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V62/12621-01XE

Texas Instruments

V62/12621-01XE by Texas Instruments

V62/12621-01XE by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 128B RAM. Operating at up to 16MHz, it features 8 ADC channels, DMA support, and peripherals like BOD and TIMER. Ideal for automotive applications due to its low power mode, I2C/SPI connectivity, and compact size of 5x4.4mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,013 parts In-Stock

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Digiode

USA . 4,381 parts In-Stock

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4,381

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Distributors (Availability)

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AZTECH Wire

Italy . 708 parts In-Stock

1+ parts

$6.951

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708

$6.951

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One Stop Electronics

USA . 1,252 parts In-Stock

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$13.000

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$13.000

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Parana Technologies

USA . 219 parts In-Stock

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$68.620

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$68.620

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DigiPath Technology Company

USA . 167 parts In-Stock

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$75.559

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167

$75.559

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ChromeModa Solutions

Germany . 1,746 parts In-Stock

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$77.101

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$63.223

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1,746

$77.101

$63.223

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IDEA Electronic Components Group

UK . 858 parts In-Stock

1+ parts

$77.101

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$73.246

1k+ parts

$69.391

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858

$77.101

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$69.391

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Corphita

USA . 2,375 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the V62/12621-01XE microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that is trusted by professionals worldwide. This versatile microcontroller is perfect for a wide range of applications, offering high-quality features such as ADC channels, DMA channels, and connectivity options like I2C and SPI. With low power mode capabilities and a maximum clock frequency of 16 MHz, this product provides exceptional value and efficiency for all your project needs. Trust Texas Instruments to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic package provides good thermal properties and is cost-effective.

Maximum Supply Voltage: 3.6 V

Allows for a flexible power supply range for different applications.

Minimum Supply Voltage: 1.8 V

Supports low power operation and extends battery life.

ADC Channels: YES

Integrated ADC channels enable analog sensing capabilities.

DMA Channels: YES

DMA channels enhance data processing speed and efficiency.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high performance and efficient processing.

Connectivity: I2C, SPI

Supports standard communication protocols for easy integration with other devices.

Speed: 16 rpm

Operates at a high clock frequency for quick response and data processing.

Low Power Mode: YES

Offers low power modes for energy-efficient operation.

Technical Specifications

Microcontrollers V62/12621-01XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

3072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, DMA, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

V62/12621-01XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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