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V62/12621-01XE-T

Texas Instruments

V62/12621-01XE-T by Texas Instruments

Texas Instruments V62/12621-01XE-T is a 16-bit microcontroller with 3072 ROM words, 128 RAM bytes, and 8 ADC channels. Ideal for automotive applications, it operates b/w -40 to 125 °C with a max clock frequency of 16 MHz. Featuring low power mode and connectivity via I2C and SPI, this MCU offers high performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,180 parts In-Stock

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Digiode

USA . 109 parts In-Stock

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109

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One Stop Electronics

USA . 165 parts In-Stock

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$3.000

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165

$3.000

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AZTECH Wire

Italy . 460 parts In-Stock

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$17.492

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460

$17.492

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$18.291

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$16.645

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$14.999

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$18.291

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$14.999

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Parana Technologies

USA . 1,911 parts In-Stock

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$60.980

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DigiPath Technology Company

USA . 2,340 parts In-Stock

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$67.147

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$67.147

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

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$68.517

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$65.091

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$61.665

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2,088

$68.517

$65.091

$61.665

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ChromeModa Solutions

Germany . 1,420 parts In-Stock

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$68.517

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$56.184

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Corphita

USA . 1,754 parts In-Stock

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Overview

Discover the power and reliability of Texas Instruments with the V62/12621-01XE-T microcontroller. Ideal for a range of applications in automotive and beyond, this compact yet powerful device offers 16-bit processing capabilities and a maximum clock frequency of 16 MHz. With features like boundary scan, peripherals like BOD and DMA, and connectivity options including I2C and SPI, this microcontroller is designed to enhance performance and efficiency. Experience the quality and innovation of Texas Instruments with the V62/12621-01XE-T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the microcontroller lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power supply variations, making it versatile in different applications.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility and support from the manufacturer for software development, updates, and technical assistance.

ADC Channels: YES

The presence of Analog-to-Digital Convertor channels allows the microcontroller to efficiently process analog signals, making it suitable for applications involving sensor data and real-world measurements.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture in a microcontroller provides high performance, low power consumption, and efficient utilization of resources, making it a reliable choice for embedded systems.

Technical Specifications

Microcontrollers V62/12621-01XE-T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

3072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

.39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, DMA, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

V62/12621-01XE-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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