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V62/14608-01XE

Texas Instruments

V62/14608-01XE by Texas Instruments

Texas Instruments V62/14608-01XE is a 16-bit microcontroller with 113 terminals, operating at up to 32 MHz. Ideal for automotive applications, it features 16 external interrupts, 3 DMA channels, and peripherals like RTC and timers. With a low power mode and flash ROM programmability, this CMOS technology-based microcontroller offers high performance in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,345 parts In-Stock

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Digiode

USA . 3,022 parts In-Stock

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3,022

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Distributors (Availability)

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AZTECH Wire

Italy . 417 parts In-Stock

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$12.815

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417

$12.815

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One Stop Electronics

USA . 888 parts In-Stock

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$35.000

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888

$35.000

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Parana Technologies

USA . 1,642 parts In-Stock

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$48.325

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1,642

$48.325

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DigiPath Technology Company

USA . 1,450 parts In-Stock

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$53.212

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1,450

$53.212

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ChromeModa Solutions

Germany . 3,740 parts In-Stock

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$54.298

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$44.524

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3,740

$54.298

$44.524

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IDEA Electronic Components Group

UK . 1,667 parts In-Stock

1+ parts

$54.298

100+ parts

$51.583

1k+ parts

$48.868

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1,667

$54.298

$51.583

$48.868

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Corphita

USA . 1,089 parts In-Stock

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Microchip USA

USA . 227 parts In-Stock

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Overview

Elevate your projects with the V62/14608-01XE by Texas Instruments, a top-tier microcontroller designed to deliver exceptional performance and reliability. With a wide range of applications in automotive and industrial settings, this microcontroller boasts advanced features like 16-bit processing, multiple DMA channels, and robust connectivity options. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and benefits this product brings to your work. Choose the V62/14608-01XE for cutting-edge technology that empowers your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square package shape enables a compact design layout, maximizing board space efficiency.

Bit Size: 16

16-bit architecture provides enhanced processing power and capabilities for the microcontroller.

No. of Terminals: 113

Ample number of terminals allow for versatile connectivity options and expansion possibilities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch enables high-density mounting and efficient signal routing.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

CPU Family: MSP430

Part of the MSP430 family known for its low power consumption, high performance, and rich peripheral integration.

No. of External Interrupts: 16

Multiple external interrupts allow for efficient handling of external events and real-time responsiveness.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature enables usage in extreme cold environments without compromising performance.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides reliability and solderability during assembly and operation.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and offload CPU for other tasks, enhancing overall system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and integration, optimizing board layout.

ROM Words: 589824

Large ROM capacity allows for storing extensive program and data, enabling complex applications and algorithms to be implemented.

Maximum Seated Height: 1 mm

Low seated height design minimizes component profile, ideal for slim and compact device designs.

Width: 7 mm

Compact width dimension enables space-saving integration on PCBs and compatibility with tight layout requirements.

Boundary Scan: YES

Boundary scan capability facilitates testing, debugging, and production testing of the microcontroller, improving overall product quality.

Peripherals: DMA(3), RTC, TIMER(3), WDT

Rich set of peripherals including DMA, RTC, Timer, and Watchdog timer enhance functionality and versatility of the microcontroller for various applications.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency allows for fast processing and response times, suitable for real-time applications and high-speed data processing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints during manufacturing and assembly processes.

Length: 7 mm

Compact length size enables space-efficient integration on PCBs and compatibility with compact device designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification ensures reliable performance and operation in automotive applications with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient and streamlined processing capabilities, suitable for various embedded applications.

RAM Bytes: 16384

Generous RAM capacity allows for efficient data storage and manipulation during program execution, enhancing application performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high-speed operation, making it ideal for energy-efficient and reliable applications.

Terminal Form: BALL

Ball terminal form facilitates reliable solder connections and mounting on PCBs, ensuring good electrical performance and mechanical stability.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels with 12-bit resolution enable accurate and precise conversion of analog inputs, suitable for sensor interfacing and data acquisition applications.

Maximum Supply Current: 14 mA

Low maximum supply current consumption enhances energy efficiency and prolongs battery life in portable and battery-powered devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller across different operating conditions and loads.

No. of DMA Channels: 3

Multiple DMA channels offer efficient data transfer and memory access, improving system performance and response times.

PWM Channels: YES

Pulse width modulation channels allow for precise control of output signals and motor speed, suitable for motor control and power management applications.

Connectivity: I2C(4), IRDA(4), SPI(8), UART(4)

Multiple communication interfaces such as I2C, IRDA, SPI, and UART enable seamless connectivity with external devices, sensors, and peripherals for data exchange and control.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and reprogrammable memory storage, enabling firmware updates and customization without requiring external memory devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density mounting and compact design integration, suitable for space-constrained applications and miniaturized devices.

Format: FIXED POINT

Fixed-point format offers efficient arithmetic operations and precise numerical calculations, suitable for embedded systems and signal processing applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 ensures proper handling and storage requirements to prevent moisture-induced damage during manufacturing and assembly processes.

Speed: 25 rpm

Reasonable speed rating suitable for general-purpose computing tasks, control applications, and signal processing algorithms, meeting diverse application needs.

Low Power Mode: YES

Low power mode capability allows for energy-efficient operation and extended battery life in power-constrained applications, enhancing overall system efficiency.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits provides sufficient memory space for storing program instructions and data, supporting complex algorithms and applications.

No. of I/O Lines: 87

Abundance of I/O lines enables versatile interfacing with external devices, sensors, and peripherals, facilitating flexible and expandable system configurations.

Technical Specifications

Microcontrollers V62/14608-01XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e0

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

87

No. of Terminals:

113

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

589824

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), SPI(8), UART(4)

Peripherals:

DMA(3), RTC, TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

V62/14608-01XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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