Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Width: 8; Package Body Material: UNSPECIFIED; Technology: CMOS;
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Flash Memory MTFDHBE1T9TDF-1AW4ZABYY attributes and parameters. Explore more Flash Memory devices from Micron Technology
JESD-30 Code:
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MTFDHBE1T9TDF-1AW4ZABYY Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Packaging - Memory 24-May-2022 Tray 05-May-2022
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
1N4148
Baneasa S A
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
2N7002
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bkc Semiconductors
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Comchip Technology
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
Changzhou Galaxy Century Microelectronics
ULN2803ADWG4
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
SST39SF010A-70-4C-NHE
Silicon Storage Technology
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Toggle Bit: YES;
SST39VF1601-70-4C-B3KE
Microchip Technology
SST39VF1601-70-4C-B3KE by Microchip Technology is a 16Mbit NOR flash memory with a rectangular package and a package style of grid array. It operates asynchronously at a nominal voltage of 3V and has a max operating temperature of 70°C. This flash memory is commonly used in applications that require high-density storage and fast access times.
S29GL064S70BHI040
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 4MX16;
M25P16-VMW6G
Numonyx
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
W25Q16JVUXIQ
Winbond Electronics
W25Q16JVUXIQ by Winbond Electronics is a 16Mb Flash Memory with synchronous operation, 2Mx8 organization, and 133MHz clock frequency. Ideal for industrial applications requiring high-speed data storage in a compact package.
AT45DB161E-SSHD-B
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 16M;
S25FL256SAGMFI001
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
AM29F400BT-90EF
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
W25Q64JVSSIQ
W25Q64JVSSIQ by Winbond Electronics is a NOR type flash memory with 8Mx8 organization, SPI serial bus type, and 133MHz clock frequency. It operates at 3.3V with 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact devices.
Infineon Technologies
S29GL064S70BHI040 by Infineon Technologies is a 4MX16 NOR flash memory with 8K/64K sector size and 4194304 words capacity. Operating at -40 to 85 °C, it offers 100000 write/erase cycles endurance and has a max access time of 70 ns. Ideal for industrial applications requiring high-speed data storage in compact devices.
N25Q128A13EF840F
Micron Technology
N25Q128A13EF840F by Micron Technology is a NOR type flash memory with 128Mx1 organization, operating at 3V with 108MHz clock frequency. It features hardware/software write protection and SPI serial bus type, suitable for industrial applications requiring high endurance of 100000 Write/Erase cycles.
SST26VF032B-104I/MF
SST26VF032B-104I/MF by Microchip Technology is a 32Mb NOR Flash Memory with SPI interface, operating at 104MHz clock frequency. It offers 100000 Write/Erase cycles endurance and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring high-speed data transfer and reliable non-volatile memory storage.
AT45DB081E-SSHN-T
Renesas Electronics
Renesas Electronics AT45DB081E-SSHN-T is a 1MX8 NOR Flash Memory with 3.9mm width, SPI serial bus type, and 133MHz clock frequency. Ideal for industrial applications requiring high endurance of 100K write/erase cycles in a compact small outline package.
AT45DB161E-SSHD2B-T
Silicon Labs
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
SST26VF064B-104V/SM
SST26VF064B-104V/SM by Microchip: 64MX1 Flash Memory with 104 MHz clock freq. Ideal for industrial applications, offers 100000 Write/Erase cycles, SPI serial bus type, and operates at -40 to 105 °C.
S29GL256P90TFIR20
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HTSSOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
S29GL128S90TFI023
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
SDINBDG4-8G
Western Digital
SDINBDG4-8G by Western Digital is a flash memory with 8GX8 organization, MLC NAND type, and 3000 write/erase cycles. It operates in synchronous mode at 3.3V, suitable for applications requiring high memory density and endurance like embedded systems or IoT devices.
AM29F400BT-90ED
Spansion's AM29F400BT-90ED is a 256Kx16 NOR flash memory with 4194304-bit density. Operating at 5V, it offers fast access time of 90ns and endurance of 1M cycles. Ideal for applications requiring high-speed data storage in commercial-grade environments.
S25FL128SAGMFI001
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
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MTFDHBK1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; No. of Words: 1099511627776 words; Maximum Operating Temperature: 95 Cel; Technology: CMOS;
MTFDHBL128TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Type: TLC NAND TYPE; Terminal Form: BALL;
MTFDHBM1T0TDQ-1AT12ATYY
Micron Technology's MTFDHBM1T0TDQ-1AT12ATYY is a RECTANGULAR flash memory module with 8-bit memory width and 1TX8 organization. Operating in ASYNCHRONOUS mode, it offers high density of 8796093022208 bits for industrial applications at temperatures ranging from -40 to 105°C.
MTFDKCC960TFR-1BC1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Type: TLC NAND TYPE; Terminal Form: UNSPECIFIED; JESD-30 Code: R-XXMA-X;
MTFDHBL512TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Maximum Operating Temperature: 105 Cel; JESD-30 Code: R-XBGA-B;
MTFDDAV480TDS-1AW1ZABYY
FLASH MODULE; No. of Terminals: 75; Package Code: SMA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Surface Mount: NO;
MTFDHBK256TDP-1AT12AIYY
Micron Technology's MTFDHBK256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization and TLC NAND type. Operating in ASYNCHRONOUS mode, it offers a wide temperature range suitable for INDUSTRIAL applications. With MICROELECTRONIC ASSEMBLY package style, this CMOS technology-based device has a memory density of 2199023255552 bit.
MTFDHBL512TDP-1AT12AIYY
MTFDHBL512TDP-1AT12AIYY by Micron Technology is a rectangular flash memory with 512GX8 organization, TLC NAND type, and industrial temperature grade. It operates asynchronously with a wide memory width of 8 bits. Ideal for applications requiring high-density storage in industrial environments.
MTFDHBL256TDP-1AT12AIYY
Micron Technology's MTFDHBL256TDP-1AT12AIYY is a RECTANGULAR flash memory with 256GX8 organization, TLC NAND type. Operating in ASYNCHRONOUS mode, it has an industrial temperature grade of -40 to 95 °C. Ideal for high-density storage applications.
MTFDHBK512TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 95 Cel;
MTFDHBM1T0TDP-1AT12AIYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Maximum Operating Temperature: 95 Cel; Memory Width: 8; Terminal Position: BOTTOM;
MTFDHBE7T6TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; No. of Functions: 1; Memory Width: 8;
MTFDHBL064TDQ-1AT12ATYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Organization: 64GX8; Maximum Operating Temperature: 105 Cel; No. of Words: 68719476736 words;
MTFDCAE001SAF-1D1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Supply Voltage (Vsup): 4.75 V;
MTFDCAE001SAF-1B3
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Organization: 1GX8;
MTFDCAE001SAF-1D1IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; Minimum Operating Temperature: -40 Cel;
MTFDCAE001SAF-1D2
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Width: 26.6 mm; Memory Density: 8589934592 bit;
MTFDCAE001SAF-1B1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Width: 26.6 mm;
MTFDCAE001SAF-1B3IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; No. of Words: 1073741824 words;
MTFDCAE001SAF-1D2IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: NO; Type: SLC NAND TYPE;
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