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XCZU7EG-2FFVC1156I

Xilinx

XCZU7EG-2FFVC1156I by Xilinx

XCZU7EG-2FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

Median Price

$4,854.260

Lifecycle Status

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Nova Conductors

Japan . 150 parts In-Stock

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AZTECH Wire

Italy . 478 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Modulus Dynamics

Lithuania . 286 parts In-Stock

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Semicontronic

India . 222 parts In-Stock

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$31.200

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MARBEL Systems

Belgium . 500 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Corohmni

South Africa . 122 parts In-Stock

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Qasali Group International

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Microchip USA

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Netroflash

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Supply Digital

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Vigor

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Overview

Discover the power of innovation with the XCZU7EG-2FFVC1156I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that excel in performance and reliability. This versatile microprocessor circuit is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're designing cutting-edge electronics or optimizing industrial systems, this product will elevate your projects to new heights. Experience the advantages of Xilinx technology and unlock endless possibilities with the XCZU7EG-2FFVC1156I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and resistance to environmental factors, making the product suitable for various application environments.

Surface Mount: YES

Surface mount technology allows for efficient and space-saving PCB assembly, enhancing the overall compactness and functionality of the product.

Maximum Supply Voltage: 0.876 V

The maximum supply voltage of 0.876 V ensures safe and stable operation within specified limits, preventing potential damage to the product or connected components.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy integration into PCB designs, optimizing space utilization and overall layout efficiency.

No. of Terminals: 1156

A high number of terminals allow for versatile connectivity options, enabling the product to support a wide range of functions and interfaces.

Package Style (Meter): GRID ARRAY

Grid array package style offers enhanced mechanical stability and electrical performance, ensuring reliable operation in demanding application scenarios.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures the product's suitability for use in extreme cold environments without compromising functionality or performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability, maintaining reliable electrical connections for extended product life.

Technology: CMOS

CMOS technology offers low power consumption, high-speed operation, and compatibility with various digital systems, making the product energy-efficient and versatile in application.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V ensures stable and efficient power delivery to the product, optimizing performance and reducing energy consumption.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EG-2FFVC1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EG-2FFVC1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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