Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MTFDHBL512TDP-1AT12AIYY by Micron Technology is a rectangular flash memory with 512GX8 organization, TLC NAND type, and industrial temperature grade. It operates asynchronously with a wide memory width of 8 bits. Ideal for applications requiring high-density storage in industrial environments.
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Surface mount technology allows for easy and reliable installation on a circuit board, making this product convenient to use in various electronic devices.
Rectangular package shape ensures compatibility with standard board layouts and facilitates efficient use of space on the board.
Asynchronous operation allows for flexible and independent read and write commands, enhancing the overall performance and versatility of the product.
With a high maximum operating temperature, this product can withstand demanding environmental conditions, making it suitable for industrial applications.
The organization of 512Gx8 provides ample capacity and efficient data storage capability for high-performance devices.
Ability to operate at low temperatures makes this product reliable in harsh environments or extreme conditions.
The terminal finish of tin, silver, and copper ensures good connectivity and resistance to corrosion, extending the product's lifespan.
Bottom terminal position simplifies the integration process and offers a secure connection to the circuit board.
The high peak reflow temperature ensures proper soldering during assembly, contributing to the overall reliability of the product.
Triple-level cell (TLC) NAND technology offers a balance between cost, performance, and durability, making this product a cost-effective and efficient choice for storage solutions.
Industrial temperature grade means this product is designed to operate reliably in challenging industrial environments, making it suitable for rugged applications.
Complementary metal-oxide-semiconductor (CMOS) technology enables low power consumption, high speed, and reliable performance, enhancing the overall efficiency of the product.
Ball terminal form facilitates easy soldering and handling during the assembly process, ensuring a reliable connection on the circuit board.
Large number of words indicates high storage capacity, making this product suitable for applications that require extensive data storage.
Memory width of 8 ensures efficient data transfer and processing, enhancing the overall performance of the product.
The 512G word code correlates with the product's organization, providing a standardized way to manage and access the data stored in the memory.
High memory density offers significant storage capacity within a compact form factor, making this product ideal for space-constrained applications.
The use of Flash memory IC type ensures fast read and write speeds, low power consumption, and reliable data retention, making this product a desirable choice for high-performance applications.
Flash Memory MTFDHBL512TDP-1AT12AIYY attributes and parameters. Explore more Flash Memory devices from Micron Technology
JESD-30 Code:
JESD-609 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Shape:
Peak Reflow Temperature (C):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Type:
MTFDHBL512TDP-1AT12AIYY Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Design/Specification - MTFDH 29-Jul-2022 Memory 24-May-2022 Mult Dev FW Rev 19/Aug/2022
PCN Packaging - Tray 05-May-2022
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
MMBT2907ALT1G
Onsemi
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
Changzhou Starsea Electronics
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ERJ2RKF1002X
Panasonic
Panasonic's ERJ2RKF1002X is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance and operating temperature range of -55 to 155 °C.
1N4148
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
NE555D
Texas Instruments
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
Micro Commercial Components
S25FL512SAGBHI210
Infineon Technologies
S25FL512SAGBHI210 by Infineon Technologies is a 64MX8 NOR type flash memory with 512753664 bit density. It operates at 3V, has a clock frequency of 133 MHz, and offers 100000 write/erase cycles. Ideal for industrial applications requiring high-speed synchronous operation in a compact GRID ARRAY package.
AT45DB641E-MHN2B-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
S29JL032J70TFI420
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
MTFC16GAPALBH-AATTR
Micron Technology
MTFC16GAPALBH-AATTR by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. It operates synchronously at up to 200 MHz clock frequency, suitable for applications requiring high-speed data storage and retrieval. With a thin profile and fine pitch grid array package style, it offers compact design flexibility for various electronic devices.
W25Q128JVEIQ
Winbond Electronics
W25Q128JVEIQ by Winbond Electronics is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type. Operating at 3.3V, it offers 100000 write/erase cycles and industrial temperature grade suitability. Ideal for applications requiring high-speed data storage in compact devices.
SST39VF020-70-4I-WHE
Microchip Technology
SST39VF020-70-4I-WHE by Microchip: 256KX8 NOR Flash Memory with 3V supply, 70ns access time, and 100k Write/Erase cycles. Ideal for industrial applications requiring high-speed data storage in a compact package. Operates asynchronously with 32 terminals in a small outline, thin profile design.
MT25QU128ABA8ESF-0SIT
Micron Technology's MT25QU128ABA8ESF-0SIT is a 128Mbit FLASH memory IC with 166MHz clock frequency, operating at 1.8V. It is used in industrial applications, featuring synchronous operation and a small outline package for compact designs.
AT45DB641E-MHN-T
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words Code: 64M;
MT25QU128ABA1EW7-0SIT
Micron Technology's MT25QU128ABA1EW7-0SIT is a 128M Flash Memory IC with 134217728 bit memory density. Operating at 166 MHz clock frequency, it has a low 0.8 mm seated height and operates in industrial temperature grade applications. With synchronous operation and serial interface, this small outline package is ideal for high-speed data storage needs.
SST25VF080B-50-4I-S2AE-T
SST25VF080B-50-4I-S2AE-T by Microchip Technology is a NOR type Flash Memory with 8Mx1 organization, SPI serial bus type, and 50 MHz clock frequency. It is ideal for industrial applications requiring high endurance with 100000 write/erase cycles and operates in a temperature range of -40 to 85°C.
