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STM32H747AII6

STMicroelectronics

STM32H747AII6 by STMicroelectronics

STM32H747AII6 by STMicroelectronics is a 32-bit microcontroller with 8KB cache, 26-bit address bus, and 3.6V max supply voltage. Ideal for industrial applications, it features 22 timers, CAN/I2C/SPI/USB connectivity, and low power mode for efficient operation at -40 to 85°C.

Median Price

$17.792

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 6,043 parts In-Stock

1+ parts

$8.373

100+ parts

-

1k+ parts

-

10k+ parts

-

6,043

$8.373

-

-

-

Farnell

UK . 333 parts In-Stock

1+ parts

$15.150

100+ parts

$11.760

1k+ parts

-

10k+ parts

-

333

$15.150

$11.760

-

-

Chip1Stop

Japan . 4,840 parts In-Stock

1+ parts

$16.944

100+ parts

$10.811

1k+ parts

$10.703

10k+ parts

-

4,840

$16.944

$10.811

$10.703

-

Mouser Electronics

USA . 2,179 parts In-Stock

1+ parts

$18.640

100+ parts

$12.750

1k+ parts

$11.940

10k+ parts

-

2,179

$18.640

$12.750

$11.940

-

DigiKey

USA . 1,075 parts In-Stock

1+ parts

$19.580

100+ parts

$13.507

1k+ parts

$12.671

10k+ parts

-

1,075

$19.580

$13.507

$12.671

-

Newark

USA . 440 parts In-Stock

1+ parts

$20.180

100+ parts

$13.780

1k+ parts

$12.360

10k+ parts

-

440

$20.180

$13.780

$12.360

-

Element14

Singapore . 333 parts In-Stock

1+ parts

$27.130

100+ parts

$20.030

1k+ parts

-

10k+ parts

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333

$27.130

$20.030

-

-

Future Electronics

Canada . 9,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$9.110

9,984

-

-

-

$9.110

Verical

USA . 6,043 parts In-Stock

1+ parts

-

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6,043

-

-

-

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Avnet

USA . 1,248 parts In-Stock

1+ parts

-

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1,248

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,872 parts In-Stock

1+ parts

$14.307

100+ parts

-

1k+ parts

-

10k+ parts

-

2,872

$14.307

-

-

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$18.240

100+ parts

-

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-

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700

$18.240

-

-

-

IBS Electronics

USA . 9,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$13.001

10k+ parts

$12.160

9,984

-

-

$13.001

$12.160

Vyrian

USA . 3,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,668

-

-

-

-

Chip Stock

USA . 2,810 parts In-Stock

1+ parts

-

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-

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2,810

-

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Anansix

USA . 963 parts In-Stock

1+ parts

-

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963

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,960 parts In-Stock

1+ parts

$8.540

100+ parts

$8.326

1k+ parts

$8.284

10k+ parts

-

3,960

$8.540

$8.326

$8.284

-

Vigor

Singapore . 8,550 parts In-Stock

1+ parts

$12.280

100+ parts

-

1k+ parts

-

10k+ parts

-

8,550

$12.280

-

-

-

Corphita

USA . 3,085 parts In-Stock

1+ parts

$13.554

100+ parts

-

1k+ parts

-

10k+ parts

-

3,085

$13.554

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$18.240

100+ parts

-

1k+ parts

$17.328

10k+ parts

$16.963

50

$18.240

-

$17.328

$16.963

Ampacity Inc.

