Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MTFDHBL512TDP-1AT12AIYY by Micron Technology is a rectangular flash memory with 512GX8 organization, TLC NAND type, and industrial temperature grade. It operates asynchronously with a wide memory width of 8 bits. Ideal for applications requiring high-density storage in industrial environments.
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Surface mount technology allows for easy and reliable installation on a circuit board, making this product convenient to use in various electronic devices.
Rectangular package shape ensures compatibility with standard board layouts and facilitates efficient use of space on the board.
Asynchronous operation allows for flexible and independent read and write commands, enhancing the overall performance and versatility of the product.
With a high maximum operating temperature, this product can withstand demanding environmental conditions, making it suitable for industrial applications.
The organization of 512Gx8 provides ample capacity and efficient data storage capability for high-performance devices.
Ability to operate at low temperatures makes this product reliable in harsh environments or extreme conditions.
The terminal finish of tin, silver, and copper ensures good connectivity and resistance to corrosion, extending the product's lifespan.
Bottom terminal position simplifies the integration process and offers a secure connection to the circuit board.
The high peak reflow temperature ensures proper soldering during assembly, contributing to the overall reliability of the product.
Triple-level cell (TLC) NAND technology offers a balance between cost, performance, and durability, making this product a cost-effective and efficient choice for storage solutions.
Industrial temperature grade means this product is designed to operate reliably in challenging industrial environments, making it suitable for rugged applications.
Complementary metal-oxide-semiconductor (CMOS) technology enables low power consumption, high speed, and reliable performance, enhancing the overall efficiency of the product.
Ball terminal form facilitates easy soldering and handling during the assembly process, ensuring a reliable connection on the circuit board.
Large number of words indicates high storage capacity, making this product suitable for applications that require extensive data storage.
Memory width of 8 ensures efficient data transfer and processing, enhancing the overall performance of the product.
The 512G word code correlates with the product's organization, providing a standardized way to manage and access the data stored in the memory.
High memory density offers significant storage capacity within a compact form factor, making this product ideal for space-constrained applications.
The use of Flash memory IC type ensures fast read and write speeds, low power consumption, and reliable data retention, making this product a desirable choice for high-performance applications.
Flash Memory MTFDHBL512TDP-1AT12AIYY attributes and parameters. Explore more Flash Memory devices from Micron Technology
JESD-30 Code:
JESD-609 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Shape:
Peak Reflow Temperature (C):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Type:
MTFDHBL512TDP-1AT12AIYY Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Design/Specification - MTFDH 29-Jul-2022 Memory 24-May-2022 Mult Dev FW Rev 19/Aug/2022
PCN Packaging - Tray 05-May-2022
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
LM317BD2TG
Onsemi
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
BAV99
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Changzhou Galaxy Century Microelectronics
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LL4148
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OPA2277UA/2K5
Texas Instruments
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
Surge Components
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
Telcom Semiconductor
Fairchild Semiconductor
Weitron Technology
SST25VF016B-50-4I-S2AF
Silicon Storage Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2;
MTFC4GACAJCN-4MITTR
Micron Technology
Micron Technology's MTFC4GACAJCN-4MITTR is a 4GX8 MLC NAND flash memory with 34359738368-bit density. Operating at up to 52 MHz, it features a very thin profile and fine pitch grid array package suitable for industrial applications. With a wide temperature range (-40 to 85 °C), this synchronous memory offers high performance in compact dimensions.
AT45DB161E-SSHD2B-T
Atmel
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
MT25QL512ABB1EW9-0SIT
Micron Technology's MT25QL512ABB1EW9-0SIT is a 512Mx1 flash memory with synchronous operation, 133 MHz clock frequency, and 3V programming voltage. Ideal for industrial applications, it offers a memory density of 536870912 bits in a small outline package with a max temperature of 85°C.
S25FL128SAGMFI000
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 7.5 mm;
Microchip Technology
SST25VF016B-50-4I-S2AF by Microchip: 16MX1 NOR Flash Memory with 50 MHz clock, SPI serial bus. Ideal for industrial applications, offers 100000 Write/Erase cycles and operates at -40 to 85 °C.
SDINBDG4-8G
Western Digital
SDINBDG4-8G by Western Digital is a flash memory with 8GX8 organization, MLC NAND type, and 3000 write/erase cycles. It operates in synchronous mode at 3.3V, suitable for applications requiring high memory density and endurance like embedded systems or IoT devices.
S29JL064J55TFI000
S29JL064J55TFI000 by Infineon Technologies is a NOR type flash memory with 4MX16 organization, operating at 3V. It features a small outline package with 48 terminals and offers fast access time of 55ns. Ideal for industrial applications requiring high-density memory storage in compact devices.
