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TDA3MADBFABFRQ1

Texas Instruments

TDA3MADBFABFRQ1 by Texas Instruments

TDA3MADBFABFRQ1 by Texas Instruments is an AEC-Q100 compliant consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With a terminal pitch of 0.65mm and moisture sensitivity level of 3, it offers high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,015

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-

-

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Vyrian

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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520

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,836 parts In-Stock

1+ parts

$0.998

100+ parts

$92.651

1k+ parts

$0.898

10k+ parts

-

1,836

$0.998

$92.651

$0.898

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DigiPath Technology Company

USA . 295 parts In-Stock

1+ parts

$1.099

100+ parts

-

1k+ parts

-

10k+ parts

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295

$1.099

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-

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ChromeModa Solutions

Germany . 1,467 parts In-Stock

1+ parts

$1.121

100+ parts

$0.919

1k+ parts

-

10k+ parts

-

1,467

$1.121

$0.919

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IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$1.121

100+ parts

-

1k+ parts

$1.009

10k+ parts

-

860

$1.121

-

$1.009

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One Stop Electronics

USA . 964 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

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10k+ parts

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964

$14.800

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AZTECH Wire

Italy . 318 parts In-Stock

1+ parts

$18.761

100+ parts

-

1k+ parts

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10k+ parts

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318

$18.761

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Corphita

USA . 2,990 parts In-Stock

1+ parts

-

100+ parts

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2,990

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Overview

Elevate your consumer electronics with the TDA3MADBFABFRQ1 by Texas Instruments, a top-of-the-line product in the category of Other Function Consumer ICs. Manufactured with precision and expertise, this IC offers unparalleled quality and reliability for a wide range of applications. With its innovative design and advanced features, customers can expect superior performance, efficiency, and durability. Experience the value and benefits that the TDA3MADBFABFRQ1 brings to your projects, setting you apart from the competition. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and quality standards, making it suitable for automotive applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand harsh operating conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity, ensuring reliable electrical connections.

Width: 15 mm

Compact width of the package allows for efficient use of board space in applications with size constraints.

Minimum Supply Voltage (Vsup): 1.02 V

Low minimum supply voltage requirement enables operation in low-power applications, enhancing energy efficiency.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, meeting stringent industry standards and reliability requirements for automotive electronics.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high density mounting, enabling more functionality in a smaller footprint.

Moisture Sensitivity Level (MSL): 3

MSL 3 classification indicates the level of protection against moisture, ensuring reliability in humid environments.

Technical Specifications

Other Function Consumer ICs TDA3MADBFABFRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3MADBFABFRQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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