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TDA3MADBABFQ1

Texas Instruments

TDA3MADBABFQ1 by Texas Instruments

TDA3MADBABFQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. Features include bottom terminal position, fine pitch, and AEC-Q100 screening level.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,370 parts In-Stock

1+ parts

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4,370

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Digiode

USA . 797 parts In-Stock

1+ parts

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797

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 511 parts In-Stock

1+ parts

$2.228

100+ parts

$206.873

1k+ parts

$2.005

10k+ parts

-

511

$2.228

$206.873

$2.005

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DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$2.453

100+ parts

-

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650

$2.453

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ChromeModa Solutions

Germany . 4,914 parts In-Stock

1+ parts

$2.503

100+ parts

$2.052

1k+ parts

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4,914

$2.503

$2.052

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IDEA Electronic Components Group

UK . 582 parts In-Stock

1+ parts

$2.503

100+ parts

-

1k+ parts

$2.253

10k+ parts

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582

$2.503

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$2.253

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One Stop Electronics

USA . 529 parts In-Stock

1+ parts

$6.800

100+ parts

-

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529

$6.800

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AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$17.119

100+ parts

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623

$17.119

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Corphita

USA . 4,004 parts In-Stock

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4,004

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Overview

Unlock the power of cutting-edge technology with the TDA3MADBABFQ1 by Texas Instruments. Designed with precision and reliability in mind, this consumer IC offers a wide range of applications for automotive and industrial settings. With a robust package body material and high-quality terminal finish, this product ensures longevity and top-notch performance. Trust Texas Instruments to deliver superior products that provide value, efficiency, and innovation to meet your needs. Elevate your projects with the TDA3MADBABFQ1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the components inside, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly, making the product suitable for applications where space is limited.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications where robust performance is required.

Package Shape: SQUARE

Square package shape is ideal for maximizing space utilization on a PCB, making the product efficient for tight layouts.

No. of Terminals: 367

High number of terminals allow for more connections and functionalities to be integrated into the product, increasing its versatility.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures that the product can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in cold environments without any issues, adding to its reliability.

Terminal Finish: TIN SILVER COPPER

Combination of Tin, Silver, and Copper terminal finish provides good conductivity and corrosion resistance, enhancing the product's performance and lifespan.

Width: 15 mm

Compact width allows for easy integration into different systems, making the product versatile and adaptable.

Minimum Supply Voltage (Vsup): 1.02 V

Low minimum supply voltage requirement enables the product to operate efficiently with different power sources, increasing its flexibility.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures that the product can withstand temperature variations commonly found in automotive environments, making it a reliable choice for automotive applications.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting, making the product suitable for compact designs and applications where space saving is crucial.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the product has moderate sensitivity to moisture, ensuring its reliability in moderately humid environments.

Maximum Supply Voltage (Vsup): 1.11 V

Low maximum supply voltage requirement ensures the product remains within safe operating limits, enhancing its safety and longevity.

Technical Specifications

Other Function Consumer ICs TDA3MADBABFQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3MADBABFQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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