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TDA3MADBFABFQ1

Texas Instruments

TDA3MADBFABFQ1 by Texas Instruments

TDA3MADBFABFQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With a terminal pitch of 0.65mm and moisture sensitivity level of 3, it is ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,294 parts In-Stock

1+ parts

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7,294

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Digiode

USA . 3,145 parts In-Stock

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3,145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,095 parts In-Stock

1+ parts

$2.612

100+ parts

-

1k+ parts

$3.101

10k+ parts

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2,095

$2.612

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$3.101

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DigiPath Technology Company

USA . 268 parts In-Stock

1+ parts

$2.876

100+ parts

$2.646

1k+ parts

-

10k+ parts

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268

$2.876

$2.646

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ChromeModa Solutions

Germany . 3,219 parts In-Stock

1+ parts

$2.935

100+ parts

$2.407

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3,219

$2.935

$2.407

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IDEA Electronic Components Group

UK . 771 parts In-Stock

1+ parts

$2.935

100+ parts

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$2.642

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771

$2.935

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$2.642

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AZTECH Wire

Italy . 301 parts In-Stock

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$8.462

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301

$8.462

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One Stop Electronics

USA . 1,170 parts In-Stock

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$19.800

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1,170

$19.800

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Corphita

USA . 758 parts In-Stock

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758

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Overview

Experience superior performance and reliability with the TDA3MADBFABFQ1 by Texas Instruments, a top-tier manufacturer known for delivering cutting-edge technology. This consumer IC offers a wide range of applications, from automotive to industrial use, making it a versatile and essential component for your projects. With its high-quality materials and advanced features, this product ensures seamless integration and optimal functionality. Trust in Texas Instruments to provide you with innovative solutions that guarantee efficiency and value for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components, providing good insulation and protection for the internal circuitry.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making the product suitable for space-constrained applications.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the product meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, this product is optimized for performance and efficiency in consumer applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions and ensures reliable operation in various temperature ranges.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes the product suitable for use in cold environments, enhancing its versatility.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Width: 15 mm

The compact width allows for easy integration into different electronic systems and devices, making it suitable for a wide range of applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, this product is suitable for use in automotive applications where reliability and performance are critical.

Technical Specifications

Other Function Consumer ICs TDA3MADBFABFQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3MADBFABFQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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