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TDA3LADBABFQ1

Texas Instruments

TDA3LADBABFQ1 by Texas Instruments

TDA3LADBABFQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. Operating temperature ranges from -40 to 125 °C, suitable for automotive applications. Features include surface mount capability, AEC-Q100 screening level, and fine pitch terminal style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,012 parts In-Stock

1+ parts

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7,012

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Digiode

USA . 4,142 parts In-Stock

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4,142

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,187 parts In-Stock

1+ parts

$1.354

100+ parts

-

1k+ parts

$2.080

10k+ parts

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2,187

$1.354

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$2.080

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DigiPath Technology Company

USA . 906 parts In-Stock

1+ parts

$1.491

100+ parts

$1.371

1k+ parts

-

10k+ parts

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906

$1.491

$1.371

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ChromeModa Solutions

Germany . 1,912 parts In-Stock

1+ parts

$1.521

100+ parts

$1.247

1k+ parts

-

10k+ parts

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1,912

$1.521

$1.247

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IDEA Electronic Components Group

UK . 1,644 parts In-Stock

1+ parts

$1.521

100+ parts

-

1k+ parts

$1.369

10k+ parts

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1,644

$1.521

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$1.369

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One Stop Electronics

USA . 1,348 parts In-Stock

1+ parts

$3.800

100+ parts

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1,348

$3.800

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AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$9.378

100+ parts

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324

$9.378

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Corphita

USA . 218 parts In-Stock

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218

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Overview

Experience unparalleled quality and reliability with the TDA3LADBABFQ1 by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch performance in their products, making this consumer IC a standout choice for various applications. With its compact package shape and advanced features, this IC offers customers exceptional value and benefits. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the TDA3LADBABFQ1 and unlock new possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and reliability for the product.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, making installation and assembly efficient.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates that the product meets automotive quality standards, ensuring high performance and reliability in automotive applications.

No. of Terminals: 367

With a high number of terminals, this product offers a wide range of connectivity options, making it versatile for various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in extreme temperature conditions.

Width: 15 mm

The compact width of 15 mm makes this product suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.02 V

The low minimum supply voltage requirement ensures energy efficiency and compatibility with various power sources.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance of 250°C ensures robustness during the manufacturing process.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates suitability for automotive applications, where temperature fluctuations are common.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65 mm allows for high-density mounting and enables compact design layouts.

Technical Specifications

Other Function Consumer ICs TDA3LADBABFQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3LADBABFQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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