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MTFDHBL128TDP-1AT12AIYY

Micron Technology

MTFDHBL128TDP-1AT12AIYY by Micron Technology

Micron Technology's MTFDHBL128TDP-1AT12AIYY is a RECTANGULAR flash memory with 128GX8 organization and TLC NAND type. Operating in ASYNCHRONOUS mode, it has an industrial temperature grade of -40 to 95 °C, making it suitable for high-performance applications.

Median Price

$90.375

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$6.669

100+ parts

$6.069

1k+ parts

$5.469

10k+ parts

-

3,000

$6.669

$6.069

$5.469

-

Verical

USA . 20 parts In-Stock

1+ parts

$69.305

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$69.305

-

-

-

Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$89.030

100+ parts

$67.190

1k+ parts

-

10k+ parts

-

7

$89.030

$67.190

-

-

DigiKey

USA . 469 parts In-Stock

1+ parts

$91.720

100+ parts

$79.057

1k+ parts

$69.214

10k+ parts

-

469

$91.720

$79.057

$69.214

-

Farnell

UK . 2 parts In-Stock

1+ parts

$99.661

100+ parts

$84.331

1k+ parts

-

10k+ parts

-

2

$99.661

$84.331

-

-

Element14

Singapore . 2 parts In-Stock

1+ parts

$109.963

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$109.963

-

-

-

Edge Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 472 parts In-Stock

1+ parts

$6.336

100+ parts

-

1k+ parts

-

10k+ parts

-

472

$6.336

-

-

-

Vyrian

USA . 4,152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,152

-

-

-

-

Chip Stock

USA . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

280

-

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Martec Srl

Italy . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 6,274 parts In-Stock

1+ parts

$2.153

100+ parts

-

1k+ parts

-

10k+ parts

-

6,274

$2.153

-

-

-

Corohmni

South Africa . 535 parts In-Stock

1+ parts

$5.571

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$5.571

-

-

-

Ampacity Inc.

Singapore . 438 parts In-Stock

1+ parts

$5.670

100+ parts

-

1k+ parts

-

10k+ parts

-

438

$5.670

-

-

-

Semicontronic

India . 116 parts In-Stock

1+ parts

$5.670

100+ parts

$5.528

1k+ parts

$5.500

10k+ parts

-

116

$5.670

$5.528

$5.500

-

Corphita

USA . 739 parts In-Stock

1+ parts

$6.002

100+ parts

-

1k+ parts

-

10k+ parts

-

739

$6.002

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$6.669

100+ parts

$6.069

1k+ parts

$5.469

10k+ parts

-

3,000

$6.669

$6.069

$5.469

-

Continental Prestige Electronics

USA . 4 parts In-Stock

1+ parts

$78.790

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$78.790

-

-

-

Component Stockers USA

USA . 1,390 parts In-Stock

1+ parts

$78.940

100+ parts

$65.140

1k+ parts

-

10k+ parts

-

1,390

$78.940

$65.140

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Argo Parts USA

USA . 2,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,382

-

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Experience the ultimate reliability and performance with the MTFDHBL128TDP-1AT12AIYY by Micron Technology. As a leader in flash memory technology, Micron delivers cutting-edge solutions that are perfect for a wide range of applications. Whether you need high-speed data storage or reliable memory solutions, this product offers exceptional value and benefits. Trust Micron Technology to provide you with top-notch quality, advanced technology, and unparalleled customer satisfaction. Choose Micron for all your flash memory needs and experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, making this product suitable for compact electronic devices with limited space.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor for easy integration into various electronic systems.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent read and write processes, improving overall system performance and flexibility.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, this product is suitable for industrial applications where thermal management is critical.

Organization: 128GX8

Organized as 128 gigabits by 8, this product offers high storage capacity and data transfer efficiency.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB layout and connection, enhancing the overall reliability and durability of the product.

Type: TLC NAND TYPE

Triple-Level Cell (TLC) NAND technology offers a balance between cost and performance, making this product a cost-effective solution for storage applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperatures, this product is reliable and durable under extreme conditions, making it ideal for industrial and automotive applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high-speed operation, improving the efficiency and performance of the product.

Terminal Form: BALL

Ball terminal form ensures reliable electrical connections and simplifies the installation process, making this product user-friendly and easy to integrate.

No. of Words: 137438953472 words

With a high number of words, this product offers expansive storage capacity for data-intensive applications, making it suitable for high-performance computing and storage systems.

Memory Width: 8

8-bit memory width allows for efficient data transfer and processing, making this product suitable for high-speed data applications and systems.

No. of Words Code: 128G

128 gigabits per word code ensures high data density and storage efficiency, making this product ideal for applications requiring large amounts of data storage.

Memory Density: 1099511627776 bit

With high memory density, this product offers large storage capacity in a compact form factor, making it suitable for space-constrained applications.

Memory IC Type: FLASH MODULE

Flash memory technology provides high-speed read and write operations, low power consumption, and robust data retention, making this product an excellent choice for storage and data transfer applications.

Technical Specifications

Flash Memory MTFDHBL128TDP-1AT12AIYY attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

JESD-30 Code:

R-XBGA-B

Memory Density:

1099511627776 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

137438953472 words

No. of Words Code:

128G

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128GX8

Package Body Material:

UNSPECIFIED

Package Shape:

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Position:

BOTTOM

Type:

TLC NAND TYPE

Trade Compliance

MTFDHBL128TDP-1AT12AIYY Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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