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TDA3MDDBABFQ1

Texas Instruments

TDA3MDDBABFQ1 by Texas Instruments

TDA3MDDBABFQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With surface mount and AEC-Q100 screening, it has a terminal pitch of 0.65mm and peak reflow temperature of 250°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,932 parts In-Stock

1+ parts

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2,932

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Vyrian

USA . 2,256 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,256

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 68 parts In-Stock

1+ parts

$3.428

100+ parts

-

1k+ parts

$3.953

10k+ parts

-

68

$3.428

-

$3.953

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DigiPath Technology Company

USA . 2,293 parts In-Stock

1+ parts

$3.775

100+ parts

$3.473

1k+ parts

-

10k+ parts

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2,293

$3.775

$3.473

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ChromeModa Solutions

Germany . 5,993 parts In-Stock

1+ parts

$3.852

100+ parts

$3.159

1k+ parts

-

10k+ parts

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5,993

$3.852

$3.159

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IDEA Electronic Components Group

UK . 297 parts In-Stock

1+ parts

$3.852

100+ parts

-

1k+ parts

$3.467

10k+ parts

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297

$3.852

-

$3.467

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AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$13.840

100+ parts

-

1k+ parts

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10k+ parts

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672

$13.840

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One Stop Electronics

USA . 993 parts In-Stock

1+ parts

$15.800

100+ parts

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1k+ parts

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993

$15.800

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Corphita

USA . 1,490 parts In-Stock

1+ parts

-

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1,490

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Overview

Unlock unparalleled performance and innovation with the TDA3MDDBABFQ1 by Texas Instruments. This cutting-edge consumer IC boasts top-tier quality and reliability, making it a go-to choice for a wide range of applications. From automotive to industrial settings, this versatile product offers unmatched value and benefits for customers seeking advanced solutions. Trust in Texas Instruments to deliver superior technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for various consumer applications.

Surface Mount: YES

The ability to be surface-mounted allows for easy integration into electronic devices, saving space and simplifying assembly.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and performance in automotive applications, giving users peace of mind.

Package Shape: SQUARE

The square shape of the package allows for efficient use of PCB space and facilitates layout design.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuits, this IC offers optimal performance and functionality for a wide range of consumer electronic products.

No. of Terminals: 367

Having a high number of terminals provides flexibility in connecting to various components and peripherals, enhancing the product's versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style allows for high-density mounting, enabling the product to deliver complex functions within a small footprint.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product is suitable for demanding environments and ensures reliable operation under varying conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature extends the product's usability in extreme cold environments, making it reliable in diverse conditions.

Terminal Finish: TIN SILVER COPPER

The combination of tin, silver, and copper in the terminal finish offers excellent conductivity and corrosion resistance, enhancing the product's longevity.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the PCB layout and improves signal integrity, contributing to the product's overall performance.

Maximum Seated Height: 2.82 mm

With a relatively low seated height, the product can be compactly integrated into devices without compromising on performance or functionality.

Width: 15 mm

The moderate width of the product enables easy integration into various electronic systems while still providing ample room for other components.

Minimum Supply Voltage (Vsup): 1.02 V

The low minimum supply voltage allows the product to operate efficiently and reliably with minimal power consumption, contributing to energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering of the component, contributing to reliable connections and long-term performance.

Peak Reflow Temperature °C: 250

The high peak reflow temperature capability enables the product to withstand soldering processes without compromising its functionality or integrity.

Length: 15 mm

The compact length of the product allows for easy integration into various electronic devices without taking up excessive space.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the product meets stringent temperature requirements and reliability standards, making it ideal for use in vehicles.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, ensuring stable performance and durability in demanding operating conditions.

Terminal Pitch: 0.65 mm

The fine terminal pitch enables high-density mounting and precise connections, allowing the product to deliver complex functionality within a small area.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product is able to withstand moderate exposure to moisture during storage and assembly, ensuring its reliability in various environments.

Maximum Supply Voltage (Vsup): 1.11 V

The maximum supply voltage of 1.11 V allows the product to safely operate within specified limits, preventing damage and ensuring long-term usability.

Technical Specifications

Other Function Consumer ICs TDA3MDDBABFQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3MDDBABFQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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