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SN74ALVC7806-40DL

Texas Instruments

SN74ALVC7806-40DL by Texas Instruments

SN74ALVC7806-40DL by Texas Instruments is a FIFO with 256x18 organization, 40ns cycle time, and 50MHz max clock frequency. It operates at 3.3V, has a temp range of 0-70°C, and is ideal for parallel memory applications due to its synchronous operation and 3-STATE output characteristics.

Median Price

$21.644

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$30.270

100+ parts

$24.590

1k+ parts

$24.180

10k+ parts

-

3

$30.270

$24.590

$24.180

-

Rochester

USA . 367 parts In-Stock

1+ parts

-

100+ parts

$16.870

1k+ parts

$15.100

10k+ parts

$14.210

367

-

$16.870

$15.100

$14.210

DigiKey

USA . 367 parts In-Stock

1+ parts

-

100+ parts

$22.200

1k+ parts

-

10k+ parts

-

367

-

$22.200

-

-

Verical

USA . 367 parts In-Stock

1+ parts

-

100+ parts

$21.087

1k+ parts

$18.875

10k+ parts

$17.762

367

-

$21.087

$18.875

$17.762

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,302 parts In-Stock

1+ parts

$15.485

100+ parts

-

1k+ parts

-

10k+ parts

-

2,302

$15.485

-

-

-

Vyrian

USA . 7,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,947

-

-

-

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DigiKey Marketplace

USA . 367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

367

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 572 parts In-Stock

1+ parts

$2.941

100+ parts

-

1k+ parts

$3.439

10k+ parts

-

572

$2.941

-

$3.439

-

DigiPath Technology Company

USA . 2,223 parts In-Stock

1+ parts

$3.238

100+ parts

$2.979

1k+ parts

-

10k+ parts

-

2,223

$3.238

$2.979

-

-

ChromeModa Solutions

Germany . 1,380 parts In-Stock

1+ parts

$3.304

100+ parts

$2.709

1k+ parts

-

10k+ parts

-

1,380

$3.304

$2.709

-

-

IDEA Electronic Components Group

UK . 1,279 parts In-Stock

1+ parts

$3.304

100+ parts

-

1k+ parts

$2.974

10k+ parts

-

1,279

$3.304

-

$2.974

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Corphita

USA . 398 parts In-Stock

1+ parts

$14.670

100+ parts

-

1k+ parts

-

10k+ parts

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398

$14.670

-

-

-

Microchip USA

USA . 2,656 parts In-Stock

1+ parts

$47.520

100+ parts

$46.840

1k+ parts

$46.500

10k+ parts

$46.160

2,656

$47.520

$46.840

$46.500

$46.160

Overview

Experience the unparalleled quality and reliability of Texas Instruments with the SN74ALVC7806-40DL FIFO. This advanced technology offers customers a seamless solution for data storage and retrieval, with a fast cycle time of 40 ns and a maximum clock frequency of 50 MHz. Ideal for a wide range of applications, this FIFO ensures efficient operation and enhanced performance. Trust in Texas Instruments to deliver cutting-edge products that provide value and benefits to meet your unique needs. Choose the SN74ALVC7806-40DL and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Cycle Time: 40 ns

Fast cycle time allows for quick data transfer and processing, making the product efficient.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, making it compatible with a wide range of systems.

Maximum Clock Frequency (fCLK): 50 MHz

High clock frequency allows for fast data retrieval and output, increasing the overall performance of the product.

Memory Density: 4608 bit

High memory density allows for storage of a large amount of data, making the product suitable for applications requiring significant memory capacity.

Technical Specifications

FIFO SN74ALVC7806-40DL attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

20 ns

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

40 ns

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

4608 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

56

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FIFOs

Maximum Supply Current:

.04 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74ALVC7806-40DL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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