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XCZU5EV-2FBVB900I

Xilinx

XCZU5EV-2FBVB900I by Xilinx

The Xilinx XCZU5EV-2FBVB900I is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w -40 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.

Median Price

$3,912.640

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Mouser Electronics

USA . 2 parts In-Stock

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Digiode

USA . 183 parts In-Stock

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$3,717.008

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Nova Conductors

Japan . 47 parts In-Stock

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VNN

France . 766 parts In-Stock

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AZTECH Wire

Italy . 549 parts In-Stock

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MARBEL Systems

Belgium . 100 parts In-Stock

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Texas Native Microelectronics

USA . 733 parts In-Stock

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Modulus Dynamics

Lithuania . 866 parts In-Stock

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Kenton Components

USA . 50 parts In-Stock

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Corohmni

South Africa . 53 parts In-Stock

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Microchip USA

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One Stop Electronics

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Ampacity Inc.

Singapore . 2 parts In-Stock

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Semicontronic

India . 2 parts In-Stock

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$3,225.968

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Corphita

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Continental Prestige Electronics

USA . 6,271 parts In-Stock

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Argo Parts USA

USA . 2,904 parts In-Stock

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$3,802.429

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$3,764.021

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$3,725.612

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Netroflash

USA . 100 parts In-Stock

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$3,648.796

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$3,571.979

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Authorized Procurement Solutions

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Qasali Group International

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RC Electronics

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Supply Digital

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Overview

Experience the next level of performance and efficiency with the XCZU5EV-2FBVB900I by Xilinx. Known for their top-notch quality and innovation in the field of Other Function uPs, uCs & Peripheral ICs, Xilinx offers a product that exceeds expectations. This versatile microprocessor circuit is designed to handle a wide range of applications, providing customers with unmatched value and benefits. From its industrial-grade temperature tolerance to its cutting-edge CMOS technology, this product is the perfect solution for those seeking reliability and superior performance. Elevate your projects with Xilinx and discover the endless possibilities with the XCZU5EV-2FBVB900I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on circuit boards, saving space and reducing production time.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for versatility in power input options, accommodating a range of power sources.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easier to handle and align during assembly, contributing to a smoother manufacturing process.

No. of Terminals: 900

Having a large number of terminals allows for greater connectivity options and flexibility in designing complex electronic circuits.

Package Style (Meter): GRID ARRAY

The grid array package style offers a higher density of terminals in a compact space, enabling more functionality in a smaller footprint.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions and provide reliable performance in various settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively even in cold environments, making it suitable for a wide range of applications.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections over an extended period of time.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier soldering and connection to the circuit board, improving the overall reliability of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps prevent damage to sensitive components during the soldering process, ensuring product quality and durability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for reliable solder joints and ensures the product can withstand high-temperature conditions without compromising performance.

Temperature Grade: INDUSTRIAL

Being classified as industrial-grade indicates that the product is designed to meet stringent quality and reliability standards, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities, enabling it to perform complex functions with speed and efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable contact points, ensuring stable electrical performance over an extended period of use.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage is optimal for efficient power usage and compatibility with a variety of electronic devices, making the product versatile and user-friendly.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that the product can withstand moderate exposure to moisture without compromising its functionality, making it suitable for diverse environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5EV-2FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU5EV-2FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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