Loading...

TDA3LXBBABFQ1

Texas Instruments

TDA3LXBBABFQ1 by Texas Instruments

TDA3LXBBABFQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. Features include Tin Silver Copper finish, 0.65mm terminal pitch, and AEC-Q100 screening level.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,904 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,904

-

-

-

-

Digiode

USA . 3,242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,242

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 970 parts In-Stock

1+ parts

$0.920

100+ parts

$85.460

1k+ parts

$0.828

10k+ parts

-

970

$0.920

$85.460

$0.828

-

DigiPath Technology Company

USA . 957 parts In-Stock

1+ parts

$1.013

100+ parts

$0.932

1k+ parts

-

10k+ parts

-

957

$1.013

$0.932

-

-

ChromeModa Solutions

Germany . 4,427 parts In-Stock

1+ parts

$1.034

100+ parts

$0.848

1k+ parts

-

10k+ parts

-

4,427

$1.034

$0.848

-

-

IDEA Electronic Components Group

UK . 581 parts In-Stock

1+ parts

$1.034

100+ parts

-

1k+ parts

$0.931

10k+ parts

-

581

$1.034

-

$0.931

-

AZTECH Wire

Italy . 225 parts In-Stock

1+ parts

$11.551

100+ parts

-

1k+ parts

-

10k+ parts

-

225

$11.551

-

-

-

One Stop Electronics

USA . 775 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

-

10k+ parts

-

775

$18.800

-

-

-

Corphita

USA . 1,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,775

-

-

-

-

Overview

Elevate your consumer electronics with the TDA3LXBBABFQ1 by Texas Instruments, a cutting-edge solution that offers unparalleled quality and reliability. Manufactured by the industry leader in semiconductor technology, this IC is designed for automotive applications, ensuring top-notch performance even in extreme conditions. With its advanced features and innovative design, this product delivers exceptional value and benefits to customers looking for superior functionality and efficiency. Upgrade your devices today with the TDA3LXBBABFQ1 and experience the difference Texas Instruments can make in your technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the product.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability for automotive applications.

Package Shape: SQUARE

Square package shape provides efficient use of space and easy integration into circuit boards.

No. of Terminals: 367

The high number of terminals allows for versatile connectivity and functionality.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in extreme conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables use in a wide range of environments.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish enhances conductivity and corrosion resistance.

Width: 15 mm

Compact width allows for space-saving installation in various applications.

Minimum Supply Voltage (Vsup): 1.02 V

Low minimum supply voltage enables energy-efficient operation.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures solder joints and connections are secure during assembly.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability and performance in automotive environments.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and miniaturization of the product.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has a moderate level of moisture sensitivity, suitable for most applications.

Maximum Supply Voltage (Vsup): 1.11 V

With a maximum supply voltage of 1.11V, the product operates within safe voltage limits.

Technical Specifications

Other Function Consumer ICs TDA3LXBBABFQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3LXBBABFQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19