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V62/12622-01YE

Texas Instruments

V62/12622-01YE by Texas Instruments

V62/12622-01YE by Texas Instruments is a 32-bit microcontroller with 8-bit on-chip data RAM and 22-bit address bus width. It features 24-Ch 12-Bit ADCs, 16 DMA channels, and peripherals like CRC, TIMER(32), WDT for applications requiring MILITARY-grade performance in low power mode.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,928 parts In-Stock

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Digiode

USA . 2,799 parts In-Stock

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2,799

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Distributors (Availability)

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AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$15.643

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351

$15.643

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One Stop Electronics

USA . 452 parts In-Stock

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$22.000

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452

$22.000

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Parana Technologies

USA . 252 parts In-Stock

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$63.551

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252

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DigiPath Technology Company

USA . 489 parts In-Stock

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$69.978

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489

$69.978

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ChromeModa Solutions

Germany . 2,282 parts In-Stock

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$71.406

100+ parts

$58.553

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2,282

$71.406

$58.553

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IDEA Electronic Components Group

UK . 162 parts In-Stock

1+ parts

$71.406

100+ parts

$67.836

1k+ parts

$64.265

10k+ parts

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162

$71.406

$67.836

$64.265

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Microchip USA

USA . 1,639 parts In-Stock

1+ parts

$99.630

100+ parts

$97.900

1k+ parts

$97.030

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$96.170

1,639

$99.630

$97.900

$97.030

$96.170

Corphita

USA . 4,808 parts In-Stock

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Overview

Unlock a world of possibilities with the V62/12622-01YE microcontroller from Texas Instruments. Designed with precision and reliability in mind, this powerful device offers unparalleled performance for a wide range of applications. Whether you're working on automotive systems, industrial automation, or consumer electronics, this microcontroller delivers the speed, connectivity, and flexibility you need to bring your ideas to life. Trust in Texas Instruments to provide cutting-edge technology that empowers you to create innovative solutions that make a difference. Elevate your projects with the V62/12622-01YE and experience the quality and value that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and reducing assembly time.

Maximum Supply Voltage: 1.65 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

On Chip Data RAM Width: 8

Wider data RAM width enables faster data processing and multitasking capabilities.

Address Bus Width: 22

Larger address bus width allows access to a greater range of memory locations, increasing memory capacity and overall performance.

Package Shape: SQUARE

Square package shape facilitates easy PCB layout and component placement, optimizing space utilization.

Bit Size: 32

32-bit architecture enhances processing speed and efficiency, making the microcontroller suitable for complex applications.

No. of Terminals: 337

High number of terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density, reduced footprint on the PCB, and improved signal integrity.

Minimum Supply Voltage: 1.35 V

Low minimum supply voltage ensures compatibility with a wide range of power sources and extends battery life in portable applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family is known for its high performance and real-time processing capabilities, ideal for time-sensitive applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enables operation in extreme cold environments without compromising performance.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures strong electrical connections.

ADC Channels: YES

Built-in ADC channels enable analog input signal conversion, making the microcontroller versatile for sensor interfacing and data acquisition applications.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU overhead, enhancing overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing signal integrity and reducing electromagnetic interference.

ROM Words: 2097152

Large ROM capacity accommodates extensive program storage, allowing for complex firmware and software applications.

Maximum Seated Height: 1.4 mm

Low seated height profile enables slim and compact device designs, suitable for space-constrained applications.

Width: 16 mm

Compact width dimension facilitates integration into small form factor devices, providing versatility in product design.

Boundary Scan: YES

Boundary scan support enables easy debugging, testing, and programming of the microcontroller during production and maintenance.

External Data Bus Width: 16

Wide external data bus width facilitates high-speed data transfer and enhances system performance in data-intensive applications.

Peripherals: CRC, DMA(16), TIMER(32), WDT

Rich peripheral set including CRC, DMA, timers, and Watchdog Timer enhances functionality and versatility for various application requirements.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency supports fast processing speeds, ensuring quick response times for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 20

Short reflow time at peak temperature reduces thermal stress on the microcontroller and improves manufacturing efficiency.

Peak Reflow Temperature °C: 220

High peak reflow temperature ensures proper solder joint formation during assembly, improving overall reliability of the product.

Length: 16 mm

Compact length dimension enables space-saving designs and flexibility in product form factor.

Temperature Grade: MILITARY

Military-grade temperature range and reliability standards ensure operation in extreme conditions and harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller type provide efficient data processing, low power consumption, and high-performance capabilities.

No. of Timers: 32

Multiple timer modules allow precise timing control and event scheduling, essential for time-critical applications.

RAM Bytes: 167772160

Large RAM capacity supports extensive data storage, multitasking, and efficient data manipulation for diverse application needs.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form: BALL

Ball terminal form facilitates reliable solder connections, compact package size, and efficient PCB assembly processes.

Analog To Digital Convertors: 24-Ch 12-Bit (2)

Multiple ADC channels with high resolution support analog signal acquisition for precision measurement and control applications.

Maximum Supply Current: 580 mA

Peak supply current rating ensures sufficient power delivery for the microcontroller and connected peripherals under maximum load conditions.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller under varying load conditions.

No. of DMA Channels: 16

A high number of DMA channels allow for efficient data transfer and increased system throughput by offloading data movement tasks from the CPU.

No. of Serial I/Os: 7

Multiple serial I/O interfaces offer flexible communication options for connecting to external devices, sensors, and communication networks.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog outputs, making the microcontroller suitable for motor control and power management applications.

Connectivity: CAN(3), LIN, SPI(3), UART(2)

Various communication interfaces such as CAN, LIN, SPI, and UART provide connectivity options for diverse communication protocols and device interactions.

ROM Programmability: FLASH

Flash ROM allows for programmability and flexibility in updating firmware and software, enabling future enhancements and customization.

Terminal Pitch: 0.8 mm

Narrow terminal pitch facilitates high-density mounting and soldering, improving PCB routing efficiency and assembly density.

Format: FLOATING POINT

Support for floating-point format enhances mathematical computation capabilities, essential for complex algorithms and engineering applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level indicates the assembly and handling precautions required to prevent damage during manufacturing and storage.

Speed: 160 rpm

High processing speed enables rapid data processing, efficient task execution, and real-time responsiveness in dynamic applications.

Low Power Mode: YES

Low power mode functionality conserves energy consumption during idle times, extending battery life and reducing overall power costs.

On Chip Program ROM Width: 8

Built-in program ROM width of 8 facilitates storing program code on the microcontroller, enabling stand-alone operation and quick startups.

No. of I/O Lines: 115

Abundant I/O lines provide versatile connectivity options for interfacing with external devices, sensors, and peripherals, enhancing system integration.

Technical Specifications

Microcontrollers V62/12622-01YE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

115

No. of Serial I/Os:

7

No. of Terminals:

337

No. of Timers:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Bytes:

167772160

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

160 rpm

Maximum Supply Current:

580 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), LIN, SPI(3), UART(2)

Peripherals:

CRC, DMA(16), TIMER(32), WDT

Analog To Digital Convertors:

24-Ch 12-Bit (2)

Trade Compliance

V62/12622-01YE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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