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V62/12625-01XE

Texas Instruments

V62/12625-01XE by Texas Instruments

V62/12625-01XE by Texas Instruments is a 16-bit microcontroller with 256 bytes of RAM and flash ROM programmability. It operates at a max clock frequency of 16 MHz, suitable for automotive applications due to its temperature grade. Features include 8-Ch 10-Bit ADC channels, PWM channels, I2C and SPI connectivity, and DMA support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,220 parts In-Stock

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8,220

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Digiode

USA . 4,169 parts In-Stock

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4,169

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 385 parts In-Stock

1+ parts

$17.598

100+ parts

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385

$17.598

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One Stop Electronics

USA . 1,355 parts In-Stock

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$32.000

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1,355

$32.000

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Parana Technologies

USA . 496 parts In-Stock

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$70.918

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496

$70.918

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DigiPath Technology Company

USA . 2,339 parts In-Stock

1+ parts

$78.089

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2,339

$78.089

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ChromeModa Solutions

Germany . 2,275 parts In-Stock

1+ parts

$79.683

100+ parts

$65.340

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2,275

$79.683

$65.340

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IDEA Electronic Components Group

UK . 2,020 parts In-Stock

1+ parts

$79.683

100+ parts

$75.699

1k+ parts

$71.715

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2,020

$79.683

$75.699

$71.715

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Corphita

USA . 146 parts In-Stock

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146

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Overview

Enhance the performance of your automotive applications with the V62/12625-01XE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that ensure reliable and efficient operation. With features like 16-bit processing, ADC and DMA channels, and connectivity options like I2C and SPI, this microcontroller offers unmatched versatility for a wide range of automotive systems. Experience the benefits of high-speed operation, low power consumption, and advanced peripherals, all in a compact and durable package. Trust Texas Instruments to provide the cutting-edge technology you need to drive innovation in your automotive designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a range of different applications.

ADC Channels: YES

Ability to convert analog signals to digital data, enhancing the product's functionality in sensor-based applications.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, enabling flexibility in applications and updating firmware.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, improving performance of the product.

Connectivity: I2C, SPI

Support for popular communication interfaces allows for easy integration with other devices, expanding the product's connectivity options.

Technical Specifications

Microcontrollers V62/12625-01XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 6 MHZ AT 1.8V MIN SUPPLY

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

256

ROM Words:

0

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

TIMER

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

V62/12625-01XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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