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V62/13624-01XE-R

Texas Instruments

V62/13624-01XE-R by Texas Instruments

Texas Instruments V62/13624-01XE-R is a 16-bit microcontroller with 32 terminals, operating at -40 to 125°C. Featuring MSP430 CPU family, it offers 512 bytes of RAM and 8-Ch 10-Bit ADC channels. Ideal for automotive applications, this CMOS technology-based chip has a max clock frequency of 16 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,115 parts In-Stock

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Digiode

USA . 811 parts In-Stock

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811

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Distributors (Availability)

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AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$13.456

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192

$13.456

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One Stop Electronics

USA . 213 parts In-Stock

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$18.000

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213

$18.000

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Parana Technologies

USA . 1,241 parts In-Stock

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$39.096

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$39.096

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DigiPath Technology Company

USA . 1,338 parts In-Stock

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$43.049

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$39.605

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1,338

$43.049

$39.605

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ChromeModa Solutions

Germany . 2,647 parts In-Stock

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$43.928

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$36.021

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2,647

$43.928

$36.021

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IDEA Electronic Components Group

UK . 942 parts In-Stock

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$43.928

100+ parts

$41.732

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$39.535

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942

$43.928

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$39.535

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Corphita

USA . 4,503 parts In-Stock

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Overview

Texas Instruments Processors provide a comprehensive portfolio, proven software, and worldwide support, enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance, and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy body material offers durability and protects the microcontroller from external elements, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6 V, ensuring compatibility with a wide range of power sources.

Bit Size: 16

16-bit architecture allows for processing more complex instructions and data, enhancing the capabilities of the microcontroller.

ADC Channels: YES

Analog to digital converters allow the microcontroller to interface with analog sensors and signals, expanding its functionality.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, this microcontroller offers fast processing speeds for efficient performance.

RAM Bytes: 512

With 512 bytes of RAM, the microcontroller can store and process a significant amount of data, enabling more complex computations and operations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture enhances the microcontroller's processing efficiency and performance, making it a reliable choice for various applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates, ensuring the microcontroller can adapt to changing requirements.

Technical Specifications

Microcontrollers V62/13624-01XE-R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Connectivity:

USCI

Peripherals:

COMPARATOR, BOD, POR, TIMER(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

V62/13624-01XE-R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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