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TDA3MDDBABFRQ1

Texas Instruments

TDA3MDDBABFRQ1 by Texas Instruments

TDA3MDDBABFRQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With surface mount and fine pitch style, it has a min supply voltage of 1.02V and peak reflow temperature of 250°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,346

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Digiode

USA . 4,817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,817

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 303 parts In-Stock

1+ parts

$1.438

100+ parts

-

1k+ parts

$2.129

10k+ parts

-

303

$1.438

-

$2.129

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DigiPath Technology Company

USA . 1,426 parts In-Stock

1+ parts

$1.584

100+ parts

$1.457

1k+ parts

-

10k+ parts

-

1,426

$1.584

$1.457

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ChromeModa Solutions

Germany . 5,872 parts In-Stock

1+ parts

$1.616

100+ parts

$1.325

1k+ parts

-

10k+ parts

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5,872

$1.616

$1.325

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IDEA Electronic Components Group

UK . 1,460 parts In-Stock

1+ parts

$1.616

100+ parts

-

1k+ parts

$1.454

10k+ parts

-

1,460

$1.616

-

$1.454

-

AZTECH Wire

Italy . 340 parts In-Stock

1+ parts

$6.017

100+ parts

-

1k+ parts

-

10k+ parts

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340

$6.017

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One Stop Electronics

USA . 1,235 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

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10k+ parts

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1,235

$18.800

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Corphita

USA . 109 parts In-Stock

1+ parts

-

100+ parts

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109

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Overview

Discover the innovative TDA3MDDBABFRQ1 by Texas Instruments, a cutting-edge consumer IC that sets new standards in performance and reliability. Manufactured with precision and expertise by Texas Instruments, this high-quality product is designed for automotive applications, providing unmatched value and benefits to customers. With its advanced features and durable construction, the TDA3MDDBABFRQ1 ensures optimal functionality in a wide range of scenarios. Upgrade your projects with confidence and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, perfect for consumer electronics applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality standards suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board and ease of integration into various systems.

Width: 15 mm

The compact width of 15mm enables the product to fit into tight spaces and accommodate smaller devices.

Minimum Supply Voltage (Vsup): 1.02 V

The low minimum supply voltage requirement of 1.02V helps in reducing power consumption and extending battery life in portable devices.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, the product can withstand high-temperature soldering processes without any issues.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade rating ensures reliable performance in a wide range of temperature conditions, making it suitable for automotive applications.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm allows for higher terminal density, enabling more connections in a limited space.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has moderate sensitivity to moisture, making it suitable for a variety of environments.

Technical Specifications

Other Function Consumer ICs TDA3MDDBABFRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3MDDBABFRQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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