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V62/13629-01XE

Texas Instruments

V62/13629-01XE by Texas Instruments

V62/13629-01XE by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width, operating at up to 80 MHz. Ideal for automotive applications, it features ADC and DMA channels, FLASH ROM programmability, and operates in temperatures ranging from -40°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,206 parts In-Stock

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5,206

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Digiode

USA . 4,036 parts In-Stock

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4,036

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,587 parts In-Stock

1+ parts

$13.000

100+ parts

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1,587

$13.000

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AZTECH Wire

Italy . 832 parts In-Stock

1+ parts

$16.659

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832

$16.659

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Parana Technologies

USA . 1,077 parts In-Stock

1+ parts

$36.679

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1,077

$36.679

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DigiPath Technology Company

USA . 68 parts In-Stock

1+ parts

$40.388

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68

$40.388

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ChromeModa Solutions

Germany . 6,891 parts In-Stock

1+ parts

$41.212

100+ parts

$33.794

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6,891

$41.212

$33.794

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IDEA Electronic Components Group

UK . 1,342 parts In-Stock

1+ parts

$41.212

100+ parts

$39.151

1k+ parts

$37.091

10k+ parts

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1,342

$41.212

$39.151

$37.091

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$53.045

100+ parts

$48.271

1k+ parts

$43.497

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1,000

$53.045

$48.271

$43.497

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Corphita

USA . 3,147 parts In-Stock

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3,147

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Overview

Discover the cutting-edge V62/13629-01XE microcontroller by Texas Instruments, a top-tier manufacturer known for their reliable and high-quality products. Perfect for a wide range of applications, this microcontroller offers unparalleled performance and efficiency. With features like ADC and DMA channels, ROM programmability, and a maximum clock frequency of 80 MHz, this device delivers exceptional value to customers looking for advanced solutions in automotive and industrial settings. Stay ahead of the curve with the V62/13629-01XE and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.32 V

Allows for stable operation within a safe voltage range.

Address Bus Width: 22

Provides a wide range of addressable memory locations for data storage.

Package Shape: SQUARE

Helps in space-saving and efficient PCB layout.

Bit Size: 32

Allows for efficient processing and handling of data.

No. of Terminals: 337

Provides multiple connectivity options for peripherals and external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables high-density integration and compact design.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 125 °C

Suitable for applications that require high temperature tolerance.

CPU Family: CORTEX-R4F

Utilizes a powerful and efficient CPU architecture for optimal performance.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme low-temperature environments.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity for reliable connections.

ADC Channels: YES

Allows for analog input signal conversion for sensor interfacing.

DMA Channels: YES

Enables efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: BOTTOM

Facilitates easy and secure mounting on the PCB.

Maximum Seated Height: 1.4 mm

Helps in achieving a low-profile design for space-constrained applications.

Width: 16 mm

Compact size for easy integration into various electronic systems.

External Data Bus Width: 32

Provides a wide data bus for efficient data transfer between external peripherals and memory.

Maximum Clock Frequency: 80 MHz

Enables fast processing and response times for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 20

Ensures proper soldering during PCB assembly.

Peak Reflow Temperature °C: 220

Suitable for reflow soldering processes without damaging the microcontroller.

Length: 16 mm

Compact size for space-saving PCB layout.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and fast processing of instructions.

RAM Bytes: 262144

Offers a large amount of memory for data storage and processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Facilitates easy and reliable soldering during PCB assembly.

Nominal Supply Voltage: 1.2 V

Optimal voltage level for efficient and stable operation.

PWM Channels: YES

Enables generation of PWM signals for precise control of connected devices.

ROM Programmability: FLASH

Allows for easy and flexible programming of the microcontroller's read-only memory.

Terminal Pitch: 0.8 mm

Provides a fine pitch for compact PCB design and high-density integration.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection needed during storage and handling to prevent moisture damage.

Speed: 180 rpm

High processing speed for quick response in demanding applications.

No. of I/O Lines: 144

Offers a large number of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers V62/13629-01XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e0

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

144

No. of Terminals:

337

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Bytes:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

V62/13629-01XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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