Singapore . 3,763 parts In-Stock

1+ parts

$18.590

100+ parts

-

1k+ parts

-

10k+ parts

-

3,763

$18.590

-

-

-

Continental Prestige Electronics

USA . 411 parts In-Stock

1+ parts

$18.740

100+ parts

$14.550

1k+ parts

-

10k+ parts

-

411

$18.740

$14.550

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-

Modulus Dynamics

Lithuania . 15 parts In-Stock

1+ parts

$20.246

100+ parts

$20.044

1k+ parts

$19.437

10k+ parts

-

15

$20.246

$20.044

$19.437

-

IDEA Electronic Components Group

UK . 1,220 parts In-Stock

1+ parts

$28.747

100+ parts

-

1k+ parts

$25.873

10k+ parts

-

1,220

$28.747

-

$25.873

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$49.658

100+ parts

$47.175

1k+ parts

$47.175

10k+ parts

-

2,000

$49.658

$47.175

$47.175

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Microchip USA

USA . 2,257 parts In-Stock

1+ parts

$52.095

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-

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2,257

$52.095

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Corohmni

South Africa . 226 parts In-Stock

1+ parts

$53.829

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226

$53.829

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MKK Technologies

India . 1,890 parts In-Stock

1+ parts

$54.057

100+ parts

-

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-

10k+ parts

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1,890

$54.057

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DigiPath Technology Company

USA . 1,890 parts In-Stock

1+ parts

$54.057

100+ parts

-

1k+ parts

-

10k+ parts

-

1,890

$54.057

-

-

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Aztec Data Supply Inc.

USA . 3,588 parts In-Stock

1+ parts

$83.960

100+ parts

-

1k+ parts

-

10k+ parts

-

3,588

$83.960

-

-

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Lixinc

USA . 10,953 parts In-Stock

1+ parts

-

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10,953

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

-

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Parana Technologies

USA . 2,224 parts In-Stock

1+ parts

-

100+ parts

$34.372

1k+ parts

-

10k+ parts

-

2,224

-

$34.372

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-

GreenTree Electronics

Israel . 1,998 parts In-Stock

1+ parts

-

100+ parts

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-

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1,998

-

-

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Glotronic Ltd.

UK . 1,997 parts In-Stock

1+ parts

-

100+ parts

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1,997

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-

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Argo Parts USA

USA . 437 parts In-Stock

1+ parts

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437

-

-

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

-

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350

-

-

-

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$15.103

1k+ parts

$15.103

10k+ parts

$15.103

350

-

$15.103

$15.103

$15.103

Computer Components Inc. - USA

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Overview

Upgrade your projects with the STM32H747AII6 microcontroller from STMicroelectronics, a leading manufacturer known for quality and reliability. Ideal for a wide range of applications, this microcontroller offers integrated cache, low power mode, and a variety of connectivity options including CAN, I2C, SPI, USB, and more. With high-speed performance, advanced peripherals, and industrial-grade temperature range, the STM32H747AII6 provides exceptional value and flexibility for your design needs. Experience the benefits of cutting-edge technology and unleash the full potential of your projects with this powerful microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Integrated Cache: YES

Integrated cache helps in reducing access time to frequently used data, enhancing the overall performance of the microcontroller.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with various voltage sources.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage capability within the microcontroller.

Address Bus Width: 26

A wider address bus width enables the microcontroller to access a larger memory space, facilitating complex computations and data handling.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easier integration into circuit designs.

Bit Size: 32

32-bit architecture provides high processing power and precision for advanced applications requiring complex algorithms and computations.

DAC Channels: YES

Digital-to-Analog Converter channels enable the microcontroller to interface with analog components and sensors, expanding its application range.

No. of Terminals: 169

Having a higher number of terminals provides more connectivity options and flexibility for interfacing with external devices and peripherals.

Minimum Supply Voltage: 1.62 V

Lower minimum supply voltage allows for efficient power consumption and compatibility with low-power applications, extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the microcontroller's reliability and stability in harsh environmental conditions and industrial settings.

CPU Family: STM32

Belonging to the STM32 CPU family signifies a proven track record of performance, compatibility, and support among developers and engineers.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the microcontroller to function reliably in extreme cold environments without compromising performance.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to measure and convert analog signals accurately, essential for data acquisition and sensor interfacing.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU, optimizing performance for tasks requiring frequent data movement.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, enhancing the overall design flexibility and manufacturability of the product.

