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TDA3LRABABFQ1

Texas Instruments

TDA3LRABABFQ1 by Texas Instruments

TDA3LRABABFQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With surface mount and fine pitch, it has a min supply voltage of 1.02V and peak reflow temperature of 250°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,826 parts In-Stock

1+ parts

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100+ parts

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3,826

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Digiode

USA . 2,741 parts In-Stock

1+ parts

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100+ parts

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2,741

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 893 parts In-Stock

1+ parts

$1.906

100+ parts

-

1k+ parts

$2.443

10k+ parts

-

893

$1.906

-

$2.443

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DigiPath Technology Company

USA . 1,766 parts In-Stock

1+ parts

$2.099

100+ parts

$1.931

1k+ parts

-

10k+ parts

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1,766

$2.099

$1.931

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ChromeModa Solutions

Germany . 4,287 parts In-Stock

1+ parts

$2.142

100+ parts

$1.756

1k+ parts

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10k+ parts

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4,287

$2.142

$1.756

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$2.142

100+ parts

-

1k+ parts

$1.928

10k+ parts

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2,182

$2.142

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$1.928

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One Stop Electronics

USA . 192 parts In-Stock

1+ parts

$10.800

100+ parts

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192

$10.800

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AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$14.766

100+ parts

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578

$14.766

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Corphita

USA . 2,378 parts In-Stock

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2,378

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Overview

Enhance your product designs with the TDA3LRABABFQ1 by Texas Instruments, a top-notch consumer IC that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this innovative device is ideal for a wide range of applications thanks to its cutting-edge technology and durable construction. With features like a wide operating temperature range and high terminal finish quality, this product delivers exceptional value and performance to meet your unique needs. Upgrade your projects today with the TDA3LRABABFQ1 and experience the advantages of Texas Instruments expertise firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the IC, ensuring durability and reliability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Compliance with automotive standards ensures high quality and reliability, making it suitable for use in automotive applications.

Package Shape: SQUARE

Square shape provides uniformity and ease of handling during manufacturing and assembly processes.

No. of Terminals: 367

High number of terminals allows for complex functionality and connectivity options in the IC.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures the IC can perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold conditions, making it versatile for different applications.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring reliability in electrical connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easier and more efficient PCB layout and routing.

Width: 15 mm

Compact width allows for space-saving design, ideal for applications with limited board space.

Minimum Supply Voltage (Vsup): 1.02 V

Low minimum supply voltage enables operation in low power applications, increasing energy efficiency.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures proper soldering and reliability during assembly processes.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the IC can withstand the harsh temperature fluctuations present in automotive environments.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density packaging, increasing functionality in a small form factor.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate sensitivity to moisture, making it suitable for various storage and operating conditions.

Maximum Supply Voltage (Vsup): 1.11 V

Low maximum supply voltage ensures safe operation and protection against overvoltage conditions.

Technical Specifications

Other Function Consumer ICs TDA3LRABABFQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3LRABABFQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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