S29AL016J70BFI020
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Alternate Memory Width: 8;
W25Q256JVEIQ
W25Q256JVEIQ by Winbond Electronics is a NOR flash memory with 32MX8 organization, SPI serial bus type, and 133 MHz clock frequency. It is used in industrial applications for its 100000 write/erase cycles endurance, 3.3V programming voltage, and compact rectangular package style.
S29WS128P0SBFW000
S29WS128P0SBFW000 by Cypress Semiconductor is a NOR type Flash Memory with 8Mx16 organization, 8 sectors of 16K/64K words. Operating at 1.8V, it offers fast access time of 80ns and low standby current of 0.000005Amp. Ideal for applications requiring high-speed data storage in compact devices.
S29AL008J70TFI023
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Power Supplies (V): 3,3.3;
S25FL128SAGNFI001
S25FL128SAGNFI001 by Infineon Technologies is a NOR type flash memory with 32Mx4 organization, operating at up to 133MHz clock frequency. It offers 100000 write/erase cycles and supports SPI serial bus type, making it ideal for industrial applications requiring high endurance and fast data transfer speeds.
S34ML04G100TFI000
Cypress Semiconductor's S34ML04G100TFI000 is a 512MX8 SLC NAND flash memory with 4K sectors and 2K page size. Operating at 3.3V, it offers fast access time of 25ns and low standby current of 0.00005A. Ideal for industrial applications requiring reliable, high-density memory with parallel interface and asynchronous operation.
AT45DB081E-SHN-B
Renesas Electronics
AT45DB081E-SHN-B by Renesas Electronics is a 1MX8 NOR type flash memory with 3-STATE output, operating at up to 133 MHz. It offers 100000 Write/Erase Cycles endurance and operates on a supply voltage range of 2.3V to 3.6V. Ideal for industrial applications requiring high-speed synchronous operation in a compact small outline package.
S25FL128SAGNFI013
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;
AT45DB642D-CNU-SL954
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Maximum Supply Current: 25 mA;
THGBMJG6C1LBAIL
Kioxia Holdings
Kioxia Holdings' THGBMJG6C1LBAIL is an 8GX8 flash memory IC with 68719476736-bit memory density. It operates b/w -25°C to 85°C, with a voltage range of 2.7V to 3.6V. This rectangular GRID ARRAY package is surface-mountable and ideal for applications requiring high-speed data storage in compact devices.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MTFDHBK1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; No. of Words: 1099511627776 words; Maximum Operating Temperature: 95 Cel; Technology: CMOS;
MTFDHBL128TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Type: TLC NAND TYPE; Terminal Form: BALL;
MTFDHBM1T0TDQ-1AT12ATYY
Micron Technology's MTFDHBM1T0TDQ-1AT12ATYY is a RECTANGULAR flash memory module with 8-bit memory width and 1TX8 organization. Operating in ASYNCHRONOUS mode, it offers high density of 8796093022208 bits for industrial applications at temperatures ranging from -40 to 105°C.
MTFDKCC960TFR-1BC1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Type: TLC NAND TYPE; Terminal Form: UNSPECIFIED; JESD-30 Code: R-XXMA-X;
MTFDHBL512TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Maximum Operating Temperature: 105 Cel; JESD-30 Code: R-XBGA-B;
MTFDDAV480TDS-1AW1ZABYY
FLASH MODULE; No. of Terminals: 75; Package Code: SMA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Surface Mount: NO;
MTFDHBK256TDP-1AT12AIYY
Micron Technology's MTFDHBK256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization and TLC NAND type. Operating in ASYNCHRONOUS mode, it offers a wide temperature range suitable for INDUSTRIAL applications. With MICROELECTRONIC ASSEMBLY package style, this CMOS technology-based device has a memory density of 2199023255552 bit.
MTFDHBL256TDP-1AT12AIYY
Micron Technology's MTFDHBL256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization, TLC NAND type. Operating in ASYNCHRONOUS mode, it has an industrial temperature grade of -40 to 95 °C. Ideal for high-density storage applications.
MTFDHBK512TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 95 Cel;
MTFDHBM1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Maximum Operating Temperature: 95 Cel; Memory Width: 8; Terminal Position: BOTTOM;
MTFDHBE7T6TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; No. of Functions: 1; Memory Width: 8;
MTFDHBL064TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Organization: 64GX8; Maximum Operating Temperature: 105 Cel; No. of Words: 68719476736 words;
MTFDCAE001SAF-1D1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Supply Voltage (Vsup): 4.75 V;
MTFDCAE001SAF-1B3
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Organization: 1GX8;
MTFDCAE001SAF-1D1IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; Minimum Operating Temperature: -40 Cel;
MTFDCAE001SAF-1D2
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Width: 26.6 mm; Memory Density: 8589934592 bit;
MTFDCAE001SAF-1B1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Width: 26.6 mm;
MTFDCAE001SAF-1B3IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; No. of Words: 1073741824 words;
MTFDCAE001SAF-1D2IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: NO; Type: SLC NAND TYPE;
Supply Digital Components
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