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V62/18601-01YE

Texas Instruments

V62/18601-01YE by Texas Instruments

V62/18601-01YE by Texas Instruments is a microcontroller with 32-bit architecture, 21-bit address bus width, and 176 terminals. It features 3-channel 12-bit DACs, 20-channel 12-bit ADCs, and peripherals like PWM(40) and UART(4). Ideal for military-grade applications requiring high-speed processing up to 100 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,118 parts In-Stock

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Vyrian

USA . 4,026 parts In-Stock

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4,026

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 111 parts In-Stock

1+ parts

$14.016

100+ parts

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$14.488

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111

$14.016

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$14.488

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One Stop Electronics

USA . 410 parts In-Stock

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$15.000

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410

$15.000

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AZTECH Wire

Italy . 254 parts In-Stock

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$15.254

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$15.254

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DigiPath Technology Company

USA . 562 parts In-Stock

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$15.433

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562

$15.433

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ChromeModa Solutions

Germany . 2,946 parts In-Stock

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$15.748

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$12.913

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2,946

$15.748

$12.913

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$15.748

100+ parts

$14.961

1k+ parts

$14.173

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1,473

$15.748

$14.961

$14.173

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Corphita

USA . 4,575 parts In-Stock

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Overview

Experience ultimate performance and reliability with the V62/18601-01YE microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality products that cater to a wide range of applications. From automotive to industrial automation, this microcontroller offers unmatched value with its cutting-edge technology, advanced features, and robust design. Trust Texas Instruments to provide you with the best-in-class microcontrollers for your next project. Elevate your designs with the V62/18601-01YE and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package sturdy and durable, ensuring reliable performance.

Surface Mount: YES

Surface mount capability makes it easy to integrate the microcontroller into various electronic designs.

Maximum Supply Voltage: 1.26 V

Ability to handle a maximum supply voltage of 1.26 V allows for flexibility in power supply options.

Address Bus Width: 21

Wide address bus width of 21 allows for efficient data retrieval and processing.

Bit Size: 32

32-bit architecture enables high-performance computing and data processing capabilities.

DAC Channels: YES

DAC channels enable the microcontroller to output analog signals, expanding its functionality.

No. of Terminals: 176

Large number of terminals provide ample connectivity options for interfacing with other components.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage of 1.14 V helps in minimizing power consumption and heat generation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures stability and performance in various environments.

Minimum Operating Temperature: -55 °C

Wide temperature range of -55°C to 125°C makes the microcontroller suitable for use in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal finish of nickel, palladium, and gold enhances conductivity and reliability of the connections.

ADC Channels: YES

ADC channels enable the microcontroller to convert analog signals into digital data, expanding its versatility.

DMA Channels: YES

DMA channels facilitate direct memory access, improving data transfer speeds and overall system performance.

ROM Words: 524288

Large ROM capacity of 524288 words allows for ample storage of program instructions and data.

External Data Bus Width: 32

Wide external data bus width of 32 facilitates efficient data transfer between the microcontroller and external devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high processing speed and reduced instruction set complexity.

RAM Bytes: 208896

Generous RAM capacity of 208896 bytes enables efficient data storage and manipulation during operation.

Analog To Digital Convertors: 20-Ch 12-Bit

Multiple ADC channels with 12-bit resolution allow for precise conversion of analog signals into digital data.

Connectivity: CAN(2), I2C(2), SPI(3), UART(4), USB

Multiple connectivity options such as CAN, I2C, SPI, UART, and USB provide flexibility in interfacing with various devices and networks.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and convenient reprogramming of the microcontroller without requiring specialized equipment.

Technical Specifications

Microcontrollers V62/18601-01YE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

21

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

97

No. of Terminals:

176

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

208896

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), UART(4), USB

Peripherals:

COMPARATOR(8), DMA(12), POR, PWM(40), TIMER(6), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

V62/18601-01YE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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