Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Micron Technology's MTFDHBL128TDP-1AT12AIYY is a RECTANGULAR flash memory with 128GX8 organization and TLC NAND type. Operating in ASYNCHRONOUS mode, it has an industrial temperature grade of -40 to 95 °C, making it suitable for high-performance applications.
Median Price
$89.030
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1k+
Adafruit Industries
1+ parts
$6.669
100+ parts
$6.069
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$5.469
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Verical
$69.305
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$67.190
Farnell
$99.661
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Element14
$109.963
Edge Electronics
Digiode
$6.336
Chip Stock
Vyrian
Nova Conductors
Martec Srl
Aztec Data Supply Inc.
$2.153
Corohmni
$5.571
Ampacity Inc.
$5.670
Semicontronic
$5.528
$5.500
Corphita
$6.002
Advanced Electronics
Continental Prestige Electronics
$78.790
Component Stockers USA
$78.940
$65.140
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Argo Parts USA
Bastille Electronics
Surface mount technology allows for easy and efficient installation on PCBs, making this product suitable for compact electronic devices with limited space.
Rectangular package shape provides a standardized form factor for easy integration into various electronic systems.
Asynchronous operation allows for independent read and write processes, improving overall system performance and flexibility.
With a high maximum operating temperature, this product is suitable for industrial applications where thermal management is critical.
Organized as 128 gigabits by 8, this product offers high storage capacity and data transfer efficiency.
With a low minimum operating temperature, this product can withstand harsh environmental conditions, making it suitable for a wide range of applications.
Bottom terminal position allows for easy PCB layout and connection, enhancing the overall reliability and durability of the product.
Triple-Level Cell (TLC) NAND technology offers a balance between cost and performance, making this product a cost-effective solution for storage applications.
Designed for industrial-grade temperatures, this product is reliable and durable under extreme conditions, making it ideal for industrial and automotive applications.
Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high-speed operation, improving the efficiency and performance of the product.
Ball terminal form ensures reliable electrical connections and simplifies the installation process, making this product user-friendly and easy to integrate.
With a high number of words, this product offers expansive storage capacity for data-intensive applications, making it suitable for high-performance computing and storage systems.
8-bit memory width allows for efficient data transfer and processing, making this product suitable for high-speed data applications and systems.
128 gigabits per word code ensures high data density and storage efficiency, making this product ideal for applications requiring large amounts of data storage.
With high memory density, this product offers large storage capacity in a compact form factor, making it suitable for space-constrained applications.
Flash memory technology provides high-speed read and write operations, low power consumption, and robust data retention, making this product an excellent choice for storage and data transfer applications.
Flash Memory MTFDHBL128TDP-1AT12AIYY attributes and parameters. Explore more Flash Memory devices from Micron Technology
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Shape:
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
Type:
MTFDHBL128TDP-1AT12AIYY Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Design/Specification - MTFDH 29-Jul-2022 Memory 24-May-2022 Mult Dev FW Rev 19/Aug/2022
PCN Packaging - Tray 05-May-2022
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
1N4148
Baneasa S A
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
Allegro MicroSystems
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
BAV99
Taitron Components
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
Eic Semiconductor
BSS138W-7-F
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
IS25LQ040B-JNLE
Integrated Silicon Solution
IS25LQ040B-JNLE by Integrated Silicon Solution is a 4Mx1 Flash Memory with 104MHz clock frequency, operating at -40 to 105°C. It has a supply voltage range of 2.3V to 3.6V and is ideal for industrial applications requiring high-speed synchronous operation in a small outline package.
SST39VF1681-70-4C-EKE
Microchip Technology
SST39VF1681-70-4C-EKE by Microchip: NOR flash memory, 2Mx8 organization, 512 sectors of 4K words each. Ideal for commercial applications requiring fast access time (70ns) and endurance of 100k write/erase cycles. Operates at 3V with low standby current (0.00002A) and supports asynchronous mode.
S29GL064S70TFI030
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
S26KS512SDPBHM020
Infineon Technologies
Infineon's S26KS512SDPBHM020 is a 64MX8 Flash Memory with 536870912 bit memory density. Operating at 1.8V, it offers synchronous mode and parallel interface for fast access time of 96ns. Ideal for automotive applications due to AEC-Q100 screening and TS16949 certification.
S25FL128SAGMFIG01
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
S34ML01G200TFI000
Skyhigh Memory
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
XCF04SVOG20C
Xilinx
Xilinx XCF04SVOG20C is a 4MX1 NOR flash memory with 4194304-bit density. Operating at 3.3V, it offers 20000 write/erase cycles and supports synchronous mode up to 33MHz clock frequency. Ideal for configuration memory in applications requiring high endurance and low standby current.
SST25WF080B-40I/SN
SST25WF080B-40I/SN by Microchip: 8MX1 organization, 40MHz clock frequency, SPI serial bus type. Ideal for industrial applications requiring 8388608-bit memory density and 100000 write/erase cycles endurance.
SDINBDG4-32G-I1
Sandisk
FLASH CARD; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Data Retention Time: 1; Maximum Operating Temperature: 85 Cel;
S29JL032J70TFI420
Infineon's S29JL032J70TFI420 is a 3V NOR flash memory with 2MX16 organization, operating at -40 to 85°C. It features synchronous operation, 8K/64K sector size, and parallel interface. Ideal for industrial applications requiring fast access times and low standby current.
