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TDA3LADBJFABFRQ1

Texas Instruments

TDA3LADBJFABFRQ1 by Texas Instruments

TDA3LADBJFABFRQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With surface mount capability and fine pitch style, it has a max supply voltage of 1.11V and peak reflow temperature of 250°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,791 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,791

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Digiode

USA . 858 parts In-Stock

1+ parts

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1k+ parts

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858

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,336 parts In-Stock

1+ parts

$3.511

100+ parts

-

1k+ parts

$4.036

10k+ parts

-

1,336

$3.511

-

$4.036

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DigiPath Technology Company

USA . 544 parts In-Stock

1+ parts

$3.866

100+ parts

$3.557

1k+ parts

-

10k+ parts

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544

$3.866

$3.557

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ChromeModa Solutions

Germany . 2,498 parts In-Stock

1+ parts

$3.945

100+ parts

$3.235

1k+ parts

-

10k+ parts

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2,498

$3.945

$3.235

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IDEA Electronic Components Group

UK . 366 parts In-Stock

1+ parts

$3.945

100+ parts

-

1k+ parts

$3.550

10k+ parts

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366

$3.945

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$3.550

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One Stop Electronics

USA . 1,140 parts In-Stock

1+ parts

$8.800

100+ parts

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10k+ parts

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1,140

$8.800

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AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$18.936

100+ parts

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622

$18.936

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Corphita

USA . 2,775 parts In-Stock

1+ parts

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2,775

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Overview

Elevate your consumer electronics with the TDA3LADBJFABFRQ1 by Texas Instruments. Crafted with precision and reliability, this innovative IC offers unmatched performance in a compact package. Perfect for automotive applications, this cutting-edge technology ensures seamless integration and enhanced functionality. Trust in Texas Instruments to deliver superior quality and value with the TDA3LADBJFABFRQ1, setting a new standard in consumer circuitry. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Screening Level: AEC-Q100

Ensures high reliability and performance standards for automotive applications, meeting stringent industry requirements.

Package Shape: SQUARE

Allows for efficient use of space on the PCB, making it ideal for compact designs.

General IC Type: CONSUMER CIRCUIT

Designed for consumer electronics applications, ensuring compatibility and performance in various devices.

No. of Terminals: 367

Provides a high level of connectivity for the IC, enabling it to support complex circuit designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

Facilitates high-density mounting on the PCB, allowing for more components to be accommodated in a limited space.

Maximum Operating Temperature: 125 °C

Ensures reliable performance in high-temperature environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature conditions, providing versatility for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for the terminals, ensuring long-term reliability.

Terminal Position: BOTTOM

Facilitates easy PCB layout and assembly, contributing to a streamlined production process.

Maximum Seated Height: 2.82 mm

Compact form factor allows for space-saving design and efficient use of PCB real estate.

Width: 15 mm

Compact width allows for flexibility in PCB layout and integration into different devices or systems.

Minimum Supply Voltage (Vsup): 1.02 V

Supports operation at low supply voltages, enabling energy-efficient performance for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during production, leading to high-quality connections for the IC.

Peak Reflow Temperature °C: 250

Can withstand high temperatures during the soldering process, ensuring proper assembly and reliable performance.

Length: 15 mm

Compact length allows for space-saving design and compatibility with various PCB layouts.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and performance in vehicle applications.

Terminal Form: BALL

Facilitates reliable connections and soldering during PCB assembly, contributing to the overall durability of the IC.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting, enabling complex circuit designs in a compact space.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring reliability in humid environments.

Maximum Supply Voltage (Vsup): 1.11 V

Supports operation at higher supply voltages when needed, providing flexibility for various applications.

Technical Specifications

Other Function Consumer ICs TDA3LADBJFABFRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3LADBJFABFRQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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