Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Memory Density: 16888498602639 bit; Technology: CMOS;
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Corphita
Flash Memory MTFDHBE1T9TDF-1AW12ABYY attributes and parameters. Explore more Flash Memory devices from Micron Technology
JESD-30 Code:
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MTFDHBE1T9TDF-1AW12ABYY Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Packaging - Memory 24-May-2022 Tray 05-May-2022
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
1554216002
Molex
WIRE AND CABLE;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
BAV99
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
2N7002
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
1N4148
Philips Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
2N2222A
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
Transys Electronics
PIC18F4550-I/P
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
MMBT3904-7-F
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
LM317D2TG
Onsemi
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
W25N01GVZEIGTR
Winbond Electronics
W25N01GVZEIGTR by Winbond Electronics is a 1Gx1 SLC NAND flash memory with 1073741824-bit memory density. It operates at up to 104MHz clock frequency, has a supply voltage range of 2.7V to 3.6V, and is suitable for industrial temperature grade applications. The package style is small outline with very thin profile, making it ideal for space-constrained designs requiring high-speed data storage.
W25Q32JVSSIQ
W25Q32JVSSIQ by Winbond Electronics is a 32Mb Flash Memory with 133MHz clock frequency, operating at 3.3V. It features a small outline package and is suitable for industrial applications requiring high-speed synchronous operation. With a memory density of 33554432 bits, it offers reliable performance in various electronic devices.
SST26VF016B-104I/SN
SST26VF016B-104I/SN by Microchip: 16MX1 NOR Flash Memory with 104 MHz clock freq. Ideal for industrial applications, offers 100000 Write/Erase cycles, SPI serial bus type.
S29JL032J70TFI310
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
S25FL064LABNFI040
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE;
IS25LP128-JBLE
Integrated Silicon Solution
IS25LP128-JBLE by Integrated Silicon Solution is a 128Mbit Flash Memory with 133MHz clock frequency, suitable for industrial applications. It features 100K Write/Erase cycles, operates at -40 to 105°C, and supports hardware/software write protection.
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
IS25LP256D-JLLE-TR
IS25LP256D-JLLE-TR by Integrated Silicon Solution is a 32MX8 Flash Memory with 268Mbit density. Operating at 133MHz, it has a supply voltage range of 2.3V to 3.6V and temperature grade of INDUSTRIAL. Ideal for applications requiring high-speed data storage in compact devices like IoT sensors and industrial control systems.
S70FL01GSAGMFI013
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
M25P16-VMW6G
Numonyx
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
W25Q32JVSNIQ
W25Q32JVSNIQ by Winbond Electronics is a 4MX8 flash memory with a memory density of 33554432 bit. It operates at a max clock frequency of 133 MHz and has an industrial temperature grade. This flash memory is commonly used in applications that require high-speed data storage and retrieval.
MTFC16GAPALBH-ITTR
Micron Technology
MTFC16GAPALBH-ITTR by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a thin profile and fine pitch package style suitable for industrial applications. With a temperature range of -40 to 85 °C, it offers high-speed synchronous operation in a compact form factor.
NAND128W3A2BN6E
STMicroelectronics
STMicroelectronics NAND128W3A2BN6E is a 16MX8 SLC NAND flash memory with 1K sectors and 512-word page size. Operating at 3V, it offers industrial-grade temperature range and parallel interface. Ideal for applications requiring high-speed data storage in compact devices.
SST26VF016B-104I/SN-RN
SST26VF016B-104I/SN-RN by Microchip: 16MX1 NOR Flash Memory, 104 MHz clock freq., SPI serial bus. Ideal for industrial applications requiring high-speed synchronous operation and 100000 write/erase cycles. Operating temp range -40 to 85 °C with AEC-Q100 screening level.
S25FL256SAGNFI010
Infineon Technologies
S25FL256SAGNFI010 by Infineon is a NOR flash memory with 64Mx4 organization, operating at 133MHz. It has a small outline package style and can withstand industrial temperatures. Ideal for applications requiring high-speed data storage in compact devices.
SST39SF040-55-4I-NHE-T
SST39SF040-55-4I-NHE-T by Microchip Technology is a 512Kx8 NOR flash memory with 128 sectors, operating at 5V. It features a max access time of 55ns, endurance of 100k cycles, and supports asynchronous operation. Ideal for industrial applications requiring high-speed data storage in a compact chip carrier package.
S25FS512SAGBHI210
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 536870912 bit;
AT45DB081D-SU
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Additional Features: ORGANIZED AS 4096 PAGES OF 264 BYTES EACH;
AT25SF641-SUB-T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Surface Mount: YES;
AT45DB321E-SHF-T
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MTFDHBK1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; No. of Words: 1099511627776 words; Maximum Operating Temperature: 95 Cel; Technology: CMOS;
MTFDHBL128TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Type: TLC NAND TYPE; Terminal Form: BALL;
MTFDHBM1T0TDQ-1AT12ATYY
Micron Technology's MTFDHBM1T0TDQ-1AT12ATYY is a RECTANGULAR flash memory module with 8-bit memory width and 1TX8 organization. Operating in ASYNCHRONOUS mode, it offers high density of 8796093022208 bits for industrial applications at temperatures ranging from -40 to 105°C.
MTFDKCC960TFR-1BC1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Type: TLC NAND TYPE; Terminal Form: UNSPECIFIED; JESD-30 Code: R-XXMA-X;
MTFDHBL512TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Maximum Operating Temperature: 105 Cel; JESD-30 Code: R-XBGA-B;
MTFDDAV480TDS-1AW1ZABYY
FLASH MODULE; No. of Terminals: 75; Package Code: SMA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Surface Mount: NO;
MTFDHBK256TDP-1AT12AIYY
Micron Technology's MTFDHBK256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization and TLC NAND type. Operating in ASYNCHRONOUS mode, it offers a wide temperature range suitable for INDUSTRIAL applications. With MICROELECTRONIC ASSEMBLY package style, this CMOS technology-based device has a memory density of 2199023255552 bit.
MTFDHBL512TDP-1AT12AIYY
MTFDHBL512TDP-1AT12AIYY by Micron Technology is a rectangular flash memory with 512GX8 organization, TLC NAND type, and industrial temperature grade. It operates asynchronously with a wide memory width of 8 bits. Ideal for applications requiring high-density storage in industrial environments.
MTFDHBL256TDP-1AT12AIYY
Micron Technology's MTFDHBL256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization, TLC NAND type. Operating in ASYNCHRONOUS mode, it has an industrial temperature grade of -40 to 95 °C. Ideal for high-density storage applications.
MTFDHBK512TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 95 Cel;
MTFDHBM1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Maximum Operating Temperature: 95 Cel; Memory Width: 8; Terminal Position: BOTTOM;
MTFDHBE7T6TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; No. of Functions: 1; Memory Width: 8;
MTFDHBL064TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Organization: 64GX8; Maximum Operating Temperature: 105 Cel; No. of Words: 68719476736 words;
MTFDCAE001SAF-1D1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Supply Voltage (Vsup): 4.75 V;
MTFDCAE001SAF-1B3
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Organization: 1GX8;
MTFDCAE001SAF-1D1IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; Minimum Operating Temperature: -40 Cel;
MTFDCAE001SAF-1D2
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Width: 26.6 mm; Memory Density: 8589934592 bit;
MTFDCAE001SAF-1B1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Width: 26.6 mm;
MTFDCAE001SAF-1B3IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; No. of Words: 1073741824 words;
MTFDCAE001SAF-1D2IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: NO; Type: SLC NAND TYPE;
Supply Digital Components
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