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SMJ320C30GBM40

Texas Instruments

SMJ320C30GBM40 by Texas Instruments

Texas Instruments' SMJ320C30GBM40 is a 32-bit DSP with 5V supply, 40MHz clock frequency, and 1024 RAM words. Ideal for military applications due to MIL-PRF-38535 screening level, it features a ceramic-metal package and low power mode for efficient performance in harsh environments.

Median Price

$1,044.860

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9 parts In-Stock

1+ parts

$1,044.860

100+ parts

$1,024.060

1k+ parts

$1,003.160

10k+ parts

-

9

$1,044.860

$1,024.060

$1,003.160

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,433 parts In-Stock

1+ parts

$1,194.008

100+ parts

-

1k+ parts

-

10k+ parts

-

4,433

$1,194.008

-

-

-

Vyrian

USA . 7,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,512

-

-

-

-

LWI Electronics Inc

India . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

5

-

-

-

-

DigiKey Marketplace

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 816 parts In-Stock

1+ parts

$22.333

100+ parts

-

1k+ parts

$23.005

10k+ parts

-

816

$22.333

-

$23.005

-

DigiPath Technology Company

USA . 22 parts In-Stock

1+ parts

$24.591

100+ parts

$22.624

1k+ parts

-

10k+ parts

-

22

$24.591

$22.624

-

-

ChromeModa Solutions

Germany . 2,937 parts In-Stock

1+ parts

$25.093

100+ parts

$20.576

1k+ parts

-

10k+ parts

-

2,937

$25.093

$20.576

-

-

IDEA Electronic Components Group

UK . 48 parts In-Stock

1+ parts

$25.093

100+ parts

$23.838

1k+ parts

$22.584

10k+ parts

-

48

$25.093

$23.838

$22.584

-

Corohmni

South Africa . 40 parts In-Stock

1+ parts

$77.089

100+ parts

-

1k+ parts

-

10k+ parts

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40

$77.089

-

-

-

Microchip USA

USA . 1,200 parts In-Stock

1+ parts

$593.960

100+ parts

$564.260

1k+ parts

$549.410

10k+ parts

$534.560

1,200

$593.960

$564.260

$549.410

$534.560

Corphita

USA . 685 parts In-Stock

1+ parts

$1,131.165

100+ parts

-

1k+ parts

-

10k+ parts

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685

$1,131.165

-

-

-

A-Z Elektronik GmbH

Germany . 7,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,337

-

-

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,500

-

-

-

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Futuretech Components

Singapore . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8

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Component Stockers USA

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3

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Overview

Experience unparalleled performance and reliability with the SMJ320C30GBM40 by Texas Instruments, a cutting-edge Digital Signal Processor that caters to a wide range of applications. As a leader in semiconductor manufacturing, Texas Instruments delivers top-notch quality and innovation with every product. Whether you're in the military, aerospace, or telecommunications industry, this DSP offers unmatched value, benefits, and advantages that will take your projects to the next level. Trust Texas Instruments for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability, making the product suitable for harsh environments.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage which can result in better performance and versatility in power supply options.

On Chip Data RAM Width: 32

Wide data RAM width allows for faster data processing and handling of large amounts of data.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized IC type designed for efficient digital signal processing tasks, ensuring optimal performance.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing speeds, making the product suitable for real-time signal processing applications.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability and performance in extreme temperature conditions.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C30GBM40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P181

Length:

40.01 mm

Low Power Mode:

YES

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

2

No. of Terminals:

181

No. of Timers:

2

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA181M,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Programmability:

MROM

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

4.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

600 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

40.01 mm

Peripheral IC Type:

Trade Compliance

SMJ320C30GBM40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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