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V62/12620-01XE

Texas Instruments

V62/12620-01XE by Texas Instruments

Texas Instruments V62/12620-01XE microcontroller, part of MSP430 family, operates at 16 MHz with 2/3.3V supplies. Features include 2048 ROM words, 128 RAM bytes, and 4-Ch 10-bit ADCs. Ideal for automotive applications due to its low power mode and connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,501 parts In-Stock

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4,501

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Digiode

USA . 680 parts In-Stock

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680

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Distributors (Availability)

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AZTECH Wire

Italy . 893 parts In-Stock

1+ parts

$13.670

100+ parts

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893

$13.670

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One Stop Electronics

USA . 1,435 parts In-Stock

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$24.000

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1,435

$24.000

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Parana Technologies

USA . 1,515 parts In-Stock

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$65.241

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1,515

$65.241

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IDEA Electronic Components Group

UK . 1,949 parts In-Stock

1+ parts

$73.304

100+ parts

$69.639

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$65.974

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1,949

$73.304

$69.639

$65.974

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ChromeModa Solutions

Germany . 668 parts In-Stock

1+ parts

$73.304

100+ parts

$60.109

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668

$73.304

$60.109

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DigiPath Technology Company

USA . 1,568 parts In-Stock

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$66.091

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1,568

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$66.091

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Corphita

USA . 161 parts In-Stock

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Overview

Discover the V62/12620-01XE by Texas Instruments, a high-quality microcontroller designed to meet your unique needs. With Texas Instruments' reputation for excellence in manufacturing, this product offers unmatched reliability and performance. Ideal for various applications, this microcontroller provides value through its efficient power usage, advanced peripherals, and connectivity options like I2C and SPI. Experience the benefits of its low power mode, fast clock frequency, and flash ROM programmability. Elevate your projects with the V62/12620-01XE and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller chip, ensuring reliability in various operating conditions.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring safe operation within specified voltage limits.

On Chip Data RAM Width: 8

Sufficient on-chip RAM capacity for data storage and processing, enhancing the microcontroller's performance.

Package Shape: RECTANGULAR

Standard shape that allows for easy integration into existing circuit designs and layouts.

Bit Size: 16

Provides adequate processing power for a wide range of applications, suitable for both simple and complex tasks.

Power Supplies (V): 2/3.3

Supports multiple power supply options, giving flexibility in designing power management circuits.

No. of Terminals: 8

Sufficient number of terminals for connecting external components and peripherals, enabling versatile system configurations.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the PCB and facilitates layout designs in compact electronic devices.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power scenarios, conserving energy and extending battery life.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes the microcontroller suitable for automotive and industrial applications where temperature variations occur.

CPU Family: MSP430

Member of the MSP430 family known for its low power consumption and high performance, ensuring efficient operation in battery-powered devices.

Technical Specifications

Microcontrollers V62/12620-01XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

4

No. of Serial I/Os:

0

No. of Terminals:

8

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

DMA, TIMER, WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

V62/12620-01XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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