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TDA3LABBABFRQ1

Texas Instruments

TDA3LABBABFRQ1 by Texas Instruments

TDA3LABBABFRQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With surface mount and fine pitch, it has a max supply voltage of 1.11V and peak reflow temperature of 250°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,396 parts In-Stock

1+ parts

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3,396

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Vyrian

USA . 3,331 parts In-Stock

1+ parts

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100+ parts

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3,331

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 861 parts In-Stock

1+ parts

$1.322

100+ parts

-

1k+ parts

$2.062

10k+ parts

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861

$1.322

-

$2.062

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DigiPath Technology Company

USA . 1,058 parts In-Stock

1+ parts

$1.455

100+ parts

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10k+ parts

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1,058

$1.455

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IDEA Electronic Components Group

UK . 948 parts In-Stock

1+ parts

$1.485

100+ parts

-

1k+ parts

$1.336

10k+ parts

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948

$1.485

-

$1.336

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ChromeModa Solutions

Germany . 598 parts In-Stock

1+ parts

$1.485

100+ parts

$1.218

1k+ parts

-

10k+ parts

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598

$1.485

$1.218

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AZTECH Wire

Italy . 399 parts In-Stock

1+ parts

$14.780

100+ parts

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399

$14.780

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One Stop Electronics

USA . 1,419 parts In-Stock

1+ parts

$20.800

100+ parts

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1,419

$20.800

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Corphita

USA . 1,347 parts In-Stock

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1,347

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Overview

Elevate your consumer electronics with the TDA3LABBABFRQ1 by Texas Instruments, a top-tier manufacturer known for their innovative solutions. This versatile product falls under the category of Other Function Consumer ICs, offering a wide range of applications in automotive settings and beyond. With high-quality materials and advanced features like AEC-Q100 screening, this product ensures reliability and durability. Experience the value and benefits of this cutting-edge technology, providing customers with unmatched performance and efficiency. Trust Texas Instruments to deliver excellence in every aspect of your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides the necessary durability and protection for the IC, ensuring reliable performance in various conditions.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards, saving time and effort during manufacturing processes.

Screening Level: AEC-Q100

Certified automotive quality standard ensures high reliability and performance in automotive applications.

Package Shape: SQUARE

Square shape provides efficient use of space on the circuit board, allowing for compact and streamlined designs.

General IC Type: CONSUMER CIRCUIT

Tailored for consumer electronics applications, ensuring compatibility and optimized performance in consumer devices.

No. of Terminals: 367

High number of terminals allows for versatile connectivity options and functionality in complex circuits.

Package Style: GRID ARRAY, FINE PITCH

Fine pitch grid array design enables high density packaging and precise connections for efficient circuit operation.

Maximum Operating Temperature: 125 °C

Wide temperature range capability ensures stable performance in various environmental conditions, enhancing reliability.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures ensures functionality in cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

Triple finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal placement simplifies PCB layout and routing, optimizing signal integrity and ease of assembly.

Maximum Seated Height: 2.82 mm

Low profile design enables compact and space-efficient product designs, ideal for slim and portable devices.

Width: 15 mm

Compact width allows for flexible placement on PCBs, accommodating various board layouts and space constraints.

Minimum Supply Voltage (Vsup): 1.02 V

Low minimum supply voltage requirement enables energy-efficient operation and extended battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for sufficient time for temperature-sensitive components to reflow during assembly, ensuring proper solder connections.

Peak Reflow Temperature °C: 250

High reflow temperature capability ensures reliable and durable solder joints, enhancing product longevity and performance.

Length: 15 mm

Compact length provides flexibility in PCB layout and design, allowing for space-saving and efficient placement in devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability and performance in automotive environments with varying temperature conditions.

Terminal Form: BALL

Ball terminal form facilitates reliable and robust connections, making it suitable for applications requiring high durability and vibration resistance.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density packaging and precise routing, essential for complex circuit designs with limited space.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, ensuring proper storage and handling to prevent component damage.

Maximum Supply Voltage (Vsup): 1.11 V

Low maximum supply voltage requirement contributes to energy-efficient operation and compatibility with a wide range of power sources.

Technical Specifications

Other Function Consumer ICs TDA3LABBABFRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3LABBABFRQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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