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TMS27C040-15JL

Texas Instruments

TMS27C040-15JL by Texas Instruments

TMS27C040-15JL by Texas Instruments is a 512KX8 EPROM with 150 ns access time, operating at 5V. It features 3-STATE output characteristics and uses CMOS technology. Commonly used in commercial applications requiring fast memory access and reliable data storage.

Median Price

$4.059

Lifecycle Status

Suppliers In-Stock

38

In-Stock Inventory

1k+

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DF Sales Co.

USA . 6,435 parts In-Stock

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DF Sales Co.

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Freelance Electronics

USA . 14 parts In-Stock

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$4.262

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$4.018

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Forefront Electronics and Design

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American Microsemiconductor Inc.

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Digiode

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Vyrian

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MRC Electronics

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Jameco Electronics

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Prism Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Electronics Depot

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Bristol Electronics

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Pegasus Components GmbH

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4 Star Electronics, Inc.

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Atlantic Semiconductor

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Resion

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Component Electronics Inc.

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J & M Industries LLC

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LWI Electronics Inc

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PC Components Company LLC

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Mil-Aero Solutions, Inc.

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Sogenti Electronics

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Standard Data Resources

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Extreme Components

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Speed Components Ltd

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Corel Iberica Componentes, S.L.

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GES GmbH

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ComSIT Distribution GmbH

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Velocity Electronics

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First Choice Components Inc.

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NAC Semi

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Parana Technologies

USA . 1,416 parts In-Stock

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$4.515

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DigiPath Technology Company

USA . 1,278 parts In-Stock

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IDEA Electronic Components Group

UK . 2,364 parts In-Stock

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$4.098

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ChromeModa Solutions

Germany . 156 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 775 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Lixinc

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A-Z Elektronik GmbH

Germany . 5,339 parts In-Stock

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Corphita

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Perfect Parts

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A-Plus Industry Inc.

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Assy Fe

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Overview

Unlock the power of reliable data storage with the TMS27C040-15JL EPROM by Texas Instruments. Crafted with precision and quality, this memory IC offers a seamless solution for a wide range of applications. Whether you're looking to enhance your electronics project or streamline your industrial processes, this product provides unmatched value and performance. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs, elevating your work to new heights of efficiency and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the EPROM, making it suitable for harsh environments.

Nominal Supply Voltage / Vsup (V): 5

The EPROM operates at a standard supply voltage of 5V, ensuring compatibility with most systems and applications.

No. of Words: 524288 words

With a large memory capacity of 524288 words, this EPROM can store a significant amount of data or code, making it ideal for applications requiring ample storage space.

Parallel or Serial: PARALLEL

Being a parallel EPROM allows for faster data transfer compared to serial EPROMs, making it suitable for applications where speed is crucial.

Maximum Access Time: 150 ns

The maximum access time of 150 ns ensures quick read and write operations, making the EPROM efficient for time-sensitive applications.

Technical Specifications

EPROM TMS27C040-15JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T32

Length:

41.91 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP32,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.91 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C040-15JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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