Stock

1+ parts

$0.520

100+ parts

$0.457

1k+ parts

$0.423

10k+ parts

$0.400

3,510

$0.520

$0.457

$0.423

$0.400

Chip1Stop

Japan . 63 parts In-Stock

1+ parts

-

100+ parts

$0.400

1k+ parts

-

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63

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$0.400

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TECHDesign

Taiwan . 4,739 parts In-Stock

1+ parts

$0.400

100+ parts

$0.380

1k+ parts

$0.350

10k+ parts

-

4,739

$0.400

$0.380

$0.350

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.408

100+ parts

-

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-

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50

$0.408

-

-

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Vyrian

USA . 4,394 parts In-Stock

1+ parts

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4,394

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ComSIT Distribution GmbH

Germany . 101 parts In-Stock

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101

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Cyclops Electronics Ltd

UK . 38 parts In-Stock

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38

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Bristol Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.399

100+ parts

-

1k+ parts

$0.383

10k+ parts

-

2,000

$0.399

-

$0.383

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Continental Prestige Electronics

USA . 4,073 parts In-Stock

1+ parts

$0.408

100+ parts

-

1k+ parts

-

10k+ parts

$0.399

4,073

$0.408

-

-

$0.399

Argo Parts USA

USA . 741 parts In-Stock

1+ parts

$0.408

100+ parts

-

1k+ parts

-

10k+ parts

$0.395

741

$0.408

-

-

$0.395

Corohmni

South Africa . 660 parts In-Stock

1+ parts

$3.571

100+ parts

-

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660

$3.571

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Aztec Data Supply Inc.

USA . 1,184 parts In-Stock

1+ parts

$3.940

100+ parts

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1,184

$3.940

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$6.048

100+ parts

$5.746

1k+ parts

$5.746

10k+ parts

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700

$6.048

$5.746

$5.746

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QUARKTWIN TECHNOLOGY LTD

USA . 6,317 parts In-Stock

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6,317

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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5,880

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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GreenTree Electronics

Israel . 2,000 parts In-Stock

1+ parts

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2,000

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Kepictronics

USA . 751 parts In-Stock

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751

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Overview

Unlock the power of reliable and high-performance flash memory with the W25Q80DVZPIG by Winbond Electronics. With a commitment to quality and innovation, Winbond Electronics sets the standard in the industry. This versatile product is ideal for a wide range of applications, offering customers seamless integration and superior performance. Experience peace of mind knowing that you are investing in a top-notch product that delivers value, benefits, and advantages that exceed expectations. Trust Winbond Electronics to provide you with the best solution for your flash memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the flash memory chip, ensuring reliability in various environments.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and enabling efficient PCB design.

Operating Mode: SYNCHRONOUS

Allows for faster data transfer rates and synchronization with other components in the system.

Nominal Supply Voltage / Vsup (V): 3

Compatible with common voltage levels in electronic devices, making it widely applicable.

Power Supplies (V): 3/3.3

Provides flexibility in power input options, ensuring compatibility with various systems.

No. of Terminals: 8

Simple and straightforward interface for connecting to other components in the system.

Maximum Operating Temperature: 85 °C

Suitable for use in a wide range of operating conditions without compromising performance.

Organization: 1MX8

Offers a high memory capacity organized in an efficient structure for data storage.

Output Characteristics: 3-STATE

Enables tristate output for efficient data bus management and reduced power consumption.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold environments.

Write Protection: HARDWARE/SOFTWARE

Provides security features to prevent accidental data overwrite or corruption.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact and efficient design for space-saving and optimal heat dissipation.

Technical Specifications

Flash Memory W25Q80DVZPIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00006 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q80DVZPIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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