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V62/13629-02XE

Texas Instruments

V62/13629-02XE by Texas Instruments

Texas Instruments V62/13629-02XE is a 32-bit microcontroller with Cortex-R4F CPU family, 22-bit address bus width, and 64K data EEPROM size. It features 24-Ch 12-Bit ADCs, CAN(3), ETHERNET connectivity, and MILITARY temperature grade. Ideal for applications requiring high-speed processing and extensive peripheral support in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,565 parts In-Stock

1+ parts

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9,565

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Digiode

USA . 4,618 parts In-Stock

1+ parts

-

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-

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4,618

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$12.743

100+ parts

-

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292

$12.743

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One Stop Electronics

USA . 783 parts In-Stock

1+ parts

$17.000

100+ parts

-

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783

$17.000

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Ampacity Inc.

Singapore . 245 parts In-Stock

1+ parts

$28.000

100+ parts

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245

$28.000

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Parana Technologies

USA . 2,062 parts In-Stock

1+ parts

$44.581

100+ parts

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2,062

$44.581

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DigiPath Technology Company

USA . 2,220 parts In-Stock

1+ parts

$49.089

100+ parts

$45.162

1k+ parts

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2,220

$49.089

$45.162

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ChromeModa Solutions

Germany . 3,985 parts In-Stock

1+ parts

$50.091

100+ parts

$41.075

1k+ parts

-

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3,985

$50.091

$41.075

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IDEA Electronic Components Group

UK . 1,547 parts In-Stock

1+ parts

$50.091

100+ parts

$47.586

1k+ parts

$45.082

10k+ parts

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1,547

$50.091

$47.586

$45.082

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Corphita

USA . 3,495 parts In-Stock

1+ parts

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3,495

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Overview

Unlock unparalleled performance and reliability with the V62/13629-02XE microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and cutting-edge technology in every product they offer. Ideal for a wide range of applications, this microcontroller provides unmatched value to customers seeking superior performance and efficiency. Experience seamless connectivity, advanced peripherals, and powerful processing capabilities with the V62/13629-02XE, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this microcontroller lightweight and durable, making it ideal for portable and rugged applications.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating various voltage requirements in different applications.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family offers high performance and efficiency, making this microcontroller suitable for high-speed and real-time processing tasks.

ADC Channels: YES

The presence of ADC channels allows for analog input signal conversion, enabling the microcontroller to interface with sensors and other analog devices effectively.

PWM Channels: YES

PWM channels enable precise control of output signals, making this microcontroller well-suited for applications that require accurate pulse-width modulation.

Connectivity: CAN(3), ETHERNET, I2C, SCI(2), SPI(5)

The variety of connectivity options such as CAN, Ethernet, I2C, SCI, and SPI make this microcontroller versatile and capable of interfacing with a wide range of devices and networks.

Technical Specifications

Microcontrollers V62/13629-02XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO HAVING SHARED 16-CH ADC

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e0

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

144

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, SCI(2), SPI(5)

Peripherals:

DMA(16), POR, TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

V62/13629-02XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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