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TDA3LABBABFQ1

Texas Instruments

TDA3LABBABFQ1 by Texas Instruments

TDA3LABBABFQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With a terminal pitch of 0.65mm and moisture sensitivity level of 3, it offers high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,290 parts In-Stock

1+ parts

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6,290

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Digiode

USA . 716 parts In-Stock

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716

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,429 parts In-Stock

1+ parts

$1.029

100+ parts

-

1k+ parts

$1.898

10k+ parts

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1,429

$1.029

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$1.898

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ChromeModa Solutions

Germany . 4,052 parts In-Stock

1+ parts

$1.156

100+ parts

$0.948

1k+ parts

-

10k+ parts

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4,052

$1.156

$0.948

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IDEA Electronic Components Group

UK . 2,255 parts In-Stock

1+ parts

$1.156

100+ parts

-

1k+ parts

$1.040

10k+ parts

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2,255

$1.156

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$1.040

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One Stop Electronics

USA . 161 parts In-Stock

1+ parts

$5.800

100+ parts

-

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161

$5.800

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AZTECH Wire

Italy . 407 parts In-Stock

1+ parts

$5.984

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407

$5.984

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DigiPath Technology Company

USA . 793 parts In-Stock

1+ parts

-

100+ parts

$1.042

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793

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$1.042

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Corphita

USA . 541 parts In-Stock

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541

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Overview

Elevate your consumer electronics with the TDA3LABBABFQ1 from Texas Instruments, a high-quality and reliable manufacturer known for cutting-edge technology. This versatile IC offers endless possibilities in automotive applications, ensuring optimal performance and efficiency. With a wide operating temperature range and advanced features, this product delivers exceptional value and benefits to customers seeking innovative solutions. Upgrade your designs with the TDA3LABBABFQ1 and experience the difference Texas Instruments can make in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as body material makes the product lightweight and durable, making it suitable for portable consumer devices.

Surface Mount: YES

Being surface mountable makes the product easy to assemble and saves space on the PCB, enabling compact designs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making the product suitable for automotive applications where reliability is crucial.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to withstand extreme thermal conditions, enhancing its reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the product to function in cold environments, increasing its versatility.

Width: 15 mm

The compact width of 15mm allows for efficient use of PCB space, making it suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 1.02 V

The low minimum supply voltage of 1.02V ensures efficient power consumption, making the product energy-efficient.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm enables high density mounting of components on the PCB, allowing for a compact design.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product can operate effectively in automotive environments with varying temperature conditions.

Technical Specifications

Other Function Consumer ICs TDA3LABBABFQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3LABBABFQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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