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TDA3LXBBABFRQ1

Texas Instruments

TDA3LXBBABFRQ1 by Texas Instruments

TDA3LXBBABFRQ1 by Texas Instruments is a consumer IC with 367 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. Features include tin silver copper finish, 0.65mm terminal pitch, and AEC-Q100 screening level.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,389 parts In-Stock

1+ parts

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5,389

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Digiode

USA . 2,722 parts In-Stock

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2,722

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 247 parts In-Stock

1+ parts

$2.317

100+ parts

-

1k+ parts

$2.814

10k+ parts

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247

$2.317

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$2.814

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DigiPath Technology Company

USA . 1,945 parts In-Stock

1+ parts

$2.551

100+ parts

-

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1,945

$2.551

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IDEA Electronic Components Group

UK . 900 parts In-Stock

1+ parts

$2.603

100+ parts

-

1k+ parts

$2.343

10k+ parts

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900

$2.603

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$2.343

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ChromeModa Solutions

Germany . 334 parts In-Stock

1+ parts

$2.603

100+ parts

$2.134

1k+ parts

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334

$2.603

$2.134

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AZTECH Wire

Italy . 387 parts In-Stock

1+ parts

$9.152

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387

$9.152

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One Stop Electronics

USA . 1,128 parts In-Stock

1+ parts

$19.800

100+ parts

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1,128

$19.800

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Corphita

USA . 89 parts In-Stock

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89

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Overview

Upgrade your consumer electronic devices with the TDA3LXBBABFRQ1 by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers unmatched performance in the field of consumer ICs. This versatile IC is perfect for a wide range of applications, offering reliability and efficiency like no other. Say goodbye to outdated technology and hello to the future of electronics with the TDA3LXBBABFRQ1. Experience the value and benefits this product brings to your projects and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and performance in automotive applications, making this product suitable for automotive electronics.

Package Shape: SQUARE

The square package shape offers a compact design that helps in efficient use of PCB space and integration into various applications.

General IC Type: CONSUMER CIRCUIT

Designed for consumer circuits, this product is tailored to meet the specific needs of consumer electronics, ensuring optimal functionality and performance.

No. of Terminals: 367

Having a high number of terminals allows for greater connectivity options, making this product versatile and compatible with various circuit designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high density interconnects, enabling efficient signal routing and minimizing signal distortion.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in extreme temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance, making this product suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The use of tin-silver-copper terminal finish provides excellent corrosion resistance and solderability, enhancing the longevity and reliability of the product.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy PCB mounting and soldering, making installation and maintenance hassle-free.

Maximum Seated Height: 2.82 mm

The low maximum seated height allows for a compact design, saving space on the PCB and enabling integration into space-constrained applications.

Width: 15 mm

The moderate width of the product offers a balance between size and functionality, making it suitable for various electronic designs without sacrificing performance.

Minimum Supply Voltage (Vsup): 1.02 V

The low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources, making this product versatile and reliable.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this product can withstand reflow soldering processes without compromising its quality and performance.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance of 250°C ensures the product's reliability during soldering processes, leading to consistent and durable connections.

Length: 15 mm

The moderate length of the product offers a compact form factor, making it suitable for various applications where space is a concern.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this product meets stringent automotive industry standards for performance, reliability, and durability, making it a trusted choice for automotive electronics.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, ensuring stable electrical connectivity and reducing the risk of signal interference or loss.

Terminal Pitch: 0.65 mm

With a fine terminal pitch of 0.65 mm, this product allows for high-density mounting and efficient signal routing, enabling compact and reliable electronic designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this product has moderate sensitivity to moisture exposure, making it suitable for a wide range of environments with controlled humidity levels.

Maximum Supply Voltage (Vsup): 1.11 V

The maximum supply voltage of 1.11 V ensures safe operation within the specified voltage range, protecting the product from potential damage due to overvoltage conditions.

Technical Specifications

Other Function Consumer ICs TDA3LXBBABFRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage (Vsup):

1.11 V

Minimum Supply Voltage (Vsup):

1.02 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TDA3LXBBABFRQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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