ROM Words: 2097152

Large ROM capacity allows for extensive program storage and code execution, supporting complex software applications and algorithms.

Maximum Seated Height: 0.6 mm

Ultra-thin profile with a low seated height enables compact and space-efficient PCB designs, ideal for applications with size constraints.

Digital To Analog Convertors: 2-Ch 12-Bit

Having dual 12-bit Digital-to-Analog Converters provides accurate and high-resolution analog output for precise control and signal generation.

RAM Words: 1019904

Generous RAM capacity allows for efficient data storage and manipulation during program execution, enhancing real-time processing capabilities.

Width: 7 mm

Compact width dimension facilitates integration into space-limited designs and enhances overall board density for enhanced functionality.

Boundary Scan: YES

Boundary scan support enables efficient testing and debugging of the microcontroller during manufacturing and maintenance, ensuring product quality.

External Data Bus Width: 16

Having a 16-bit external data bus width enables faster data transfer between the microcontroller and external memory, improving system performance.

Peripherals: BOR, COMPARATOR(2), DMA, POR, RTC, TIMER(22), WDT(4)

A wide range of peripherals offers versatile interfacing options and functionality for diverse applications, enhancing the microcontroller's flexibility.

Maximum Clock Frequency: 48 MHz

High clock frequency capability allows for fast processing speed and execution of time-sensitive tasks, suitable for high-performance applications.

Length: 7 mm

Compact length dimension enables space-efficient placement on PCBs and contributes to overall design miniaturization for compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade requirements, ensuring reliable operation in harsh environmental conditions and extended operational lifetimes.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture with integrated microcontroller peripherals offers optimized performance, efficiency, and cost-effectiveness for a wide range of applications.

No. of Timers: 22

Having multiple timers allows for precise timing control, event scheduling, and synchronization, essential for various applications requiring accurate timekeeping.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic components, enhancing overall system efficiency.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly processes, ensuring reliable electrical connections and robust mechanical support for the microcontroller.

Analog To Digital Convertors: 28-Ch 16-Bit

With 28 16-bit Analog-to-Digital Converters, the microcontroller can handle multiple analog inputs with high resolution and accuracy, suitable for sensor-related applications.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage simplifies power management and ensures consistent performance across various operating conditions.

No. of DMA Channels: 4

Having 4 Direct Memory Access channels enables efficient data transfer and management, reducing CPU load and enhancing overall system performance.

PWM Channels: YES

Pulse Width Modulation channels enable the generation of analog-like signals for precise control, making the microcontroller suitable for motor control and power management applications.

Connectivity: CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SPI(6), SDMMC(2), SWPMI, UART(4), USART(4), USB

Diverse connectivity options including various communication protocols and interfaces offer compatibility and flexibility for seamless integration with external devices and systems.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible software updates, enabling efficient development and deployment of firmware and applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density packaging and miniaturization, enabling compact PCB designs and enhancing overall system integration.

Format: FIXED POINT

Fixed-point format ensures efficient arithmetic operations and numerical calculations, suitable for applications requiring precise and predictable mathematical processing.

Speed: 480 rpm

High speed of 480 rpm enables fast execution of control algorithms and signal processing tasks, making the microcontroller ideal for time-critical applications.

Low Power Mode: YES

Low power mode capability allows for energy-efficient operation, extending battery life and enabling power-sensitive applications to run optimally.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits enables efficient storage and execution of program code, enhancing the microcontroller's processing capabilities.

No. of I/O Lines: 112

With 112 I/O lines, the microcontroller offers versatile interfacing options and connectivity for external peripherals, sensors, and devices, enhancing its application flexibility.

Technical Specifications

Microcontrollers STM32H747AII6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

STM32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

112

No. of Terminals:

169

No. of Timers:

22

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

1019904

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

480 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SPI(6), SDMMC(2), SWPMI, UART(4), USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA, POR, RTC, TIMER(22), WDT(4)

Analog To Digital Convertors:

28-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H747AII6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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