ASFC4G31M-51BIN
Alliance Memory
FLASH CARD;
AT45DB321E-SHFHC-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SST26VF016-80-5I-S2AE
SST26VF016-80-5I-S2AE by Microchip is a 16Mx1 NOR flash memory with 80MHz clock frequency, SPI serial bus, and 100K endurance cycles. It operates at -40 to 85°C for industrial applications, featuring software write protection and 3-state output. The small outline package has dual terminals and measures 5.275mm in length and width.
AT45DB641E-SHN-B
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 2.3;
W25Q64JVSSIQTR
Winbond Electronics
W25Q64JVSSIQTR by Winbond Electronics is a NOR type flash memory with 8MX8 organization, 133 MHz clock frequency, and 3.3V programming voltage. It is ideal for applications requiring high-speed synchronous operation, such as automotive electronics and industrial control systems.
S29AL008J70TFI023
Infineon's S29AL008J70TFI023 is a 512Kx16 NOR flash memory with 85°C max temp, 3.6V max supply, and 70ns access time. Ideal for industrial applications requiring fast data polling and common flash interface support in a compact package.
WDS400T2B0A
WDS400T2B0A by Western Digital is a 4TB flash memory with 8-bit memory width and CMOS technology. It operates b/w 0-70°C, ideal for commercial applications requiring high memory density. With a compact size of 100.2mm x 69.85mm x 7mm, it suits microelectronic assemblies needing reliable NAND type storage.
S29AL016J70BFI020
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
S29AL008J70TFI013
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
AT45DB021E-SSHN-T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
S25FL128SAGNFI010
S25FL128SAGNFI010 by Infineon Technologies is a NOR type flash memory with 32Mx4 organization and 133MHz clock frequency. It operates at 3V, has SPI serial bus, and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact form factors.
SST39SF040-70-4C-NHE
SST39SF040-70-4C-NHE by Microchip Technology is a 512Kx8 NOR flash memory chip with 128 sectors and 524,288 words. Operating at 5V, it offers a max access time of 70ns and endurance of 100,000 write/erase cycles. Ideal for applications requiring high-speed data storage in commercial-grade environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MTFDHBK1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; No. of Words: 1099511627776 words; Maximum Operating Temperature: 95 Cel; Technology: CMOS;
MTFDHBL128TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Type: TLC NAND TYPE; Terminal Form: BALL;
MTFDHBM1T0TDQ-1AT12ATYY
Micron Technology's MTFDHBM1T0TDQ-1AT12ATYY is a RECTANGULAR flash memory module with 8-bit memory width and 1TX8 organization. Operating in ASYNCHRONOUS mode, it offers high density of 8796093022208 bits for industrial applications at temperatures ranging from -40 to 105°C.
MTFDKCC960TFR-1BC1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Type: TLC NAND TYPE; Terminal Form: UNSPECIFIED; JESD-30 Code: R-XXMA-X;
MTFDHBL512TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Maximum Operating Temperature: 105 Cel; JESD-30 Code: R-XBGA-B;
MTFDDAV480TDS-1AW1ZABYY
FLASH MODULE; No. of Terminals: 75; Package Code: SMA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Surface Mount: NO;
MTFDHBK256TDP-1AT12AIYY
Micron Technology's MTFDHBK256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization and TLC NAND type. Operating in ASYNCHRONOUS mode, it offers a wide temperature range suitable for INDUSTRIAL applications. With MICROELECTRONIC ASSEMBLY package style, this CMOS technology-based device has a memory density of 2199023255552 bit.
MTFDHBL256TDP-1AT12AIYY
Micron Technology's MTFDHBL256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization, TLC NAND type. Operating in ASYNCHRONOUS mode, it has an industrial temperature grade of -40 to 95 °C. Ideal for high-density storage applications.
MTFDHBK512TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 95 Cel;
MTFDHBM1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Maximum Operating Temperature: 95 Cel; Memory Width: 8; Terminal Position: BOTTOM;
MTFDHBE7T6TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; No. of Functions: 1; Memory Width: 8;
MTFDHBL064TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Organization: 64GX8; Maximum Operating Temperature: 105 Cel; No. of Words: 68719476736 words;
MTFDCAE001SAF-1D1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Supply Voltage (Vsup): 4.75 V;
MTFDCAE001SAF-1B3
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Organization: 1GX8;
MTFDCAE001SAF-1D1IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; Minimum Operating Temperature: -40 Cel;
MTFDCAE001SAF-1D2
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Width: 26.6 mm; Memory Density: 8589934592 bit;
MTFDCAE001SAF-1B1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Width: 26.6 mm;
MTFDCAE001SAF-1B3IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; No. of Words: 1073741824 words;
MTFDCAE001SAF-1D2IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: NO; Type: SLC NAND TYPE;
Supply Digital Components
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