AT25SF041-SSHD-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1;
SST25VF040B-50-4I-SAE-T
SST25VF040B-50-4I-SAE-T by Microchip: 50MHz clock freq, 4194304-bit memory density, SPI serial bus. Ideal for industrial applications requiring high-speed data transfer and reliable flash memory storage.
SST26VF064B-104I/MF
SST26VF064B-104I/MF by Microchip: NOR flash memory with 64Mx1 organization, SPI serial bus type, and 104 MHz clock frequency. Ideal for industrial applications requiring high endurance with 100K write/erase cycles and operating temperature range of -40 to 85°C.
MT29F128G08AJAAAWP-ITZ:A
Micron Technology
Micron Technology's MT29F128G08AJAAAWP-ITZ:A is a 3.3V MLC NAND Flash Memory with 16GX8 organization, operating from -40 to 85 °C. It has a memory density of 137.4Gb and is suitable for industrial applications requiring high-speed parallel data storage.
S25FL256SAGBHVB00
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SST25VF080B-50-4C-S2AF-T
SST25VF080B-50-4C-S2AF-T by Microchip Technology is a 8M NOR Flash Memory with 8388608 bit density. Operating at 3/3.3V, it supports SPI serial bus type and offers 100000 Write/Erase cycles. Ideal for applications requiring high-speed synchronous operation and small outline package style.
M25P128-VMF6TPB
M25P128-VMF6TPB by Micron Technology is a 16MX8 NOR type flash memory with 134217728 bit density. It operates at 3V, has a clock frequency of 50 MHz, and offers 10000 write/erase cycles. Ideal for industrial applications requiring high-speed data storage in compact devices.
S29GL512T10TFI020
S29GL512T10TFI020 by Infineon Technologies is a 32MX16 flash memory with 536870912 bit density. It operates at 3V, has 100 ns access time, and supports parallel mode. Ideal for industrial applications requiring high-speed data storage in compact devices.
S29GL256P10TFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HTSSOP; Package Shape: RECTANGULAR; Sector Size (Words): 128K;
MT29F16G08ABACAWP-AAT:C
MT29F16G08ABACAWP-AAT:C by Micron Technology is a 3.3V SLC NAND Flash Memory with 2GX8 organization, 4K page size, and 80000 Write/Erase cycles. It operates in asynchronous mode, has a max temperature of 105°C, and is suitable for applications requiring high endurance and fast access times.
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MTFDHBK1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; No. of Words: 1099511627776 words; Maximum Operating Temperature: 95 Cel; Technology: CMOS;
MTFDHBM1T0TDQ-1AT12ATYY
Micron Technology's MTFDHBM1T0TDQ-1AT12ATYY is a RECTANGULAR flash memory module with 8-bit memory width and 1TX8 organization. Operating in ASYNCHRONOUS mode, it offers high density of 8796093022208 bits for industrial applications at temperatures ranging from -40 to 105°C.
MTFDKCC960TFR-1BC1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Type: TLC NAND TYPE; Terminal Form: UNSPECIFIED; JESD-30 Code: R-XXMA-X;
MTFDHBL512TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Maximum Operating Temperature: 105 Cel; JESD-30 Code: R-XBGA-B;
MTFDDAV480TDS-1AW1ZABYY
FLASH MODULE; No. of Terminals: 75; Package Code: SMA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Surface Mount: NO;
MTFDHBK256TDP-1AT12AIYY
Micron Technology's MTFDHBK256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization and TLC NAND type. Operating in ASYNCHRONOUS mode, it offers a wide temperature range suitable for INDUSTRIAL applications. With MICROELECTRONIC ASSEMBLY package style, this CMOS technology-based device has a memory density of 2199023255552 bit.
MTFDHBL512TDP-1AT12AIYY
MTFDHBL512TDP-1AT12AIYY by Micron Technology is a rectangular flash memory with 512GX8 organization, TLC NAND type, and industrial temperature grade. It operates asynchronously with a wide memory width of 8 bits. Ideal for applications requiring high-density storage in industrial environments.
MTFDHBL256TDP-1AT12AIYY
Micron Technology's MTFDHBL256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization, TLC NAND type. Operating in ASYNCHRONOUS mode, it has an industrial temperature grade of -40 to 95 °C. Ideal for high-density storage applications.
MTFDHBK512TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 95 Cel;
MTFDHBM1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Maximum Operating Temperature: 95 Cel; Memory Width: 8; Terminal Position: BOTTOM;
MTFDHBE7T6TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; No. of Functions: 1; Memory Width: 8;
MTFDHBL064TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Organization: 64GX8; Maximum Operating Temperature: 105 Cel; No. of Words: 68719476736 words;
MTFDCAE001SAF-1D1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Supply Voltage (Vsup): 4.75 V;
MTFDCAE001SAF-1B3
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Organization: 1GX8;
MTFDCAE001SAF-1D1IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; Minimum Operating Temperature: -40 Cel;
MTFDCAE001SAF-1D2
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Width: 26.6 mm; Memory Density: 8589934592 bit;
MTFDCAE001SAF-1B1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Width: 26.6 mm;
MTFDCAE001SAF-1B3IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; No. of Words: 1073741824 words;
MTFDCAE001SAF-1D2IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: NO; Type: SLC NAND TYPE;
Supply Digital Components
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