Loading...

TDA3MADBABFRQ1

Texas Instruments

TDA3MADBABFRQ1 by Texas Instruments

TDA3MADBABFRQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. Features include tin silver copper terminal finish, 0.65mm pitch, and AEC-Q100 screening level.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,914

-

-

-

-

Vyrian

USA . 2,891 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,891

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,836 parts In-Stock

1+ parts

$1.525

100+ parts

-

1k+ parts

$2.183

10k+ parts

-

1,836

$1.525

-

$2.183

-

DigiPath Technology Company

USA . 663 parts In-Stock

1+ parts

$1.680

100+ parts

$1.545

1k+ parts

-

10k+ parts

-

663

$1.680

$1.545

-

-

IDEA Electronic Components Group

UK . 1,031 parts In-Stock

1+ parts

$1.714

100+ parts

-

1k+ parts

$1.543

10k+ parts

-

1,031

$1.714

-

$1.543

-

ChromeModa Solutions

Germany . 438 parts In-Stock

1+ parts

$1.714

100+ parts

$1.405

1k+ parts

-

10k+ parts

-

438

$1.714

$1.405

-

-

AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$11.833

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$11.833

-

-

-

One Stop Electronics

USA . 1,175 parts In-Stock

1+ parts

$21.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,175

$21.800

-

-

-

Corphita

USA . 1,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,631

-

-

-

-

Overview

Elevate your consumer electronics with the TDA3MADBABFRQ1 by Texas Instruments. Crafted with precision and expertise, this cutting-edge product offers unparalleled quality and reliability. Perfect for a wide range of applications, this consumer IC provides seamless performance and efficiency. Experience the value and benefits of this innovative technology, designed to exceed your expectations. Upgrade your devices today with the TDA3MADBABFRQ1 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal circuitry of the product.

Surface Mount: YES

Being surface mountable makes the product suitable for automated assembly processes, resulting in faster production and reliable connections.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the product meets rigorous automotive industry standards for reliability and performance, making it suitable for automotive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables the product to withstand harsh environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can operate in cold environments without any performance issues.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishes provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Width: 15 mm

The compact width of 15mm makes the product suitable for space-constrained applications, offering flexibility in installation.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification indicates that the product is designed to meet stringent automotive industry requirements for temperature range and reliability.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures that the product has moderate sensitivity to moisture, making it suitable for a variety of environments without compromising performance.

Maximum Supply Voltage (Vsup): 1.11 V

The maximum supply voltage of 1.11V indicates the product's ability to operate effectively within a specific voltage range, ensuring stability and optimal performance.

Technical Specifications

Other Function Consumer ICs TDA3MADBABFRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3MADBABFRQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19