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TDA3LXRBFABFRQ1

Texas Instruments

TDA3LXRBFABFRQ1 by Texas Instruments

TDA3LXRBFABFRQ1 by Texas Instruments is an AEC-Q100 compliant consumer IC with 367 terminals in a grid array package. Operating temperature range from -40 to 125°C, suitable for automotive applications. Features include fine pitch, bottom terminal position, and tin silver copper finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,493 parts In-Stock

1+ parts

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6,493

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Digiode

USA . 4,604 parts In-Stock

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4,604

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,315 parts In-Stock

1+ parts

$1.692

100+ parts

-

1k+ parts

$2.290

10k+ parts

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2,315

$1.692

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$2.290

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DigiPath Technology Company

USA . 2,157 parts In-Stock

1+ parts

$1.863

100+ parts

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2,157

$1.863

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ChromeModa Solutions

Germany . 2,370 parts In-Stock

1+ parts

$1.901

100+ parts

$1.559

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2,370

$1.901

$1.559

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IDEA Electronic Components Group

UK . 1,323 parts In-Stock

1+ parts

$1.901

100+ parts

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$1.711

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1,323

$1.901

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$1.711

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One Stop Electronics

USA . 1,638 parts In-Stock

1+ parts

$15.800

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1,638

$15.800

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AZTECH Wire

Italy . 386 parts In-Stock

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$17.273

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386

$17.273

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Corphita

USA . 1,926 parts In-Stock

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1,926

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Overview

Experience the cutting-edge technology of Texas Instruments with the TDA3LXRBFABFRQ1. This innovative consumer IC boasts high-quality construction and AEC-Q100 screening, making it ideal for automotive applications. With 367 terminals and a compact square package, this product offers superior performance and reliability. Trust Texas Instruments to deliver value and efficiency with the TDA3LXRBFABFRQ1, providing customers with the advantage they need in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort in production.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this IC suitable for automotive applications where performance and safety are critical.

Package Shape: SQUARE

Square package shape helps in efficient space utilization and easy integration into electronic systems.

No. of Terminals: 367

Large number of terminals allows for complex circuit connections, enabling versatile functionality and connectivity options.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures stable performance even in challenging thermal conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for reliable operation in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish with Tin, Silver, and Copper provides excellent conductivity and corrosion resistance for long-term reliability.

Width: 15 mm

Compact width allows for space-efficient placement on PCBs and integration into tight electronic designs.

Minimum Supply Voltage (Vsup): 1.02 V

Low minimum supply voltage requirement enables energy-efficient operation and extends battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

Extended peak reflow time allows for thorough and uniform soldering during manufacturing, ensuring strong and reliable connections.

Peak Reflow Temperature °C: 250

High peak reflow temperature capability ensures proper soldering and bonding of the IC during assembly, enhancing overall reliability.

Length: 15 mm

Compact length facilitates efficient placement on PCBs and allows for flexible integration into various electronic systems.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates that this IC is designed to withstand harsh automotive environments, ensuring reliable performance in vehicles.

Terminal Form: BALL

Ball terminal form enables reliable connections and simplifies soldering during assembly, improving overall manufacturing efficiency.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for high-density packaging and compact design, optimizing space utilization on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, ensuring proper handling and storage procedures to maintain component reliability.

Maximum Supply Voltage (Vsup): 1.11 V

Low maximum supply voltage requirement helps in minimizing power consumption and improving energy efficiency of the IC.

Technical Specifications

Other Function Consumer ICs TDA3LXRBFABFRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3LXRBFABFRQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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