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V62/12625-01XE-T

Texas Instruments

V62/12625-01XE-T by Texas Instruments

V62/12625-01XE-T by Texas Instruments is a 16-bit microcontroller with 256 bytes of RAM and flash ROM programmability. It features 8 ADC channels, 8 DMA channels, and peripherals like TIMER and PWM. Ideal for automotive applications with an operating temperature range from -40°C to 125°C, it offers low power mode and connectivity via I2C and SPI interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,765 parts In-Stock

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Digiode

USA . 1,188 parts In-Stock

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1,188

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Distributors (Availability)

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AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$6.171

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766

$6.171

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One Stop Electronics

USA . 1,470 parts In-Stock

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$11.000

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$11.000

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Parana Technologies

USA . 1,753 parts In-Stock

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$54.302

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$54.302

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DigiPath Technology Company

USA . 2,045 parts In-Stock

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$59.793

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$55.009

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2,045

$59.793

$55.009

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ChromeModa Solutions

Germany . 2,040 parts In-Stock

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$61.013

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$50.031

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2,040

$61.013

$50.031

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IDEA Electronic Components Group

UK . 1,300 parts In-Stock

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$61.013

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$57.962

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$54.912

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1,300

$61.013

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$54.912

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Corphita

USA . 4,145 parts In-Stock

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Overview

Unleash the power of innovation with the V62/12625-01XE-T microcontroller by Texas Instruments. Crafted with precision and expertise, this small yet mighty device offers unparalleled performance and reliability in a wide range of applications. From automotive to industrial automation, this versatile microcontroller is designed to meet your specific needs with ease. Experience seamless connectivity, low power consumption, and advanced features such as ADC and PWM channels. Elevate your projects to new heights with the V62/12625-01XE-T and unlock endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 16

16-bit architecture allows for higher processing capabilities and better performance in handling complex tasks and calculations.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and devices, expanding its functionality.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of the output signals, making it suitable for applications such as motor control and power management.

Connectivity: I2C, SPI

Support for I2C and SPI communication protocols allows for easy integration with other devices and peripherals, enhancing overall system connectivity.

ROM Programmability: FLASH

Flash programmable ROM enables easy and convenient firmware updates and modifications, ensuring flexibility and adaptability in the product's design.

Low Power Mode: YES

Low power mode capability helps in conserving energy and prolonging battery life, making it ideal for applications requiring low power consumption.

Technical Specifications

Microcontrollers V62/12625-01XE-T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 6 MHZ AT 1.8V MIN SUPPLY

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

1

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

0

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

TIMER

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

V62/12625-01XE-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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