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V62/14608-02XE-T

Texas Instruments

V62/14608-02XE-T by Texas Instruments

V62/14608-02XE-T by Texas Instruments is a 16-bit microcontroller with 113 terminals, operating at up to 32 MHz. Ideal for military applications, it features 16 external interrupts, 3 DMA channels, and peripherals like RTC and timers. With a low power mode and flash ROM programmability, this CMOS technology-based microcontroller offers high performance in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,841 parts In-Stock

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Digiode

USA . 3,558 parts In-Stock

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AZTECH Wire

Italy . 240 parts In-Stock

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$15.927

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240

$15.927

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One Stop Electronics

USA . 1,185 parts In-Stock

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$16.000

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Parana Technologies

USA . 1,599 parts In-Stock

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$57.346

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$57.346

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IDEA Electronic Components Group

UK . 2,235 parts In-Stock

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$64.434

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$61.212

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$57.991

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2,235

$64.434

$61.212

$57.991

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ChromeModa Solutions

Germany . 68 parts In-Stock

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$64.434

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$52.836

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Corphita

USA . 4,203 parts In-Stock

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DigiPath Technology Company

USA . 727 parts In-Stock

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$58.094

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Microchip USA

USA . 283 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the V62/14608-02XE-T microcontroller. Ideal for a wide range of applications, this product offers exceptional value to customers seeking superior performance and versatility. With advanced features such as multiple peripherals, low power mode, and high clock frequency, the V62/14608-02XE-T ensures seamless operation and maximum efficiency. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating different voltage requirements for the application.

Package Shape: SQUARE

The square package shape helps in easy mounting and placement on circuit boards, optimizing space utilization and design efficiency.

No. of Terminals: 113

With a high number of terminals, this microcontroller offers extensive connectivity options for interfacing with other devices and components in a system.

ADC Channels: YES

The availability of ADC channels enables the microcontroller to perform analog to digital conversions, making it suitable for applications requiring sensor interfacing and data acquisition.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer and processing, improving overall system performance and reducing the workload on the CPU.

ROM Words: 589824

The large ROM size of 589824 words provides ample storage for program instructions and data, accommodating complex algorithms and applications.

RAM Bytes: 16384

The generous amount of RAM allows for temporary storage of data and variables during program execution, enhancing the microcontroller's processing capabilities.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency of 32 MHz enables fast execution of instructions, leading to high-speed operation and responsiveness in real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller ensures efficient and optimized instruction execution, resulting in high performance and low power consumption.

Technical Specifications

Microcontrollers V62/14608-02XE-T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e0

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

87

No. of Terminals:

113

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

235

RAM Bytes:

16384

ROM Words:

589824

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), SPI(8), UART(4)

Peripherals:

DMA(3), RTC, TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

V62/14608-02XE-T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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