Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MX25V20066M1I02
Macronix
Macronix MX25V20066M1I02 is a NOR flash memory with 256Kx8 organization, SPI serial bus type, and 80 MHz clock frequency. It is ideal for industrial applications requiring high endurance of 100k write/erase cycles in a small outline package.
ALSO AVAILABLE WITH 2.3VMIN@50MHZ
80 MHz
20
100000 Write/Erase Cycles
R-PDSO-G8
4.9 mm
2097152 bit
FLASH
8
1
262144 words
256K
SYNCHRONOUS
85 Cel
-40 Cel
256KX8
3-STATE
PLASTIC/EPOXY
SOP
SOP8,.25
RECTANGULAR
SMALL OUTLINE
SERIAL
3
1.75 mm
SPI
.00002 Amp
15 mA
3.6 V
2.7 V
YES
CMOS
INDUSTRIAL
GULL WING
1.27 mm
DUAL
NOR TYPE
3.9 mm
HARDWARE
MTFC64GAPALGT-AIT
Micron Technology
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA153,14X14,20;
200 MHz
5
R-PBGA-B153
13 mm
549755813888 bit
FLASH CARD
153
68719476736 words
64G
64GX8
VFBGA
BGA153,14X14,20
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PARALLEL
AEC-Q100
.8 mm
BALL
.5 mm
BOTTOM
NAND TYPE
11.5 mm
MTFC64GAPALHT-AIT
Micron Technology's MTFC64GAPALHT-AIT is a 64GX8 NAND flash memory with 549755813888 bit density. Operating at up to 200 MHz, it offers -40 to 85 °C temp range and AEC-Q100 screening for industrial applications. With a very thin profile, this package features a grid array style suitable for high-speed data storage systems.
R-PBGA-B100
18 mm
100
VBGA
BGA100,10X17,40
GRID ARRAY, VERY THIN PROFILE
1 mm
14 mm
MTFC16GAPALHT-AAT
MTFC16GAPALHT-AAT by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a memory density of 137438953472 bit and supports industrial temperature grade applications. With a very thin profile package style, it is suitable for high-performance devices requiring fast data storage and retrieval.
137438953472 bit
17179869184 words
16G
105 Cel
16GX8
MTFC32GAPALGT-AAT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
274877906944 bit
34359738368 words
32G
32GX8
MTFC8GAMALGT-AIT
MTFC8GAMALGT-AIT by Micron Technology is a NAND flash memory with 8GX8 organization, operating at up to 200 MHz. It features a very thin profile, fine pitch package style suitable for industrial applications. With a memory density of 68719476736 bits and AEC-Q100 screening level, it offers reliable performance in automotive electronics.
68719476736 bit
8589934592 words
8G
8GX8
MTFC8GAMALHT-AIT
Micron Technology's MTFC8GAMALHT-AIT is a NAND flash memory with 8GX8 organization, 200 MHz clock frequency, and 85°C max operating temp. Ideal for industrial applications requiring high-speed data storage in compact devices due to its very thin profile package style and AEC-Q100 screening level.
MTFC128GAPALBH-AIT
Micron Technology's MTFC128GAPALBH-AIT is a 128GX8 NAND flash memory with 1.1mm seated height, operating at up to 200MHz clock frequency. Ideal for industrial applications, it offers a memory density of 1099511627776 bit and operates in an industrial temperature range from -40°C to 85°C.
e1
1099511627776 bit
137438953472 words
128G
128GX8
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
260
1.1 mm
TIN SILVER COPPER
30
MTFC8GAMALGT-AAT
Micron Technology's MTFC8GAMALGT-AAT is a NAND flash memory with 8GX8 organization, 200 MHz clock frequency, and 105°C max operating temp. Ideal for industrial applications requiring high-speed data storage in compact devices due to its fine pitch grid array package and low power consumption.
