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V62/12623-01XE-T

Texas Instruments

V62/12623-01XE-T by Texas Instruments

V62/12623-01XE-T by Texas Instruments is a 16-bit microcontroller with 8KB ROM, 256B RAM, and 8-Ch 10-Bit ADC. Ideal for industrial applications, it operates b/w -40 to 85°C with a max clock frequency of 16MHz. Features include I2C/SPI connectivity, low power mode, and peripherals like BOD and WDT.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,556 parts In-Stock

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Digiode

USA . 1,859 parts In-Stock

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1,859

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Distributors (Availability)

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One Stop Electronics

USA . 366 parts In-Stock

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$2.000

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366

$2.000

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AZTECH Wire

Italy . 763 parts In-Stock

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$10.752

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Parana Technologies

USA . 142 parts In-Stock

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$26.437

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$27.023

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142

$26.437

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$27.023

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DigiPath Technology Company

USA . 1,064 parts In-Stock

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$29.110

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$29.110

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ChromeModa Solutions

Germany . 3,779 parts In-Stock

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$29.704

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$24.357

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IDEA Electronic Components Group

UK . 1,128 parts In-Stock

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$29.704

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$28.219

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$26.734

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$29.704

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$26.734

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Corphita

USA . 3,909 parts In-Stock

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Overview

Elevate your electronic designs with the V62/12623-01XE-T microcontroller by Texas Instruments. Crafted with precision and innovation, this small but powerful device is a game-changer in the world of technology. Ideal for industrial applications, this microcontroller offers unparalleled performance and reliability. With features like low power mode, PWM channels, and connectivity options such as I2C and SPI, the V62/12623-01XE-T delivers exceptional value to customers seeking cutting-edge solutions for their projects. Experience the difference that Texas Instruments brings to the table and revolutionize the way you approach microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, ensuring compatibility with different voltage requirements.

CPU Family: MSP430

Being part of the MSP430 family means the microcontroller benefits from its high-performance features and reliability.

ADC Channels: YES

The presence of Analog to Digital Converters allows for the conversion of analog signals to digital data, enabling a wider range of applications.

Maximum Clock Frequency: 16 MHz

With a high clock frequency, this microcontroller can handle tasks efficiently and process data quickly.

Peripheral IC Type: MICROCONTROLLER, RISC

The Reduced Instruction Set Computing (RISC) architecture ensures high performance and power efficiency in the microcontroller.

Connectivity: I2C, SPI

Support for popular communication protocols like I2C and SPI enables seamless integration with other devices and systems.

RAM Bytes: 256

Sufficient RAM capacity for storing data and running applications, contributing to the overall performance of the microcontroller.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, enhancing the efficiency of the microcontroller.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of outputs such as motor speed or LED brightness, expanding the microcontroller's utility.

Technical Specifications

Microcontrollers V62/12623-01XE-T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 6 MHZ AT 1.8V MIN SUPPLY

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

V62/12623-01XE-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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