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FEMC016GTTG7-T13-27

Flexxon Global

FEMC016GTTG7-T13-27 by Flexxon Global

FEMC016GTTG7-T13-27 by Flexxon Global is a SLC NAND flash memory with 16GX8 organization and 137.4Gb density. It operates in industrial temperature range (-40 to 85°C) and has AEC-Q100 screening level for automotive applications. The package is rectangular, surface mountable, with 100 terminals at a nominal voltage of 3.3V.

Median Price

$69.190

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 71 parts In-Stock

1+ parts

$69.190

100+ parts

$58.735

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71

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Distributors (In-Stock)

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Vyrian

USA . 6,500 parts In-Stock

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6,500

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,768 parts In-Stock

1+ parts

$4.880

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2,768

$4.880

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AZTECH Wire

Italy . 693 parts In-Stock

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$15.382

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693

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Advanced Electronics

New Zealand . 56 parts In-Stock

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$65.250

100+ parts

$60.030

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$56.250

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56

$65.250

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Microchip USA

USA . 1,201 parts In-Stock

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$150.190

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Continental Prestige Electronics

USA . 3,806 parts In-Stock

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3,806

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Argo Parts USA

USA . 3,228 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Experience top-notch quality and reliability with the FEMC016GTTG7-T13-27 by Flexxon Global. This flash memory device offers unparalleled performance and durability, making it perfect for a wide range of applications. With a focus on excellence in manufacturing and cutting-edge technology, Flexxon Global guarantees a product that delivers exceptional value and benefits to customers. Trust in Flexxon Global to provide you with the best solutions for your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the flash memory, making it suitable for various industrial environments.

Surface Mount: YES

Being surface mountable makes the installation of this flash memory easy and convenient in electronic devices.

Screening Level: AEC-Q100; TS 16949

Compliance with these screening levels ensures high quality and reliability in automotive and industrial applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage of 3.3V, ensuring compatibility with most electronic systems.

No. of Terminals: 100

Having a sufficient number of terminals allows for seamless connectivity and data transfer in complex systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this flash memory can withstand harsh environmental conditions without compromising performance.

Organization: 16GX8

The organization of 16GX8 signifies a high capacity and efficient data organization, ideal for storing large amounts of information.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extremely cold environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy installation and maintenance in electronic devices.

Type: SLC NAND TYPE

Being an SLC NAND type ensures fast data transfer speeds and enhanced durability, making it suitable for critical applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade allows this flash memory to operate efficiently in demanding industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making this flash memory energy-efficient.

Terminal Form: BALL

The ball terminal form provides secure connections and allows for reliable data transfer in electronic systems.

No. of Words: 17179869184 words

With a high number of words, this flash memory offers ample storage capacity for extensive data storage requirements.

Memory Width: 8

An 8-bit memory width ensures efficient data handling and processing capabilities, making it suitable for high-performance applications.

No. of Words Code: 16G

The 16G words code indicates a large storage capacity, making this flash memory suitable for data-intensive applications.

Memory Density: 137438953472 bit

With high memory density, this flash memory can accommodate a large amount of data in a compact form factor.

Memory IC Type: FLASH CARD

Being a flash card memory IC type offers versatility and compatibility with a wide range of devices, making it a versatile storage solution.

Technical Specifications

Flash Memory FEMC016GTTG7-T13-27 attributes and parameters. Explore more Flash Memory devices from Flexxon Global

Specs

JESD-30 Code:

R-PBGA-B100

Memory Density:

137438953472 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

100

No. of Words:

17179869184 words

No. of Words Code:

16G

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16GX8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Screening Level:

AEC-Q100; TS 16949

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Position:

BOTTOM

Type:

SLC NAND TYPE

Trade Compliance

FEMC016GTTG7-T13-27 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Flexxon Global

As NAND Flash Manufacturers, Flexxon is the leading brand to design, manufacture, and retail industrial NAND flash storage and memory devices. Our key emphasis is to provide top-notch memory solutions ensuring the highest level of data security. We have a range of versatile compact memory storage solutions to serve every sector; specifically the CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications. We are 100% focused on developing products and solutions that can be customized to support various Industrial performance requirements for our customer base worldwide. For a reliable, competent, and enduring memory, Flexxon always delivers premium memory devices to apprehend the data security aspects. Flexxon is the industry leader to develop NAND flash storage devices. Our key focus is to innovate memory devices ensuring data security and reliability. The rate of data theft and cyber-attacks has risen which unfolds the importance of a strong and efficient protection solution. Due to the need of eliminating cyber-threats, as NAND Flash Manufacturers, we have improvised the firmware-based cybersecurity solution to enhance the security level. The world’s first AI cybersecurity solution certifies as the last layer of defense against cyber threats and won the CSA Award. With the revolutionizing AI cybersecurity solution, Flexxon maintains Data Integrity, Data Confidentiality, and Cybersecurity intact. Being the leader in Industrial NAND Flash Manufacturing Industry, we have profound knowledge about the NAND flash market and have an in-depth understanding of the related challenges as well as the requirements of our CYBERSECURITY, INDUSTRIAL, MEDICAL & AUTOMOTIVE (CIMA) applications.

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