MTFC8GAMALHT-AAT
MTFC8GAMALHT-AAT by Micron Technology is a 8GX8 NAND flash memory with 68719476736 bit density. It operates in synchronous mode at up to 200 MHz clock frequency, suitable for industrial applications requiring high-speed data storage and retrieval. With a temperature range of -40 to 105 °C, it offers reliable performance in harsh environments.
MTFC32GAPALGT-AIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153;
MTFC32GAPALHT-AAT
MTFC32GAPALHT-AAT by Micron Technology is a 32GX8 NAND flash memory with 34359738368 words capacity. Operating at up to 200 MHz, it offers industrial-grade performance with -40 to 105 °C temperature range. Ideal for applications requiring high-speed data storage in compact form factors.
MTFC32GAPALHT-AIT
Micron Technology's MTFC32GAPALHT-AIT is a 32GX8 NAND flash memory with 34359738368 words capacity. Operating at up to 200 MHz, it features a very thin profile grid array package suitable for industrial applications. With a temperature range of -40 to 85 °C, this CMOS technology memory supports parallel operation and has a min data retention time of 5 units.
MTFDHBA480TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words: 515396075520 words; No. of Words Code: 480G; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
R-XXMA-N
4123168604160 bit
FLASH MODULE
515396075520 words
480G
ASYNCHRONOUS
70 Cel
0 Cel
480GX8
UNSPECIFIED
XMA
MICROELECTRONIC ASSEMBLY
NO LEAD
TLC NAND TYPE
MTFDHBA480TDF-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Surface Mount: YES; Package Body Material: UNSPECIFIED;
MTFDHBE3T2TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Organization: 3.2TX8; Technology: CMOS;
28147497671065 bit
3518437208883 words
3.2T
3.2TX8
MTFDHBE3T8TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Technology: CMOS; No. of Words Code: 3.84T;
33776997205278 bit
4222124650659 words
3.84T
3.84TX8
MTFDHBE7T6TDF-1AW4ZABYY
Micron Technology's MTFDHBE7T6TDF-1AW4ZABYY is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 7.68TX8 organization, TLC NAND TYPE, and 67553994410557 bit memory density. It operates in ASYNCHRONOUS mode at temperatures from 0 to 70 °C, suitable for FLASH MODULE applications.
67553994410557 bit
8444249301319 words
7.68T
7.68TX8
MTFDHBE800TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Memory Width: 8; Type: TLC NAND TYPE;
6871947673600 bit
858993459200 words
800G
800GX8
MTFDHBG1T9TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Organization: 1.92TX8; Surface Mount: YES;
16888498602639 bit
2111062325329 words
1.92T
1.92TX8
MTFDHBE3T2TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Density: 28147497671065 bit; Technology: CMOS; Package Body Material: UNSPECIFIED;
MTFDHBE6T4TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; Terminal Position: UNSPECIFIED; Maximum Operating Temperature: 70 Cel;
56294995342131 bit
7036874417766 words
6.4T
6.4TX8
MTFDHBG1T9TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; No. of Functions: 1; Terminal Form: NO LEAD; No. of Words: 2111062325329 words;
MTFDHBG3T8TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words: 4222124650659 words; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Terminal Position: UNSPECIFIED;
MTFDHBA400TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Terminal Position: UNSPECIFIED;
3435973836800 bit
429496729600 words
400G
400GX8
MTFDHBA480TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Type: TLC NAND TYPE; No. of Words Code: 480G;
MTFDHBA960TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Package Body Material: UNSPECIFIED; Memory Density: 8246337208320 bit;
8246337208320 bit
1030792151040 words
960G
960GX8
MTFDHBE1T9TDF-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Memory Density: 16888498602639 bit; Technology: CMOS;
MTFDHBE1T9TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Density: 16888498602639 bit; Surface Mount: YES; No. of Words Code: 1.92T;
