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V62/11613-01XE

Texas Instruments

V62/11613-01XE by Texas Instruments

Texas Instruments V62/11613-01XE microcontroller operates at 16 MHz with 2/3.3V power supplies, featuring 2048 ROM words and 128 RAM bytes. Ideal for automotive applications, it offers ADC channels, BOR, timers, and low power mode for efficient performance in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,303 parts In-Stock

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4,303

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Vyrian

USA . 3,888 parts In-Stock

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3,888

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Distributors (Availability)

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AZTECH Wire

Italy . 549 parts In-Stock

1+ parts

$11.406

100+ parts

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549

$11.406

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One Stop Electronics

USA . 267 parts In-Stock

1+ parts

$15.000

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267

$15.000

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Parana Technologies

USA . 974 parts In-Stock

1+ parts

$15.133

100+ parts

$1,405.298

1k+ parts

$13.619

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974

$15.133

$1,405.298

$13.619

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DigiPath Technology Company

USA . 2,287 parts In-Stock

1+ parts

$16.663

100+ parts

$15.330

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2,287

$16.663

$15.330

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

1+ parts

$17.003

100+ parts

$16.153

1k+ parts

$15.303

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1,668

$17.003

$16.153

$15.303

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ChromeModa Solutions

Germany . 1,077 parts In-Stock

1+ parts

$17.003

100+ parts

$13.942

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1,077

$17.003

$13.942

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Corphita

USA . 2,002 parts In-Stock

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Overview

Discover the V62/11613-01XE by Texas Instruments, a top-quality microcontroller designed for a wide range of applications. With cutting-edge technology and reliable performance, this product offers customers exceptional value and benefits. From automotive to industrial use, this microcontroller delivers superior functionality with features like low power mode, PWM channels, and connectivity options such as I2C and SPI. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the V62/11613-01XE microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material makes the product suitable for a wide range of applications while keeping the overall weight low.

Surface Mount: YES

Surface mount packaging makes the installation process easier and more efficient, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for compatibility with a wider range of power sources, increasing flexibility in design.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage, enhancing overall performance.

Package Shape: SQUARE

The square package shape offers better symmetry and alignment during mounting, ensuring proper orientation and optimal functionality.

Bit Size: 16

A 16-bit architecture enables higher computational capabilities and better performance compared to lower bit sizes.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows for greater compatibility with different systems and environments, enhancing versatility.

No. of Terminals: 16

Having a sufficient number of terminals facilitates easy connectivity with other components, peripherals, and interfaces.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and devices, expanding its range of applications.

ROM Words: 2048

With a large ROM capacity, the microcontroller can store a significant amount of program data and instructions, allowing for more complex applications and functionalities.

Technical Specifications

Microcontrollers V62/11613-01XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.38 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USI

Peripherals:

BOR, TIMER(2), WDT

Analog To Digital Convertors:

2-Ch 16-Bit

Trade Compliance

V62/11613-01XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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