MTFDHBE6T4TDG-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; JESD-30 Code: R-XXMA-N; Memory Density: 56294995342131 bit;
MTFDHBE7T6TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Memory Width: 8; No. of Words: 8444249301319 words;
MTFDHBA400TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Surface Mount: YES; Minimum Operating Temperature: 0 Cel;
MTFDHBA800TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Operating Mode: ASYNCHRONOUS; Package Body Material: UNSPECIFIED;
MTFDHBE3T8TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Organization: 3.84TX8; Surface Mount: YES;
MTFDHBE6T4TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Technology: CMOS; Memory Density: 56294995342131 bit;
MTFDHBE800TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Terminal Form: NO LEAD; Type: TLC NAND TYPE;
MTFDHBE960TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Surface Mount: YES; Memory Density: 8246337208320 bit;
MTFDHBG3T8TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; No. of Words: 4222124650659 words; Operating Mode: ASYNCHRONOUS;
MTFDHBE1T6TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED;
14073748835532 bit
1759218604441 words
1.6T
1.6TX8
MTFDHBE1T6TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; Package Body Material: UNSPECIFIED; Terminal Form: NO LEAD;
MTFDHBE1T9TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Width: 8; Package Body Material: UNSPECIFIED; Technology: CMOS;
MTFDHBA960TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: UNSPECIFIED; Terminal Form: NO LEAD;
MT25QL02GCBB8E12-0SITTR
Micron Technology's MT25QL02GCBB8E12-0SITTR is a 256MX8 NOR flash memory with 133 MHz clock frequency, 3V programming voltage. Ideal for industrial applications, it offers 100K write/erase cycles, SPI serial bus type, and operates in a temperature range of -40 to 85°C.
BOTTOM/TOP
133 MHz
R-PBGA-B24
8 mm
2147483648 bit
24
268435456 words
256M
256MX8
TBGA
BGA24,5X5,40
GRID ARRAY, THIN PROFILE
1.2 mm
.00013 Amp
94 mA
6 mm
HARDWARE/SOFTWARE
MTFC128GAZAQJP-AIT
MTFC128GAZAQJP-AIT by Micron Technology is a 128GX8 NAND flash memory with 1.8V programming voltage, operating at up to 200MHz clock frequency. It is designed for industrial applications requiring high memory density and operates in synchronous mode with a temperature range of -40 to 85°C.
1.8
1.95 V
1.7 V
MTFC64GAZAQHD-AIT
Micron Technology's MTFC64GAZAQHD-AIT is a 64GX8 NAND flash memory with 68719476736 words capacity. Operating at 200 MHz, it has a low profile of 0.9 mm and supports industrial temperature grade applications. With a package style of GRID ARRAY, it offers high memory density and synchronous operation for various electronic devices.
.9 mm
W25R256JVFIQ
Winbond Electronics
Winbond Electronics' W25R256JVFIQ is a 32MX8 NOR type Flash Memory with 133 MHz clock frequency. Operating at 3V, it offers 100000 Write/Erase cycles via SPI serial bus. Ideal for applications requiring high-speed data storage in compact devices.
R-PDSO-G16
10.31 mm
268435456 bit
16
33554432 words
32M
32MX8
SOP16,.4
2.64 mm
.00012 Amp
20 mA
7.49 mm
SOFTWARE
SQF-SMSM4-128G-SBC
Advantech
Advantech's SQF-SMSM4-128G-SBC is a 128GX8 MLC NAND flash module with 137.44TB memory density. It operates in commercial temperature range of 0-70°C, ideal for microelectronic assemblies requiring high-speed serial memory solutions. Measuring 30x50.8 mm, it offers 52 terminals and NO LEAD terminal form for compact designs.
R-XSMA-N52
50.8 mm
52
4.2 mm
NO
COMMERCIAL
SINGLE
MLC NAND TYPE
30 mm
SQF-SMSM2-64G-SBE
Advantech SQF-SMSM2-64G-SBE is a 64GX8 MLC NAND flash module with 52 terminals. It operates in industrial temperature range (-40 to 85°C) and offers high memory density of 549755813888 bits. Ideal for applications requiring reliable serial flash memory storage solutions.
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